Metalorganic Chemical Vapor Deposition Growth Research Articles

First-principles investigations and MOCVD growth of Si-doped β-Ga2O3 thin films on sapphire substrates for enhancing Schottky barrier diode characteristics

In the realm of high-power electronics, the potential of gallium oxide (β-Ga2O3) as a front-runner material has garnered significant attention due to its wide bandgap and the capacity to withstand high critical electric fields. To push the boundaries of performance for β-Ga2O3 devices, a meticulous exploration into the effects of silicon (Si) doping on β-Ga2O3 films was carried out using the metalorganic chemical vapor deposition (MOCVD) technique with various tetraethoxysilane (TEOS) flow rates (0–30 sccm). The Si-doped β-Ga2O3 films were systematically studied and characterized using XRD, SEM, and XPS techniques. XRD patterns demonstrated the preservation of the β-Ga2O3 monoclinic structure in the Si-doped β-Ga2O3 films, without any evidence of secondary phases. In addition to this, first-principles calculations were performed to explore the incorporation of Si atoms in Ga2O3 supercells, which revealed the preference of Si atoms to occupy substitutional Ga tetrahedral sites within the Ga2O3 lattice. Through the utilization of Si-doped β-Ga2O3 films, a unique design of donut-shaped Schottky barrier diode (SBD) was successfully engineered. Remarkably, the Si-doped β-Ga2O3 SBD (employed with 20 sccm TEOS flow rate) exhibited the breakdown voltage (Vbr) of 497 V and Baliga's Figure of Merit (BFOM) value of 1.16 kW/cm2, which is five-order higher BFOM compared to undoped β-Ga2O3 SBD. This substantial improvement in BFOM underscores the significant potential of Si-doped β-Ga2O3 films for high-power electronics, opening avenues for enhanced device efficiency and capabilities.

Impact of Residual Compositional Inhomogeneities on the MCT Material Properties for IR Detectors.

HgCdTe is a well-known material for state-of-the-art infrared photodetectors. The interd-iffused multilayer process (IMP) is used for Metal-Organic Chemical Vapor Deposition (MOCVD) of HgCdTe heterostructures, enabling precise control of composition. In this method, alternating HgTe and CdTe layers are deposited, and they homogenize during growth due to interdiffusion, resulting in a near-uniform material. However, the relatively low (350 °C) IMP MOCVD growth temperature may result in significant residual compositional inhomogeneities. In this work, we have investigated the residual inhomogeneities in the IMP-grown HgCdTe layers and their influence on material properties. Significant IMP growth-related oscillations of composition have been revealed in as-grown epilayers with the use of a high-resolution Secondary Ion Mass Spectroscopy (SIMS). The oscillations can be minimized with post-growth annealing of the layers at a temperature exceeding that of growth. The electric and photoelectric characterizations showed a significant reduction in the background doping and an increase in the recombination time, which resulted in dramatic improvement of the spectral responsivity of photoconductors.

Effect of growth temperature on the microstructure and properties of epitaxial MoS2 monolayers grown by metalorganic chemical vapor deposition

Metalorganic chemical vapor deposition (MOCVD) is a promising technique for wafer-scale synthesis of MoS2 monolayers for 2D field-effect transistors (2D-FETs) and related devices. Epitaxial growth of MoS2 on sapphire provides films that are crystallographically well-oriented but typically contain low-angle grain boundaries (e.g., mirror twins), voids, and other defects depending on growth conditions and substrate characteristics. In this study, we investigate microstructure, optical properties, and field-effect characteristics of wafer-scale MoS2 monolayers grown by MOCVD on c-plane sapphire over a narrow window of growth temperatures (900–1000 °C). The density of low-angle grain boundaries in the MoS2 monolayer was found to decrease dramatically from 50% areal coverage for films grown at 900 °C to 5% at 1000 °C. This decrease in low-angle grain boundary density is correlated with an increase in the room-temperature photoluminescence intensity of A excitons and a decrease in the full-width-half maximum (FWHM) of the Raman A1g peak, which are typically indicative of a general reduction in defects in MoS2. However, the best transport properties (e.g., mean field-effect mobility mFE = 17.3 cm2/V s) were obtained in MoS2 monolayers grown at an intermediate temperature of 950 °C. It was found that as the growth temperature increased, small regions bound by high-angle boundaries begin to appear within the monolayer and increase in areal coverage, from ∼2% at 900 °C to ∼5% at 950 °C to ∼10% at 1000 °C. The growth temperature of 950 °C, therefore, provides an intermediate condition where the combined effects of low-angle and high-angle boundaries are minimized. The results of this study provide guidance on MOCVD growth and characterization that can be used to further optimize the performance of MoS2 2D-FETs.

(Invited) Growth of Hexagonal Boron Nitride by MOCVD for Electronic and Photonic Applications

Hexagonal boron nitride (h-BN) is a 2-dimensional (2D) layered insulating material. Thanks to its wide bandgap of ~6 eV and high thermal conductivity, h-BN has been widely utilized as an ideal substrate, gate dielectric material, passivation layer, and atomic tunnelling layer for 2D electronic devices. Recently, it has gained more attention as active material for photonics applications due to its potential for stable quantum emitters in the visible spectral range, as well as deep-ultraviolet emitters and detectors due to its exceptionally high internal quantum efficiency despite its indirect bandgap. However, mechanically exfoliated bulk h-BN and h-BN films grown on catalytic metal substrates by conventional chemical vapor deposition (CVD) systems have been mainly used to study the fundamental properties, lacking in scalability for practical implementation of h-BN.Here, we exploit the scalable approach to grow h-BN on various substrates such as sapphire, Si, and GaN, by using metal-organic chemical vapor deposition (MOCVD). A few-layer h-BN films were successfully grown on those substrates. In particular, we successfully accomplished the conformal growth of few-layer h-BN over an array of Si-based nanotrenches with 45 nm pitch and the aspect ratio of ~ 7:1. Moreover, it was found that at a specific MOCVD growth condition, a very unique h-BN film can be grown on GaN substrates, in which few-layer h-BN film is suspended on GaN nanoneedles. The combination of state-of-the-art microscopic and spectroscopic analyses revealed that the suspended h-BN films exhibit unprecedented deep ultraviolet photoluminescence spectra with local variation in band-edge emission. In addition, the h-BN films show unprecedented atomic stacking configuration, the mechanism of which will be discussed with optical and structural characterizations and theoretical calculations.

A systematic study on the efficacy of low-temperature GaN regrown on p-GaN to suppress Mg out-diffusion

Embedding p-type gallium nitride (p-GaN) in AlxGa1-xN-based thin films has garnered significant interest as a versatile structure for bandgap engineering such as tunnel/super-junctions or current blocking/guiding functions in electronic devices. However, Mg, a p-GaN dopant, has an undesirable diffusive capacity into the nearby thin films at a high growth temperature (>1,000°C), resulting in structural challenges in device design. This study systematically investigated the low-temperature GaN (LT-GaN) layer regrown on p-GaN that suppresses Mg diffusion according to metal–organic chemical vapor deposition growth conditions. Prototype Al0.3Ga0.7N (40 nm)/GaN (140 nm) high-electron-mobility transistors (HEMTs) were regrown with LT-GaN on p-GaN (300 nm), and a high two-dimensional electron gas (2DEG) density of 3.13E12 cm−2 was achieved by inserting a 100-nm-thick LT-GaN layer grown at 750°C; in contrast, only 1.76E10 cm−2 2DEG density was obtained from Al0.3Ga0.7N/GaN HEMTs regrown directly on p-GaN (Mg: 4.0E19 cm−3). The fabricated Al0.3Ga0.7N/GaN HEMTs with 100-nm-thick LT-GaN demonstrated a high drain current density of 84.5 mA/mm with a low on-state resistance of 31 Ω·mm. The AlxGa1-xN/LT-GaN/p-GaN platform demonstrated here paves the way for various III-nitride-based structures with embedded p-GaN.

A CFD study of the gas reaction path in growth of InN films in metal–organic chemical vapor deposition

During simulation of the growth of indium nitride (InN) thin films in metal–organic chemical vapor deposition (MOCVD), different choices of kinetic parameters (activation energy Ea and pre-exponential factor A) for gas-phase reactions give rise to many uncertainties in the gas reaction path and growth rate. This study summarized and compared the kinetic parameters of gas-phase reactions during InN MOCVD growth. The InN MOCVD growth in a close-coupled showerhead reactor was simulated with varying kinetic parameters of gas-phase reactions. The effects of kinetic parameters on the gas reaction path were determined by comparing molar concentrations and growth rates of primary In-containing substances. The results show that with varying kinetic parameters, the gas reaction path is likely to be dominated by the addition or trimethylindium pyrolysis path, or to proceed through both reaction paths. Although the reaction path changes with varying kinetic parameters, the predicted growth rates do not vary substantially, because the total rate of transport of In-containing substances to the substrate changes little with the reaction path. The results also indicate that the contribution of pyrolytic products to the growth rate is greater than that of amine, whereas H radicals have minimal effect on the gas reaction path in InN MOCVD growth.

Reduced Defect Density in MOCVD-Grown MoS2 by Manipulating the Precursor Phase.

Advancements in the synthesis of large-area, high-quality two-dimensional transition metal dichalcogenides such as MoS2 play a crucial role in the development of future electronic and optoelectronic devices. The presence of defects formed by sulfur vacancies in MoS2 results in low photoluminescence emission and imparts high n-type doping behavior, thus substantially affecting material quality. Herein, we report a new method in which single-phase (liquid) precursors are used for the metal-organic chemical vapor deposition (MOCVD) growth of a MoS2 film. Furthermore, we fabricated a high-performance photodetector (PD) and achieved improved photoresponsivity and faster photoresponse in the spectral range 405-637 nm compared to those of PDs fabricated by the conventional MOCVD method. In addition, the fabricated MoS2 thin film showed a threshold voltage shift in the positive gate bias direction owing to the reduced number of S vacancy defects in the MoS2 lattice. Thus, our method significantly improved the synthesis of monolayer MoS2 and can expand the application scope of high-quality, atomically thin materials in large-scale electronic and optoelectronic devices.

Trap characterization of high-growth-rate laser-assisted MOCVD GaN

A detailed study comparing defect incorporation between laser-assisted metal-organic chemical vapor deposition (MOCVD)-grown GaN and conventional low- and high-growth-rate MOCVD GaN was conducted. Using deep-level transient and optical spectroscopy, traps throughout the bandgap were characterized where traps were found at EC-0.25 eV, EC-0.57 eV, EC-0.72 eV, EC-0.9 eV, EC-1.35 eV, EC-2.6 eV, and EC-3.28 eV in all three samples. This indicates no new traps were observed in the laser-assisted MOCVD GaN sample. Overall, the trap concentrations in the laser-assisted MOCVD sample were ∼2× higher than the optimal low-growth-rate sample, but this is primarily due to the increase in gallium vacancy EC-2.6 eV and carbon-related EC-3.28 eV trap concentrations. The EC-0.9 eV trap concentration was ∼2× higher in the laser-assisted sample, so proton irradiation experiments were conducted to identify the physical source of this level. The results indicated this was a native point defect likely related to gallium interstitials. Overall, this study shows that the laser-assisted MOCVD growth method is promising for future thick, high-quality GaN epilayers after further growth optimizations.

8.1 μ m-emitting InP-based quantum cascade laser grown on Si by metalorganic chemical vapor deposition

This study presents the growth and characterization of an 8.1 μm-emitting, InGaAs/AlInAs/InP-based quantum cascade laser (QCL) formed on an InP-on-Si composite template by metalorganic chemical vapor deposition (MOCVD). First, for the composite-template formation, a GaAs buffer layer was grown by solid-source molecular-beam epitaxy on a commercial (001) GaP/Si substrate, thus forming a GaAs/GaP/Si template. Next, an InP metamorphic buffer layer (MBL) structure was grown atop the GaAs/GaP/Si template by MOCVD, followed by the MOCVD growth of the full QCL structure. The top-surface morphology of the GaAs/GaP/Si template before and after the InP MBL growth was assessed via atomic force microscopy, over a 100 μm2 area, and no antiphase domains were found. The average threading dislocation density (TDD) for the GaAs/GaP/Si template was found to be ∼1 × 109 cm−2, with a slightly lower defect density of ∼7.9 × 108 cm−2 after the InP MBL growth. The lasing performance of the QCL structure grown on Si was compared to that of its counterpart grown on InP native substrate and found to be quite similar. That is, the threshold-current density of the QCL on Si, for deep-etched ridge-guide devices with uncoated facets, is somewhat lower than that for its counterpart on native InP substrate, 1.50 vs 1.92 kA/cm2, while the maximum output power per facet is 1.64 vs 1.47 W. These results further demonstrate the resilience of QCLs to relatively high residual TDD values.

MOCVD Growth of Hierarchical Nanostructured MoS2: Implications for Reactive States as the Large-Area Film

Large-area hierarchical grown transition metal dichalcogenide (TMD) nanostructures as out-of-plane directional layered TMD nanocrystals on a substrate could be considerably useful in electrochemical applications because of the high density of edge states. In this study, layered MoS2 nanocrystals less than 50 nm in diameter were synthesized by overlapping with each other as vertical growth in the form of a film with an area of 10 mm × 40 μm using metal–organic chemical vapor deposition (MOCVD) for the lateral growth of TMDs. Notably, in the spatial distribution, a singular point where the vertical growth is promoted was found through optical dark-field data and spatially resolved micro-Raman spectroscopy. The accelerated vertical growth region distinguished by the singular point is due to the layer-dependent dielectric constant of MoS2, which affects the surface energy and changes the conditions of vapor-phase deposition. In addition, with these phenomena, we discuss a way for expanding the hierarchical vertically grown MoS2 region on a substrate through analytical methods based on hydromechanics.

MOCVD growth of gadolinium oxide layers on tubes

In the paper, non-porous and smooth gadolinium oxide layers were synthesized on the inner surfaces of quartz glass tubes using MOCVD (Metalorganic Chemical Vapour Deposition) in the temperature range of 580–800 °C.Commercial Gd(tmhd)3 (Tris(2,2,6,6-tetramethyl-3,5-heptanedionato)gadolinium(III), 99% (99.9%-Gd)) was a basic reactant. Pure argon (99.999%) was used as a carrier gas. Air was applied to eliminate the carbon. It also was a carrier gas. The magnitude of the extended Grx/Rex2 criterion did not exceed the value of 0.01. Other synthesis conditions were established in such a way that this condition was maintained. The evaporation temperature of Gd(tmhd)3 varied in the range of 170–270 °C.The influence of the synthesis conditions on microstructure, structure and transparency of the deposited layers was investigated. Oval-shaped Gd2O3 aggregates and fine crystallites were formed regardless of the synthesis conditions. The conducted research also shows that the lower deposition temperature and the higher evaporation temperature of reactant, causes smaller crystallite sizes and smaller their number.

High Current Density Trench CAVET on Bulk GaN Substrates with Low-Temperature GaN Suppressing Mg Diffusion

We report that, for the first time, a low-temperature GaN (LT-GaN) layer prepared by metal–organic chemical vapor deposition (MOCVD) regrowth was used as a Mg stopping layer (MSL) for a GaN trench current–aperture vertical electron transistor (CAVET) with p-GaN as a carrier blocking layer (CBL). Inserting LT-GaN on top of the p-GaN effectively suppresses Mg out-diffusion into the regrown AlGaN/GaN channel, contributing to the high current capability of GaN vertical devices with a p-GaN CBL. With different MOCVD growth conditions, MSLs inserted in trench CAVETs were comprehensively investigated for the influence of MSL regrowth temperature and thickness on device performance. With the best on-state current performance obtained in this study, the trench CAVET with a 100 nm thick MSL regrown at 750 °C shows a high drain current of 3.2 kA/cm2 and a low on-state resistance of 1.2 mΩ∙cm2. The secondary ion mass spectrometry (SIMS) depth profiles show that the trench CAVET with the 100 nm thick MSL regrown at 750 °C has a dramatically decreased Mg diffusion decay rate (~39 nm/decade) in AlGaN/GaN channel, compared to that of the CAVET without a MSL (~104 nm/decade). In developing GaN vertical devices embedded with a Mg-doped p-type layer, the LT-GaN as the MSL demonstrates a promising approach to effectively isolate Mg from the subsequently grown layers.

Properties of high to ultrahigh Si-doped GaN grown at 550 °C by flow modulated metalorganic chemical vapor deposition

The heterogeneous integration of III-nitride materials with other semiconductor systems for electronic devices is attractive because it combines the excellent electrical properties of the III-nitrides with other device platforms. Pursuing integration through metalorganic chemical vapor deposition (MOCVD) is desirable because of the scalability of the technique, but the high temperatures required for the MOCVD growth of III-nitrides (>1000 °C) are incompatible with direct heteroepitaxy on some semiconductor systems and fabricated wafers. Thus, the MOCVD growth temperature of III-nitride films must be lowered to combine them with other systems. In this work, 16 nm-thick Si:GaN films were grown by MOCVD at 550 °C using a flow modulation epitaxy scheme. By optimizing the disilane flow conditions, electron concentrations up to 5.9 × 1019 cm−3 were achieved, resulting in sheet resistances as low as 1070 Ω/□. Film mobilities ranged from 34 to 119 cm2 V−1 s−1. These results are promising for III-nitride integration and expand device design and process options for III-nitride-based electronic devices.

3 W Continuous-Wave Room Temperature Quantum Cascade Laser Grown by Metal-Organic Chemical Vapor Deposition

In this article, we report a high-performance λ ~ 4.6 μm quantum cascade laser grown by metal-organic chemical vapor deposition. Continuous wave power of 3 W was obtained from an 8 mm-long and 7.5 μm wide coated laser at 285 K. The maximum pulsed and CW wall-plug efficiency reached 15.4% and 10.4%, respectively. The device performance shows the great potential of metal-organic chemical vapor deposition growth for quantum cascade material and devices.

Toward achieving cost-effective hexagonal BN semi-bulk crystals and BN neutron detectors via halide vapor phase epitaxy

Presently, thermal neutron detectors fabricated from boron-10 enriched hexagonal boron nitride (h-10BN) ultrawide bandgap semiconductor grown by metal organic chemical vapor deposition (MOCVD) hold the record high detection efficiency among all solid-state detectors at 59%. To overcome the short comings of MOCVD growth, including inherently low growth rate and unavoidable impurities such as carbon in metal organic source, we demonstrate here the growth of natural hexagonal boron nitride (h-BN) semi-bulk wafers using halide vapor phase epitaxy (HVPE), which is an established technique for producing GaN semi-bulk crystals at a high growth rate. Electrical transport characterization results revealed that these HVPE grown materials possess an electrical resistivity of 1 × 1013 Ω cm, and a charge carrier mobility and lifetime product of 2 × 10−4 cm2/V s. Detectors fabricated from a 100 μm thick h-BN wafer have demonstrated a thermal neutron detection efficiency of 20%, corresponding to a charge collection efficiency of ∼60% at an operating voltage of 500 V. This initial demonstration opens the door for mass producing high efficiency h-BN semiconductor neutron detectors at a reduced cost, which could create unprecedented applications in nuclear energy, national security, nuclear waste monitoring and management, the health care industry, and material sciences.

Metalorganic chemical vapor deposition of (100) β-Ga2O3 on on-axis Ga2O3 substrates

Metalorganic chemical vapor deposition (MOCVD) growths of β-Ga2O3 on on-axis (100) Ga2O3 substrates are comprehensively investigated. Key MOCVD growth parameters including growth temperature, pressure, group VI/III molar flow rate ratio, and carrier gas flow rate are mapped. The dependence of the growth conditions is correlated with surface morphology, growth rate, and electron transport properties of the MOCVD grown (100) β-Ga2O3 thin films. Lower shroud gas (argon) flow is found to enhance the surface smoothness with higher room temperature (RT) electron Hall mobility. The growth rate of the films decreases but with an increase of electron mobility as the VI/III molar flow rate ratio increases. Although no significant variation on the surface morphologies is observed at different growth temperatures, the general trend of electron Hall mobilities are found to increase with increasing growth temperature. The growth rates reduce significantly with uniform surface morphologies as the chamber pressure increases. By tuning the silane flow rate, the controllable carrier concentration of (100) β-Ga2O3 thin films between low-1017 cm−3 and low-1018 cm−3 was achieved. Under optimized growth condition, an (100) β-Ga2O3 thin film with RMS roughness value of 1.64 nm and a RT mobility of 24 cm2/Vs at a carrier concentration of 7.0 × 1017 cm−3 are demonstrated. The mobilities are primarily limited by the twin lamellae and stacking faults defects generated from the growth interface. Atomic resolution scanning transmission electron microscopy reveals the formation of twin boundary defects in the films, resulting in the degradation of crystalline quality. Results from this work provide fundamental understanding of the MOCVD epitaxy of (100) β-Ga2O3 on on-axis Ga2O3 substrates and the dependence of the material properties on growth conditions. The limitation of electron transport properties of the (100) β-Ga2O3 thin films below 25 cm2/Vs is attributed to the formation of incoherent boundaries (twin lamellae) and stacking faults grown along the on-axis (100) crystal orientation.

In situ MOCVD growth and band offsets of Al2O3 dielectric on β-Ga2O3 and β-(AlxGa1−x)2O3 thin films

The in situ metalorganic chemical vapor deposition (MOCVD) growth of Al2O3 dielectrics on β-Ga2O3 and β-(AlxGa1−x)2O3 films is investigated as a function of crystal orientations and Al compositions of β-(AlxGa1−x)2O3 films. The interface and film qualities of Al2O3 dielectrics are evaluated by high-resolution x-ray diffraction and scanning transmission electron microscopy imaging, which indicate the growth of high-quality amorphous Al2O3 dielectrics with abrupt interfaces on (010), (100), and (2¯01) oriented β-(AlxGa1−x)2O3 films. The surface stoichiometries of Al2O3 deposited on all orientations of β-(AlxGa1−x)2O3 are found to be well maintained with a bandgap energy of 6.91 eV as evaluated by high-resolution x-ray photoelectron spectroscopy, which is consistent with the atomic layer deposited (ALD) Al2O3 dielectrics. The evolution of band offsets at both in situ MOCVD and ex situ ALD deposited Al2O3/β-(AlxGa1−x)2O3 is determined as a function of Al composition, indicating the influence of the deposition method, orientation, and Al composition of β-(AlxGa1−x)2O3 films on resulting band alignments. Type II band alignments are determined at the MOCVD grown Al2O3/β-(AlxGa1−x)2O3 interfaces for the (010) and (100) orientations, whereas type I band alignments with relatively low conduction band offsets are observed along the (2¯01) orientation. The results from this study on MOCVD growth and band offsets of amorphous Al2O3 deposited on differently oriented β-Ga2O3 and β-(AlxGa1−x)2O3 films will potentially contribute to the design and fabrication of future high-performance β-Ga2O3 and β-(AlxGa1−x)2O3 based transistors using MOCVD in situ deposited Al2O3 as a gate dielectric.

(Digital Presentation) MOCVD Growth of Ga2O3, Algao and Heterostructures

Ultrawide bandgap (UWBG) gallium oxide (Ga2O3) represents an emerging semiconductor material with excellent chemical and thermal stability. It has a band gap of 4.5-4.9 eV, much wider than that of the GaN (3.4 eV) and 4H-SiC (3.2 eV). The monoclinic β-phase Ga2O3 represents the thermodynamically stable crystal among the known five known phases (α, β, γ, d, ε/κ). The breakdown field of β-Ga2O3 is predicted to be 6-8 MV/cm, which is much larger than that of the 4H-SiC and GaN. These unique properties make β-Ga2O3 a promising candidate for high power electronic device and solar blind photodetector applications. Single crystal β-Ga2O3 substrates can be synthesized by scalable and low cost melting based growth techniques. Metalorganic chemical vapor deposition (MOCVD) growth technique was demonstrated to produce high quality β-Ga2O3 thin films and its ternary (AlxGa1-x)2O3 alloys. Control of background and n-type doping in β-Ga2O3 will be discussed. Record carrier mobilities of 194 cm2/V·s at room temperature and ~10,000 cm2/V·s at low temperature were measured for MOCVD β-Ga2O3 thin films. Growth and fundamental understanding of β-(AlxGa1-x)2O3 are still limited. The incorporation of Al in beta-phase Ga2O3 has not been well understood, although it was predicted up to 60% of Al composition could be incorporated into β-Ga2O3. MOCVD growth of β-AlGaO targeting for Al composition of > 40% will be discussed. N-type doping capability as a function of Al composition in (AlxGa1-x)2O3 is another important fundamental question. Charge carrier transport properties in (AlxGa1-x)2O3 will be discussed. In addition, MOCVD growth of different phases of Ga2O3 and AlGaO will be presented. Acknowledgement: The authors acknowledge the funding support from the Air Force Office of Scientific Research FA9550-18-1-0479 (AFOSR, Dr. Ali Sayir) and the National Science Foundation (1810041, 2019753, 1755479).

Effect of V–III Ratio‐Based Growth Mode on the Surface Morphology, Strain Relaxation, and Dislocation Density of AlN Films Grown by Metal‐Organic Chemical Vapor Deposition

Herein, regulation of the growth mode through manipulating the V–III ratio during metal‐organic chemical vapor deposition (MOCVD) growth of AlN films on c‐plane sapphire substrates and optimization of the crystalline quality and surface morphology of AlN films are demonstrated. Based on detailed analyses of the evolution process of surface morphology, dislocation annihilation, and stress state of the AlN film during MOCVD growth, it is found that 2D rather than 3D growth mode introduces tensile stress as well as promotes edge‐type threading dislocation (ETD) propagation and crack generation, while 3D growth mode produces rough surface. These results would help to further understand the AlN growth mechanism and provide important guidance on the preparation of AlN‐related epitaxial structure.

Impacts of hydrogen flow and growth pressure on characteristics of semipolar (11 [formula omitted] 2) plane AlInGaN quaternary epilayers

The semipolar (11 2‾ 2) plane AlInGaN quaternary epilayer was successfully grown by metal-organic chemical vapor deposition (MOCVD) technology. The impacts of hydrogen flow and growth pressure on indium incorporation, growth rate, surface morphology, and crystalline quality of the semipolar AlInGaN epilayers were investigated extensively. It was found that the indium incorporation, growth rate, surface morphology, and crystalline quality of the semipolar AlInGaN epilayers were strongly dependent on the constituent of reaction gas and growth pressure in MOCVD growth process. In fact, an evident decrease in the number of hillock-like features and a slight increase in the size of hillock-like features were observed on the surfaces of the semipolar AlInGaN epilayers as the proportion of hydrogen in reaction gas was gradually increased. A root mean square value as small as 2.7 nm and an indium composition of 3.2% were achieved by adding extra 15% hydrogen in reaction gas. On the other hand, an enhanced indium composition of 3.9% was obtained together with a 64% reduction in growth rate and dramatic degradation in surface morphology and crystalline quality by increasing the growth pressure from 40 to 100 Torr for the semipolar AlInGaN epilayer due to aggravated parasitic reactions. This fact indicates that the conventional method, namely simply increasing growth pressure is not a good option to obtain high indium composition in the semipolar AlInGaN quaternary alloy.