Melamine Urea Formaldehyde Adhesives Research Articles

Mechanical and Fire Properties of Flame-Retardant Laminated Bamboo Lumber Glued with Phenol Formaldehyde and Melamine Urea Formaldehyde Adhesives.

This study investigated the effects of different adhesives, phenol formaldehyde (PF) and melamine urea formaldehyde (MUF), on the mechanical and fire properties of flame-retardant laminated bamboo lumber (LBL). The results demonstrated that the flame-retardant treatment using phosphorus-nitrogen-boron compounds endowed the LBL with excellent flame retardancy and smoke suppression properties, even though the bending strength and bond shear strength were slightly reduced. The PF-glued LBL exhibited superior mechanical and shear properties to the MUF-glued ones, primarily due to its higher processing temperature and deeper adhesive penetration. In addition, the MUF-glued flame-retardant LBL displayed better heat release reduction and smoke suppression properties than the PF-glued LBL, which resulted from the synergistic flame retardancy between the melamine element in MUF and the applied flame retardant. The analysis of the influence of adhesive type on the mechanical and fire properties of flame-retardant LBL holds significant importance for the future design and production of high-performance LBL material.

The effects of wood fiber directions on bonding performance

Using engineered wood products (EWPs) in the building technologies is very crucial in terms of sustainable approaches. They provide; low weight, high structural stiffness, carbon storage capacity and easy erection on site. EWPs are composite materials that are influenced by a variety of factors that play a critical role in their formation. The chemical ingredients of the wood, the curing process of the adhesive, the type of wood, the relationship between the adhesive and the wood species, the curing temperature, the geometric configuration of the lamellae, etc. can all be included under the heading of these factors. In contrary with massive wood, to obtain EWPs different types of adhesives can be used. Therefore adhesive type and its application method affects the quality of wooden structural element. Choosing the appropriate adhesive is one of the steps to be taken to obtain the structurally correct product. Based on this approach, it was decided to investigate the adhesion performance of different adhesive types. This paper aims to present the best bonding method among the melamine urea formaldehyde (MUF) and epoxy adhesives by considering the fiber directions of the wood and the type of adhesive according to the load. One of the aims of this study is to investigate the effect of changing the fiber direction of wood on adhesion performance, taking into account the current gap in the literature. Pull-off tests were conducted to assess the bonding performance of different types of adhesive in wood samples with varying fiber direction. The wood samples were bonded to the wood surface with varying grain directions. During the pull-off tests, ruptures in the glue line of the test samples were commonly observed. The results have shown that in cylindrical samples bonded with epoxy, the highest bonding strength values were observed in scenarios where the wood fibers were oriented parallel to the load direction and perpendicular to the ground plane. Similarly, for wood samples used as the bonding surface, the highest bonding strength values were achieved when the wood fibers were oriented parallel to the load direction and perpendicular to the surface plane. On the other hand, the highest value in pull-off test setups was found with melamine urea formaldehyde adhesive; commonly used in laminated timber, between the wood samples with grains perpendicular to the load direction and the wood adherence surfaces with a parallel grain direction. In summary, the highest strength value was obtained from the test setup in which epoxy was used as the adhesive and both the wood specimens and the wood bonding surface had fiber directions parallel to the load direction.

STUDY OF WOOD ADHESIVES ON THE BONDING PROPERTIES IN SOLID AND HOLLOW GLULAM BEAMS OF PINUS RADIATA

The aim of this research was study of polyurethane (PUR), isocyanate polymer emulsions (EPI) and melamine-urea-formaldehyde (MUF) adhesives, on the bonding properties of solid and hollow glulam beams of Pinus radiata. The thermomechanical analysis (DMA) of theadhesives was carried out to evaluate their stiffness and reactivity. Glulam beams were evaluated by a bending test. The quality of the bonding was evaluated by resistance to shear anddelamination. The morphology of the bonding was studied by microscopy. The DMA study showed that the MUF adhesive had the highest level of stiffness and reactivity. The results of the bending test showed that the highest modulus of rupture results were obtained in solid and hollow laminated beams with MUF adhesive, achieving increases of 30% over the PUR adhesive. The lowest delamination results were obtained in solid glulam beams with MUF and EPI adhesives, while the highest results were 32% and 47% for the PUR adhesive. Finally, glulam beams manufactured with MUF adhesive presented the best performance and results.

THE SOY FLOUR AS AN EXTENDER FOR UF AND MUF ADHESIVES IN BIRCH PLYWOOD PRODUCTION

Formaldehyde emission still remains a major disadvantage of widely applied formaldehyde-containing amino resins such as UF (urea-formaldehyde) resin and MUF (melamine-urea-formaldehyde) resin. The compositions of adhesives for plywood manufacturing have to contain a proper extenders in order to adjust their viscosity. Thus, the aim of the study was to investigate the effect of protein-rich soy flour (SF) as the extender for adhesives. The composition of flours and their ability to absorb the formaldehyde were determined. Properties of liquid resins such as gel time, viscosity, pH and solid content were investigated. The possible chemical interaction between the extenders and resins were assessed with the use of FTIR spectroscopy. Plywood panels manufactured using UF and MUF adhesives with the soy flour introduced as the extender in various concentrations were tested in terms of shear strength and formaldehyde release. Studies have shown that soy flour has a favorable composition and formaldehyde-scavenging ability. The addition of SF affected resins properties such as viscosity and gel time but showed no influence on their pH and solid content. FTIR analysis has not explained the chemical interaction between resin and extender. The application of soy flour in the concentration of 15% for UF resin and 10% for MUF resin allowed to produce plywood characterized by improved bonding quality and decreased formaldehyde emission.

Effect of resin content on the physiochemical and combustion properties of wood fiber insulation board

As petrochemical products (including plastics) contribute to the destruction of the natural environment, the use of such products must be reduced. Plastics account for 90% of the insulation materials used in Korea, including extruded polystyrene (EPS), expanded polystyrene (XPS), and urethane foam. Wood-fiber insulation board (WIB) is a promising natural alternative to petrochemical insulation. This study aimed to determine the optimal amount of adhesive resin required for manufacturing WIB. Fire-resistant WIB was prepared with a melamine-urea-formaldehyde (MUF) resin (ranging from 20% to 35%), and the physicochemical and fire-resistant properties were determined. Higher resin content led to improved physical properties, while the thermal conductivity was unaffected. With the exception of 35% resin content in the WIB, the formaldehyde emissions of the WIB samples complied with the Korean Industrial Standards requirements for Super E0 grade (less than 0.3 mg per L). The physicochemical properties of the WIB samples were sufficient for use as an insulating material, even at 20% resin content. A perpendicular flame test revealed that all samples formed a carbonized layer to prevent flame penetration, except for the specimen with 20% of the resin content. The cone calorimeter testing indicated that the MUF adhesives acted as an effective fire retardant at resin contents above 25%.

The Effects of Some Synthetic Adhesives on the Formaldehyde Emission of the Particleboard

The formaldehyde emission is the one of the major problems of the particleboard industry that harms to human health and environment. The purpose of this study was to determine the effect of the adhesive type on the formaldehyde emission of three-layered particleboard. The urea formaldehyde (UF), phenol formaldehyde (PF) and melamine-urea formaldehyde (MUF) adhesives were used as adhesives. Black poplar (Populus nigra) was used as wood raw material. The panels produced with PF and MUF adhesives had the required level of formaldehyde emission value specified in EN 312-2 (1996) and these panels could be classified as E-1 grade particleboard. The particleboard samples produced with UF adhesive had more than the formaldehyde emission value required for E-1 class particleboards.

Bonding performance of melamine-urea-formaldehyde and phenol-resorcinol-formaldehyde adhesives in interior grade glulam

Wood moisture content (MC) affects the glued laminated beam (glulam) bonding strength. Selected adhesives were Phenol-Resorcinol-Formaldehyde (PRF) and Melamine-Urea-Formaldehyde (MUF) adhesives with 1, 1.5 and 2% (w/w) carboxymethyl cellulose (CMC) formic acid solutions. Douglas fir (pseudotsuga menziesii) from North America was used in the test. The bonding behavior of these adhesives with wood at 12 and 18% MC were investigated. The study focused on the effect of 18% MC on shear strength performance of MUF and PRF adhesives and optimizing the formula of CMC formic acid solution. Compressive shear strength of wood with MUF adhesive with 2% (w/w) formic acid solution at 12 and 18% MC stabilized at 10.6 and 10.0 MPa, respectively, which were 17 and 16% higher than that with PRF adhesive at the same condition. At 12–18% MC, MC had a little effect on bonding strength. However, 18% MC wood with PRF adhesive had 52.2% less initial strength increasing rate than that of 12% MC wood. 18% MC wood with MUF adhesives with 1, 1.5 and 2% (w/w) CMC formic acid solutions had 16.0, 15.5 and 27.0% less initial strength increasing rates than that of 12% MC wood, respectively. MUF adhesive using 2% CMC formic solution required the shortest press time at 12 and 18% MC about 1.6 and 2.7 h, respectively. The strength of PRF adhesive was significantly affected by wood MC and enough press time is essential for the proper bonding strength.

Feasibility of Creosote Treatment for Glued-Laminated Pine-Timber Railway Sleepers

This article studies the possibility of using market available glued-laminated timber (GLT) based on melamine-urea-formaldehyde (MUF) adhesives as an alternative to traditional solid timber sleepers. The study comprised an examination of the effect of creosote treatment on the short-term and durability after accelerated aging of the glue lines (delamination and shear strength) and the potential for full sapwood penetration by the creosote. Creosote treatment showed a negative effect on shear strength and delamination, more severe in the nonstructural than the structural GLT specimens tested. Full penetration of creosote into the sapwood was not achieved. GLT elements based on MUF adhesives can be considered an alternative to solid wood sleepers if specific grading of lamellas, proper treatment schedule, and highly controlled factory production are implemented.

The effect of the heat treatment of spruce wood on the curing of melamine–urea–formaldehyde and polyurethane adhesives

The effect of the heat treatment of spruce wood on the curing of melamine–urea–formaldehyde (MUF) and polyurethane (PUR) adhesives was monitored by measuring their rheological properties by means of a rheometer. Instead of the standard aluminium discs, wooden discs, made from heat-treated wood with different degrees of thermal modification and conditioned in different climates, were used. The wooden discs provided more realistic curing of the adhesives compared to the real-life bonding of wood, because of solvent absorption. The results of the rheological measurements suggested that the modified wood inhibited the curing of MUF and PUR adhesives. The curing of the MUF adhesive was slower because of the reduced absorption of water from the adhesive. The curing of the one-component PUR adhesive was affected by the lower moisture content (MC) of the modified wood.

Upgrading of MUF adhesives for particleboard production using oligomers of hyperbranched poly(amine-ester)

Oligomeric precursors of poly(amine-ester) were synthesized by a two-step condensation reaction of succinic anhydride with diethanolamine under mild conditions. The oligomers formed were characterized at each synthesis step using matrix-assisted laser desorption/ionization time of flight (MALDI-TOF) mass spectrometry. This showed that after step (1), the condensation adduct of both reactants (206 Da) was the main product mixed to high proportion of unreacted diethanolamine (106 Da). After step (2), the adduct at 206 Da decreased substantially, while other compounds at 275, 292, and 375 Da started to increase along with the appearance of a new compound at 392 Da. This indicates that the reaction proceeds slowly under these conditions to give higher branched oligomers (HP). In addition, some cyclic compounds were also identified by the 188, 275, and 375 Da peaks. MALDI-TOF of the melamine–urea–formaldehyde (MUF) resin before and after reaction with the hyperbranched oligomers mix showed clear indication of the coreaction of simple melamine–formaldehyde oligomers with several of the hyperbranched oligomers previously identified. Addition of small proportions of a mixture of the formed HP oligomers to a MUF adhesive improved the internal bond (IB) strength, both dry and wet, of wood particleboards bonded with it. The results obtained indicate that the addition of these HP oligomers can improve the dry IB strength by 17–24% according to conditions of preparation and the wet IB strength by as much as 47% when compared to the control sample.

Particle Board and Oriented Strand Board Prepared with Nanocellulose‐Reinforced Adhesive

Adhesives on the basis of urea‐formaldehyde (UF) and melamine‐urea‐formaldehyde (MUF) are extensively used in the production of wood‐based panels. In the present study, the attempt was made to improve the mechanical board properties by reinforcing these adhesives with cellulose nanofibers (CNFs). The latter were produced from dissolving grade beech pulp by a mechanical homogenization process. Adhesive mixtures with a CNF content of 0, 1, and 3 wt% based on solid resin were prepared by mixing an aqueous CNF suspension with UF and MUF adhesives. Laboratory‐scale particle boards and oriented strand boards (OSBs) were produced, and the mechanical and fracture mechanical properties were investigated. Particle boards prepared with UF containing 1 wt% CNF showed a reduced thickness swelling and better internal bond and bending strength than boards produced with pure UF. The reinforcing effect of CNF was even more obvious for OSB where a significant improvement of strength properties of 16% was found. For both, particle board and OSB, mode I fracture energy and fracture toughness were the parameters with the greatest improvement indicating that the adhesive bonds were markedly toughened by the CNF addition.

Effects of steaming process on some properties of eucalyptus particleboard bonded with UF and MUF adhesives

The steaming process, applied to logs before chipping, affected positively the dimensional stability of eucalyptus particleboard whereas, the internal bonding. The modulus of rupture (MOR) and internal bond strength (IB) values of the panels produced from steamed log parts without hardener were found to be higher than those of the panels produced by adding hardener into the urea formaldehyde (UF) glue. The steaming process did not have a clear effect on the IB of the panels bonded with melamine–urea formaldehyde (MUF) resin. The IB values of the panels bonded with MUF resin were higher than those of the panels bonded with UF resin. The MOR values of the MUF-bonded panels were higher than the requirement for general purpose panels. The steaming process caused an extra improvement in the thickness swelling (TS) of the panels bonded with MUF resin, which has higher resistance to water and weather than UF resin. The TS of the panels produced without hardener was half of the value obtained for the panels bonded with hardener-added UF resin.

Acetal‐induced strength increases and lower resin content of MUF and other polycondensation adhesives

AbstractAcetals such as methylal and ethylal are shown to be particularly effective additives in improving the strength of wood boards bonded with melamine‐ urea‐formaldehyde (MUF) resins, although they show some appreciable but lesser effect on other resins too, particularly phenol‐ formaldehyde resins. They equally allow a considerable decrease in resin loading, and thus, in melamine content, on the bonded wood panel and at parity of performance. Their development as additives is then primarily, but not only, targeted at the MUF adhesive resins. One‐third decreases in MUF adhesives loading at parity of performance or equally internal bond (IB) strength increases approximately up to 50% by addition of methylal are shown to be possible by laboratory particleboard as well as by thermomechanical analysis (TMA). The reasons for methylal and ethylal behavior were studied by a variety of techniques, including liquid‐ and solid‐ phase 13C‐NMR and could be mostly ascribed to the increased effectiveness and participation of the melamine to resin crosslinking due to its now preferentially homogeneous rather than heterogeneous reactions, consequences of the increased solubility in water afforded by the acetal cosolvents. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 2561–2571, 2002