Thin Sn-based solder microjoints, typically less than 25 μm thick, attached to Cu bond pads on both sides in three-dimensional electronic packages are often converted completely into intermetallic compounds (IMC) during service or accelerated testing. The rate of IMC growth and the proportions of the IMCs relative to the unreacted Sn in the joint have strong implications on solder joint reliability, and hence on the performance of the entire package. Although IMC growth at the interface between two semi-infinite slabs of different components (e.g., Cu and Sn) has been previously modeled, to date, no analytical treatment of intermetallic growth at the interfaces of a thin joint (Sn) sandwiched between two massive substrates (Cu), with concurrent growth of two different intermetallics (Cu6Sn5 and Cu3Sn) at each interface, has been proposed. In this work, a multicomponent diffusion-based model is developed for IMC growth in a thin joint between two semi-infinite substrates, with each interface possessing a multiphase structure. Because the Sn layer is thin, after prolonged aging, Sn may be completely depleted by reaction with Cu from the substrates, with the entire joint becoming IMC. Considering the joint as a finite source of Sn and the substrates as semi-infinite sources of Cu, general solutions of Fick’s second law of diffusion were applied to obtain the concentration of Cu within each phase. Values of interdiffusion coefficients available in literature were used to solve for the interfacial position parameters in the multiphase system, and thence to determine the instantaneous thicknesses of Cu6Sn5 (η), Cu3Sn (e), and Sn. The predictions of the model were validated against experimental data on the growth of IMCs in thin solder joints at 180°C and 210°C. Finally, the model was used to simulate the effects of aging temperature, joint thickness, and initial IMC thicknesses on the growth kinetics of IMCs during isothermal aging.