Electronic Product Manufacturers Research Articles

Microstructural response characteristics of SAC305/Cu column joint under friction embedded welding conditions

The friction welding method for macro-scale weldments was introduced into the manufacturing of electronic products. Without mold assistance, the positioning and connection of micro copper columns in column grid array packaging (CGA) devices were achieved. The average connection strength of 40.6 N and the intermetallic compound interface layer meant that effective connections were achieved. In the poorly identified stirring-mixing zone (SMZ) in scanning electron microscopy (SEM) images, electron backscatter diffraction (EBSD) results showed that this region was composed of recrystallized grains, twin grains, and Ag3Sn and Cu6Sn5 particles distributed inside or at the grain boundaries. The grain size was about 2 μm, and the Ag3Sn and Cu6Sn5 particle sizes were broken to 250 nm and 120 nm due to stirring. The SMZ at the bottom of the copper column only underwent deformation-induced dynamic recrystallization, while the SMZ on the side was discharged from the bottom of the copper column, so it underwent dynamic recrystallization through the process of cutting crushing-extruding and flow-bonding-deformation. Therefore, the hardness of SMZ was significantly reduced after welding. Unlike traditional friction welding, in the thermo-mechanical affected zone (TMAZ), the solder not only underwent deformation but also formed 47.8% recrystallization microstructure and 14.6% recovery microstructure. Therefore, the effect of deformation strengthening was weakened and recrystallization led to a decrease in hardness. Recovery was the main response behavior in the micro-deformation zone (MDZ). Combined with the numerical simulation results, the temperature and stress driving conditions of the microstructure of each micro-region in instantaneous friction embedded welding (FEW) were also discussed.

EU의 표준화정책과 기준·인증제도에 관한 연구

Purpose: This paper presents implications determined by analyzing the process in which the EU standardization system has been formed, and by analyzing the characteristics and problems of the EU’s standards and certification system. Research design, data, and methodology: Preceding studies of the EU standardization policy and the standards and certification system were analyzed. Results: T he EU’s s tandardization r egulations s ubmitted t o t he W TO a re s tandards a nd certification rules that check whether environmental requirements are met in relation to the manufacture, use, and disposal of chemicals, automobiles, and electronic products, as well as for food safety and labeling, automobile safety and formal approval, and household goods. Conclusions: From Korea’s perspective, it is first necessary to clearly understand international standards, the EU’s standards, and its certification system for each item exported to the EU, and to have an overall support system in place to respond immediately to changes in the EU market by paying close attention to changes in related rules. Second, it is necessary to respond quickly to changes in the UK’s standardization policy. Third, government support should be strengthened to revitalize the private industry standardization system and to harmonize it with national standards. Finally, we need to develop high-tech, next-generation international standards to strengthen manufacturing industries that meet global standards, and to preemptively respond to new trade environments.

Applying Relevance Theory in Advertisement Translation: A Particular Look into Electronic Product Advertisement

Competition among different electronic product manufacturers has become increasingly fierce, and advertisement translation now significantly influences both product sales and brand image. Relevance Theory, situated within the realm of cognitive pragmatics, demonstrates great compatibility with translation and proves to be effectively applicable. Viewing electronic product advertisement translation through the lens of Relevance Theory, this study regards it as “ostensive-inferential” communication. This study analyzes the advertisement translation of some renowned foreign electronic products and the translation strategies employed. It points out that translators must consider the cognitive environment of target language readers and flexibly adopt translation strategies to help them recognize advertiser’s communicative intention with minimal referencing effort and achieve contextual effects, and concludes that the key to successful translation lies in whether the translation aligns with the principle of optimal relevance.

SMART 3D Manufacturing of Printed Electronics

Printed electronics has been around for many years, reaching back to screen printing of thick film hybrid microelectronics. As time went on new material technologies emerged and integrated with graphically based printing processes like gravure, ink jet and others. Additionally, 3d printing matured over time, again with new material technologies and printing processes to include fused deposition modeling (FDM). Born out of the desire to print engineering models the technology has evolved into the ability to print higher performance structures as the final product. The idea in creating a factory in a box for 3D printed electronics was enabled in creating the ability to print multimaterial with multiple printed processes that included additive and subtractive methods. This integration allowed for the ability to print electronics and the electronic packaging in the same system. The goal was the ability to achieve the green -button, meaning load a digital file, press the green button and the electronic device, module or product emerged. True digital to physical manufacturing. Missing in this process is the integration of machine learning, artificial intelligence and in situ monitoring of processes and materials and digital twin. This presentation will cover the industry evolution of SMART 3D Manufacturing of electronic products the enable distributed manufacturing at the point of use/need.

System for PCB Defect Detection Using Visual Computing and Deep Learning for Production Optimization

With the growing competition between the various manufacturers of electronic products, the quality of the products developed and the consequent confidence in the brand are fundamental factors for the survival of companies. To guarantee the quality of the products in the manufacturing process, it is crucial to identify defects during the production stage of an electronic device. This study presents a system based on traditional visual computing and new deep learning methods to detect defects in electronic devices during the manufacturing process. A prototype of the proposed system was developed and manufactured for direct use in the production line of electronic devices. Tests were performed using a particular smartphone model that had 22 critical components to inspect and the results showed that the proposed system achieved an average accuracy of more than 90% in defect detection when it was directly used in the operational production line. Other studies in this field perform measurements in controlled laboratory environments and identify fewer critical components. Therefore, the proposed method is a real-time high-performance system. Furthermore, the proposed system conforms with the Industry 4.0 goal that process system digitization is essential to improve indicators and optimize production.

Is environmental regulation keeping e-waste under control? Evidence from e-waste exports in the European Union

Waste generated from electrical and electronic equipment, known as e-waste, is increasing worldwide. Developed countries like those in Europe produce the most significant proportion of e-waste worldwide and, therefore, rely on exporting it to other countries for waste disposal. As Europe is transiting towards a Circular Economy and tackling environmental-related problems, there has been an increase in environmental policies and regulations in this area. This paper presents empirical evidence of how European Union regulations have affected the exports of e-waste. Yearly data from 2010 to 2018 for a panel of 18 European Union countries were analysed using the PCSE (Panel-Corrected Standard Error) estimator. In order to measure environmental regulation, Environmental Tax Revenues from the manufacture of computers, electronic, and optical products were selected. The findings of this paper suggest that taxation is ineffective in reducing e-waste exports, with a tax on manufacturers actually increasing them. Also, high dependence and sub-standard e-waste collection systems increase e-waste exportation. Given that countries often depend on foreign raw materials, a sensible approach would be to invest in collection points for e-waste to take economic advantage of this waste's vital elements.

Progress in Active Infrared Imaging for Defect Detection in the Renewable and Electronic Industries.

In recent years, infrared thermographic (IRT) technology has experienced notable advancements and found widespread applications in various fields, such as renewable industry, electronic industry, construction, aviation, and healthcare. IRT technology is used for defect detection due to its non-contact, efficient, and high-resolution methods, which enhance product quality and reliability. This review offers an overview of active IRT principles. It comprehensively examines four categories based on the type of heat sources employed: pulsed thermography (PT), lock-in thermography (LT), ultrasonically stimulated vibration thermography (UVT), and eddy current thermography (ECT). Furthermore, the review explores the application of IRT imaging in the renewable energy sector, with a specific focus on the photovoltaic (PV) industry. The integration of IRT imaging and deep learning techniques presents an efficient and highly accurate solution for detecting defects in PV panels, playing a critical role in monitoring and maintaining PV energy systems. In addition, the application of infrared thermal imaging technology in electronic industry is reviewed. In the development and manufacturing of electronic products, IRT imaging is used to assess the performance and thermal characteristics of circuit boards. It aids in detecting potential material and manufacturing defects, ensuring product quality. Furthermore, the research discusses algorithmic detection for PV panels, the excitation sources used in electronic industry inspections, and infrared wavelengths. Finally, the review analyzes the advantages and challenges of IRT imaging concerning excitation sources, the PV industry, the electronics industry, and artificial intelligence (AI). It provides insights into critical issues requiring attention in future research endeavors.

Augmented Reality-Based BIM Data Compatibility Verification Method for FAB Digital Twin implementation

With the advancement of state-of-the-art technologies, the semiconductor industry plays a key role as an essential component in the manufacture of various electronic products. Since the manufacturing of a semiconductor goes through very sophisticated and complex processes, efficient and accurate work and management are essential in the design, construction, and operation stages of the semiconductor fabrication (FAB) plant. Recently, the combined application of building information modeling (BIM) and augmented reality (AR) technology has gained increased attention in this semiconductor FAB industry as an advanced way to improve work efficiency and accuracy while eliminating other related problems, such as human errors. Despite the perceived benefits of combined use of BIM and AR, many technical problems still exist when integrating the target test model and the 3D virtual object model using BIM data and existing AR visualization technology, due to the unique characteristics of the FAB sites. To solve these problems, this study proposed an AR-based real-time BIM data compatibility verification method for future FAB digital twin implementation and demonstrated that it could be converted into a system and applied to actual FAB sites. As a result of the development and verification of this system, the proposed AR-based real-time BIM data compatibility verification system enables the accurate fitting of the AR model and actual object through AR tracking and anchoring technology considering the characteristics of FAB sites. After the fitting, the system was able to maintain compatibility, even when the camera moved and the marker moved away from the screen. By expanding the effective distance of compatibility between the AR model and the actual object, it was possible to increase the AR application range between the 3D virtual object model and the test target model and to improve the compatibility.

Exploring Industry-Specific Research Themes on E-Waste: A Literature Review

The usance of electric and electronic products has become commonplace across the globe. The growing number of customers and the demand for these products are resulting in the manufacturing of new electrical and electronic products into the market, which is ultimately generating a plethora of e-waste. The notion of a circular economy (CE) is attracting more researchers to work in the growing field of e-waste management. Considering e-waste as a prominent menace, the objective of this study was to undertake a comprehensive review of the literature by analyzing the research articles published in the MDPI Sustainability journal pertaining to the topic of e-waste in the context of operations and supply chain management (OSCM). This study was addressed via three research questions. A total of 87 selected papers from 2014 to 2023 were analyzed, reviewed, and categorized after data were collected from Web of Science (WOS) and Scopus academic databases with articles only published in the MDPI Sustainability journal. This entails identifying prominent research themes, publication trends, research evolution, research clusters, and industries related to e-waste through descriptive analysis. The field of study and methods employed were analyzed by means of content analysis by delving into the main body of the published articles. Further, four major research themes and clusters were identified: (1) closed-loop supply chains; (2) e-waste; (3) sustainable development; and (4) waste electrical and electronic equipment (WEEE). Consequently, this review can be a foundation for subsequent scholarly pursuits toward e-waste management and fresh lines of inquiry for the journal. Finally, in the conclusion section, some future research guidelines are also provided.

Flexible MXene decorative nonwovens with patterned structures for integrated joule heating and strain sensing

Multifunctional textile-based wearable electronics require reliable mechanical flexibility, excellent breathability. Therefore, the manufacture of electronic products with the above characteristics is of great significance for multifunctional, physical health care, and personalized medicine. Herein, we fabricated a wearable heater by depositing MXene uniformly on the patterned thermoplastic polyurethane (TPU) fiber membrane. The unique patterned junctions of the fiber membrane not only guarantee excellent air permeability for the overall structure but also enable MXene to form more stable conductive pathways. The prepared fiber film has a stable electrothermal response and a good Joule heating effect. It can reach 44 ° C instantaneously at a 2 V voltage, and the duration was far more than the 1400 s. The temperature can reach 150 ° C at 5 V voltage, to achieve the purpose of higher temperature at low voltage and low MXene content. In addition, the fiber film also has the photothermal conversion effect, which can reach 32.4 ° C when heated by light for 100 s, and the light-off temperature can be rapidly reduced to room temperature after the 40 s. In addition, it also has the function of monitoring human movement. This study provides multifunctional wearable electronics for personal medical and health monitoring and personal thermal management, because of the uniform loading of MXene and excellent mechanical properties and air permeability provided by the patterned structure. In conclusion, we expect that this work will be beneficial to improve the Joule heating performance of smart wearable devices.

Design and validation of a gripper for the automated assembly of film components in flexible electronics manufacturing

ABSTRACT Automation in the manufacturing of electronic products and devices has been increasingly implemented in the last decades, to cope with the growing demand for mass emerging products. However, some niches still exhibit a large room for improvement. Considering flexible electronics production, this work addresses the assembly of film coverlays, which is still conducted manually, mainly due to the technological challenges related to the manipulation of film-based components and the removal of the film protecting the adhesive layer, along with the extreme variability of their shape and dimension. These issues result in stressful and troublesome tasks for the operator, besides preventing the full digitalization of the production process. A multifunctional gripper is presented as the core device to enable assembly automation. The study concerns the full gripper development, from the analysis of requirements and concept definition to design, prototyping and testing. The device was tested installed on a robot arm, demonstrating full reliability for the completion of all assembly process tasks. Moreover, the assessment of positioning performance confirms the fulfilment of process requirements, still providing insights for slight improvements. The gripper represents a scalable solution for the automated assembly of film-based coverlays, ready for validation in industrial settings.

Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

Research on Material Science has a long tradition, and lead has been used widely in many applications. Because of their low melting temperatures, low cost, and good wettability, tin -lead alloys have been preferred as solder alloys in industrial production, particularly in the electronics sector. However, due to the negative effects of lead on the environment and human health, studies on lead-free solder alloys have been increasing, and the subject is still important today. Furthermore, environmental protection agencies (RoHS and WEEE) have prohibited the use of lead-containing solder alloys in the manufacture of electronic and microelectronic products. In this work, the effect of adding Cu to alloys in five compositions of (81Sn-xCu-(19-x)In) % with x=1, 2, 3, 4, and 5 on the mechanical properties has been studied. The five samples were prepared from high purity (99%) elements (Sn –Cu –In ) using the melting technique. The creep of the ternary alloys was examined at different temperatures (25, 50, and 80 ) under three different loads (2.5, 6.3, and 11.4 MPa). It was found that the creep rate of the ternary alloys was increasing with the increases in Cu –content in all samples at different temperatures and loads. The mean values of the stress exponent were found to be in the range of (0.1-2.5) as well as the activation energies vaied in the range of (0.48-5.33) eV for all alloys under different loads (2.5, 6.3, and 11.4 MPa).

PCB Defect Detection Based on Deep Learning Algorithm

Printed circuit boards (PCBs) are primarily used to connect electronic components to each other. It is one of the most important stages in the manufacturing of electronic products. A small defect in the PCB can make the final product inoperable. Therefore, careful and meticulous defect detection steps are necessary and indispensable in the PCB manufacturing process. The detection methods can generally be divided into manual inspection and automatic optical inspection (AOI). The main disadvantage of manual detection is that the detection speed is too slow, resulting in a waste of human resources and costs. Thus, in order to speed up the production speed, AOI techniques have been adopted by many PCB manufacturers. Most current AOI mechanisms use traditional optical algorithms. These algorithms can easily lead to misjudgments due to different light and shadow changes caused by slight differences in PCB placement or solder amount so that qualified PCBs are judged as defective products, which is also the main reason for the high misjudgment rate of AOI detection. In order to effectively solve the problem of AOI misjudgment, manual re-judgment is currently the reinspection method adopted by most PCB manufacturers for defective products judged by AOI. Undoubtedly, the need for inspectors is another kind of labor cost. To reduce the labor cost. of manual re-judgement, an accurate and efficient PCB defect reinspection mechanism based on deep learning algorithm is proposed. This mechanism mainly establishes two detection models, which can classify the defects of the product. When both models have basic recognition capabilities, the two models are then combined into a main model to improve the accuracy of defect detection. In the study, the data provided by Lite-On Technology Co., Ltd. were implemented. To achieve the practical application value in the industry, this research not only considers the problem of detection accuracy, but also considers the problem of detection execution speed. Therefore, fewer parameters are used in the construction of the model. The research results show that the accuracy rate of defect detection is about 95%, and the recall rate is 94%. Compared with other detection modules, the execution speed is greatly improved. The detection time of each image is only 0.027 s, which fully meets the purpose of industrial practical application.

Study on Chains of Information Industry based on Average Propagation Lengths and Minimal Spanning Tree

Compared with the traditional methods of using industrial linkages to analyze the industrial chain, this paper introduces the theories of economic distance and graph theory to analyze the information industry chain. Industrial linkages reflects the size of economic and technological connection, and economic distance measures the distance between industries. The minimum spanning tree in graph theory measures the position of each industry in the information industry chain. There are complex indirect dependence and direct dependence in the industrial chain of electronic product manufacturing. The economic distance with most industries is 2 and 3, and most of the associated industries are manufacturing. The industrial chain of information service industry is relatively simple. Most related industries belong to the tertiary industry, and the economic distance is relatively close. The minimum spanning tree of information industry shows the central position of metal ore and metal smelting, and shows that the information industry chain still depends on metal ore resources. Using the time series input-output table, this paper analyzes the development and changes of the information industry chain, and finds that the information industry chain is relatively stable in this time span. Finally, it compares the difference between the competitive model and the non competitive model to measure the information industry chain. Using the non competitive model, it is found that the information industry chain becomes shorter and the economic distance between industries is closer.

A new job priority rule for the NEH-based heuristic to minimize makespan in permutation flowshops

The permutation flowshop scheduling problem is a vital production management concern of industries such as electronic product manufacturing and integrated circuit fabrication. In many studies, jobs are prioritized independently according to their features or properties. This article develops a new perspective by introducing the self-attention mechanism into scheduling for the first time. The job similarities are characterized by the dot-product of processing time matrices and taken as job priorities. Based on this idea, a new priority rule denoted by PRSAT is proposed, and a heuristic named NEHLJP2 is presented with makespan minimization. The computational results with the Taillard and VRF benchmarks and 640 random instances demonstrate that the new priority rule and heuristic dominate the existing ones at a nominal cost of computation time.

(Invited) Plasma-Based Thin Film Technology in Fabrication of Nano- to Giga-Sized Electronics

This talk is presented to honor Professor Noel Buckley who has made many important contributions in compound semiconductors, copper thin film deposition, batteries, and other topics critical to the manufacture of modern optoelectronics. He is also a good friend, colleague, and collaborator for 3 decades.Plasma technology has been broadly used in the mass production of modern electronics varying from nano-sized devices in ICs to giga-dimension flat panel displays. It is especially critical to the preparation of thin films with well-controlled properties, geometry, and reliability. In this talk, the speaker shall discuss the recent development of plasma thin film deposition, etching, and reaction in his laboratory for the manufacture of electronic and optoelectronic products. Room-temperature plasma-based copper etch processes for sub 0.5 μm geometry patterns ICs and large-area direct-view TFT LCDsSputter deposited sub 1 nm EOT high-k gate dielectrics, nanocrystals embedded high-k dielectric nonvolatile memories, and solid-state incandescent light emitting devices (SSI-LEDs)Plasma oxidation of copper as a self-aligned passivation film

How multi-sourcing can influence management control: Case study evidence from the electronic products supply chain

This study investigates how multi-sourcing can influence the use of management controls in the presence of varying buyer-supplier power dependencies. Multi-sourcing is an interorganizational design choice that can help buyers collect valuable information to facilitate cost and performance comparisons across multiple sources of supply. We leverage prior research to develop a conceptual framework that highlights how multi-sourcing can enable buyers to use cost management and performance management controls differently depending on the nature of buyer-supplier power dependencies. We then use case studies of three electronic product manufacturers to illustrate the framework, yielding empirically testable propositions regarding when multi-sourcing may enable cost management controls, performance management controls, and both types of control. The evidence demonstrates the importance of simultaneously considering multiple interorganizational design choices when studying management controls in supply chains. We also highlight how multi-sourcing may help supply chains promote non-financial goals, including those related to environmental and social activities.

Has the rise of China’s domestic supply chain contributed to its GDP increases?

ABSTRACT This paper applies a structural decomposition of the input-output tables to investigate the sources of changes in the GDP of China, paying special attention to the import substitution of intermediate inputs. It is argued that the specific way GDP is decomposed in this paper sheds more light on the origin of growth than does the conventional decomposition of GDP by its final demand components. The results of the decomposition show that import substitution of intermediate products, which is an act of de-globalization of trade and a model of industrialization some Asian newly industrializing economies followed decades earlier, also became important in China, but only belatedly: in 2011–2012 and 2013–2014. The phenomenon is found to be significant in the manufacture of (i) computer, electronic and optical products, (ii) chemicals and chemical products, (iii) coke and refined petroleum products, and (iv) basic metals.

Labour Productivity as a Factor of Tangible Investment in Companies Producing Wind Energy Components and Its Impacts: Case of Lithuania

This paper aims at justifying the significance of investment in the improvement of labour productivity (LP) and importance of the latter on economic performance of companies manufacturing wind energy components (WEC) in Lithuania in terms of value added (VA) created, profitability and wage earned. The time period covered is 2000–2020. The following methods have been employed: analysis of legal acts, programmes, strategies, and business structure and finance indicators, interdependence (correlation and regression), trend, case analysis, logical economical reasoning and graphical representation. The research results of current status analysis showed that the business of WEC manufacturing is small in regard to their variety of products but increasing in terms of VA and employment in Lithuania. Investment has been found as a driver of improvement in LP. The calculated historical ratio of change in LP to investment showed that, on average, after 1000 EUR per employee has been invested in tangible assets (TA), the LP increased by 0.13 EUR/h. A higher than average ratio was found in the manufacture of other transport and repair and installation of machinery and equipment (1.41), such as rubber, plastic and other non-metallic mineral products (0.17), but lower in the manufacture of electronic and communication (0.12) and metal (0.06) products. Taking into account the linear curves of LP to investment in TA curve and the average volumes of investment in different manufacturing activities, it is estimated that LP could grow by 5.3% a year in the manufacture of electronic products, and communication equipment are expected to increase by two-fold to 33 EUR/h in 2030, but it could grow only by 2.0% a year in the manufacture of rubber, plastic and other non-metallic mineral products to reach 28 EUR/h in 2030. Due to investment related changes in LP, the VA created by WEC companies could increase by 5.9% a year and account to 2.9 billion EUR during 2021–2030. Net profitability and real wages (and salaries) could also increase in future. Seeking to use the potential of companies to manufacture WEC for domestic wind installations and exports, investment supporting programmes are of high importance in the fields of promotion of innovations, development of human capital and adaptation of new technologies.

P‐59: In‐Fab Raman Spectroscopy for Defect Analysis of Random Failures

Random defects, which account for more than 90% of electronic product manufacturing defects, are defects caused by foreign substances. Although the detection ability has been improved through various efforts using optical inspection and image features, the ultimate enhancement to improve quality and yield cannot be achieved just by detecting defects. In particular, there was a limit to classifying and specifying the failure source because the ingredients were not known, and it was often impossible to eliminate defects even after spending a lot of time. We developed a world first in‐fab Raman spectroscopy microscopy to be applied to the analysis of foreign substances in the entire area of the 8.5th generation glass substrate and applied it in real time between manufacturing. As a result, it is possible to detect defective sources in real time and to improve quality and yield through process control and ultimate improvement.