Microstructural response characteristics of SAC305/Cu column joint under friction embedded welding conditions

Abstract

The friction welding method for macro-scale weldments was introduced into the manufacturing of electronic products. Without mold assistance, the positioning and connection of micro copper columns in column grid array packaging (CGA) devices were achieved. The average connection strength of 40.6 N and the intermetallic compound interface layer meant that effective connections were achieved. In the poorly identified stirring-mixing zone (SMZ) in scanning electron microscopy (SEM) images, electron backscatter diffraction (EBSD) results showed that this region was composed of recrystallized grains, twin grains, and Ag3Sn and Cu6Sn5 particles distributed inside or at the grain boundaries. The grain size was about 2 μm, and the Ag3Sn and Cu6Sn5 particle sizes were broken to 250 nm and 120 nm due to stirring. The SMZ at the bottom of the copper column only underwent deformation-induced dynamic recrystallization, while the SMZ on the side was discharged from the bottom of the copper column, so it underwent dynamic recrystallization through the process of cutting crushing-extruding and flow-bonding-deformation. Therefore, the hardness of SMZ was significantly reduced after welding. Unlike traditional friction welding, in the thermo-mechanical affected zone (TMAZ), the solder not only underwent deformation but also formed 47.8% recrystallization microstructure and 14.6% recovery microstructure. Therefore, the effect of deformation strengthening was weakened and recrystallization led to a decrease in hardness. Recovery was the main response behavior in the micro-deformation zone (MDZ). Combined with the numerical simulation results, the temperature and stress driving conditions of the microstructure of each micro-region in instantaneous friction embedded welding (FEW) were also discussed.