Ceramic materials are widely used in national defense, military industry, information technology and other fields, are a typical hard and brittle material. Microstructure and mechanical properties not only affect the overall performance of ceramic parts, but also affect their machining performance. The diamond wire sawing technology has the characteristics of high machining efficiency, small crack damage, low cutting loss, and green environmental protection, and is widely used in the cutting of hard and brittle materials. Therefore, exploring the influence of ceramic microstructure on diamond wire sawing has theoretical significance and practical value. This article first prepares high-performance alumina ceramics with different grain sizes to provide preliminary material preparation for diamond wire sawing; Then, characterization experiments such as microstructure, mechanical properties, fracture and indentation morphology, and indentation depth were conducted to provide technical methods for in-depth research on material removal in diamond wire sawing; Finally, the removal form, chips, roughness, and removal rate of diamond wire sawing were studied to obtain the influence of different microstructures of alumina ceramics on diamond wire sawing, providing a certain theoretical and technical basis for efficient machining of high-performance ceramics by diamond wire saw.
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