Abstract
Ceramics thin substrates are widely used in electronic devices due to their excellent physical and mechanical properties. Diamond wire sawing is one of promising manufacturing route to prepare thin ceramic substrates from sintered ceramics block. In present paper, a comparative study on diamond wire sawing of Al2O3, AlN, ZrO2 and Si3N4 ceramics was carried out. The material removal rate (MRR), wire sawing force and surface integrity of different ceramics as well as the wear characteristics of diamond wire were examined. A finite element model (FEM) for the single-grain cutting of different ceramic materials was developed to elucidate the influence of the mechanical properties of these ceramics on both surface morphology and the cutting force. The results show that mechanical properties of ceramic materials have great influence on diamond wire sawing performance. The Al2O3 and AlN with lower fracture toughness exhibit better machinability than that of ZrO2 and Si3N4. AlN has the highest MRR (0.128 mm3/min) and the smallest tangential sawing force (0.0255 N), while Si3N4 presents the lowest MRR (0.101 mm3/min) and ZrO2 owns the largest wire sawing force (0.238 N) under wire speed of 1.3 m/s. For the sawn surface of ceramics, Si3N4 shows the lowest surface roughness (Ra 0.23 μm), followed by ZrO2 (Ra 0.44 μm) and AlN (Ra 0.57 μm), while Al2O3 exhibits the highest surface roughness (Ra 0.62 μm). In sawing of ZrO2 and Si3N4, the electroplated diamond grits tend to flatten or fall-off, producing severer wear of diamond wire than that of Al2O3 and AlN, and deteriorating the sawing capability of the diamond wire.
Published Version
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