Low Coefficient Of Thermal Expansion Research Articles

Spodumene glass-ceramics with low thermal expansion coefficient prepared using gold tailings

Spodumene glass-ceramics with low thermal expansion coefficient prepared using gold tailings

Poly(ester imide)s with Low Linear Coefficients of Thermal Expansion and Low Water Uptake (VIII): Structure–Flame Retardancy Relationship

A series of ester-linked tetracarboxylic dianhydrides containing multiple para-phenylene units (TA-pPhs) was synthesized to obtain novel modified polyimides, namely poly(ester imide)s (PEsIs). The flame retardancy and film toughness of PEsIs tended to deteriorate with the structural extension of the repeating units (or monomers) via ester groups. To identify the structural factors necessary for achieving the highest flame retardancy rank (UL-94, V-0), we systematically investigated the structure–property relationships of a series of TA-pPh-based PEsIs. Among them, a PEsI derived from para-quaterphenylene-containing TA-pPh (TA-DPQP) and p-phenylenediamine (p-PDA) exhibited the best property combination, featuring an extremely high glass transition temperature (Tg), very low linear coefficient of thermal expansion (CTE), low water uptake (WA), ultralow linear coefficient of humidity (hygroscopic) expansion (CHE), unexpectedly high film toughness, and excellent flame retardancy (V-0 rank). Moreover, we examined the effects of substituents of TA-pPh and discussed the mode of action for the increased film toughness. This study also investigated the structure–property relationship for a series of PEsIs derived from isomeric naphthalene-containing tetracarboxylic dianhydrides. Some of the PEsIs obtained in this study, such as the TA-DPQP/p-PDA system, hold promise as novel high-temperature dielectric substrates for use in flexible printed circuits.

An experimental and numerical study on the evolution of pores and its effect on the tensile properties of LPBF Invar36 with different energy density

Laser powder bed fusion (LPBF) Invar 36 alloy has attracted plenty of attention in cryogenic components or precision instruments due to its low coefficient of thermal expansion in a wide range of temperature. However, the LPBF Invar 36 has a significant anisotropic mechanical property due to the unique columnar grain morphology and pore feature. In this study, the influence of scanning speed on the anisotropic tensile properties were investigated, and the melt pool dynamics were analyzed by the numerical simulation. In this respect, tensile tests of specimens parallel and perpendicular to the building direction with a scanning speed from 200 to 1400 mm/s of LPBF Invar 36 alloy were conducted, and the microstructural influential factors on the anisotropic tensile properties were analyzed. Results show that as the volumetric energy density (VED) increases, the inhomogeneity of grain morphology decreases, while the pore feature changes from the lack-of-fusion (LOF) pore perpendicular to the building direction to the bubble-shaped spherical pore, which is resulted from the collapse of the key-holes. In this case, the grain orientation and size, as well as the dislocation density in the vicinity of pores are influenced by the pore morphology due to different thermal history. On the whole, the combined morphology of dislocation and stress concentration affected by the pore morphology are the main reason of the increased level of anisotropy in tensile properties.

Synthesis and Characterization of Negative-Tone Photosensitive Polyimides with Low Coefficient of Thermal Expansion for Packaging Applications.

Negative-tone photosensitive polyimides (PSPIs) with a low coefficient of thermal expansion (CTE) were prepared by dissolving polyimide precursor-poly(amide ester) (PAE) resins, photoinitiators, photocrosslinkers and other additives in organic solvents. Using triamine as a monomer and dianhydride and diamine as polycondensates, tri-branched structure PAE resins with different molecular weights named PAE-1~5 were prepared. A series of corresponding PSPI films named PSPI-1~5 were prepared from PAE-1~5 resins with the same formulation, respectively. The PSPI-1~5 films prepared from resins of this structure have excellent mechanical, thermal and electrical properties after being thermally cured at 350 °C/2 h in nitrogen. The PSPI-1~5 films' coating solution also show good photolithographic performance and are able to obtain photolithographic patterns with a resolution of about 10 μm after homogenization, exposure and development. Among the PSPI-1~5 films, PSPI-2 has the most excellent lithographic properties with a weight average molecular weight (Mw) of 2.9 × 104 g/mol, a CTE of 41 ppk/°C, a glass transition temperature (Tg) of 343 °C and a 5% weight loss temperature (Td5) of 520 °C, making it suitable for industrial scale-up. The mechanical properties of elongation at breakage of 42.4%, tensile moduli of 3.4 GPa and tensile strength of 153.7 MPa were also measured.

Sintering Behavior and Thermal Properties of Cu-Graphite Materials by a Spark Plasma Sintering Method

The use of heat dissipation materials in various field such as power semiconductor device, LED and microelectronic system. Therefore, there is a need for heat dissipation materials using copper (Cu) and graphite (Gr). These materials have high thermal conductivity. In particular, graphite has high thermal stability with a low coefficient of thermal expansion. This study was conducted to enhance the thermal properties of Cu for use in heat dissipation materials, using a spark plasma sintering method. Cu-Gr powders were mixed by a shaking mixer and fabricated with volume fractions of 7:3, 6:4, 5:5, 4:6 and 3:7. The spark plasma sintering method is a uniaxial pressurization process, which can control the direction of Gr. The Cu-Gr powders were sintered at a temperature of 850 oC at a heating rate of 30 oC/min and a sintering pressure of 40MPa. Consequently, as the Gr contents were increased, the relative densities of the Cu-Gr composites decreased from 99.25 to 94.85%. Gr has high resistance to high-temperature deformation, which contributed to a decrease in shrinkage and relative density. The highest thermal conductivity was measured at 539.7 W/ m·K for a Cu-Gr volume ratio of 5:5. The thermal conductivity of the directionally controlled Gr was measured to be about 20-30 W/m·K higher than the uncontrolled sample. Furthermore, the TDP (Thermal distortion parameter), for which a lower value indicates better thermal stability, was systematically investigated.

Fabrication of matrix graphite with a high degree of graphitization for spherical fuel elements by using natural microcrystalline graphite fillers

Matrix graphite is used as a structural material, thermal conductor, moderator, and secondary fission product barrier for fuel elements in high-temperature gas-cooled reactors (HTRs). Due to its high graphitization degree and compressibility, natural flake graphite (NFG) is used as the main filler in traditional A3-3 matrix graphite, whereas artificial graphite (AG), with a lower graphitization degree than NFG, serves as an additive for toughness and gas permeability. Matrix graphite could be improved in terms of thermal conductivity, oxidation resistance, and irradiation performance by increasing the degree of graphitization. However, reports on the development of new matrix graphite formulations are scarce. In this study, MG-20 matrix graphite was prepared by mixing 60 wt% NFG, 20 wt% natural microcrystalline graphite (MG), and 20 wt% phenolic resin. Due to the high graphitization degree (higher than AG) and low coefficient of thermal expansion (CTE) of MG, MG-20 exhibited higher thermal conductivity (∼6%) and lower CTE (∼2.4%) than A3-3. Thus, MG-20 with higher graphitization degree and better thermal properties than A3-3 could improve the performance of HTR fuel elements in the future.

Highly efficient thermal conductivity of polyarylene ether nitrile composites via the introduction of hybrid fillers and tailored cross-linked structure

Polymer dielectrics with high thermal conductivity (λ) and excellent insulating properties are of interest in miniaturized and integrated electronic devices. However, most polymers are unable to fulfill this need due to their inherent structure. In this work, a polymer alloy with balanced thermal conductive and dielectric properties was successfully prepared by polyarylene ether nitrile(PEN), bisphthalonitrile-microsphere@boron nitride nanosheets(Bm@BNNS), and silicon carbide whisker (SiCws) at different scales. Specifically, introduction of Bm@BNNS fillers with core-shell structure into PEN resins results in heterogeneous interfaces, which effectively reduces the agglomeration and dosage of BNNS and synergistically improves the λ and dielectric performance. Besides, it has high breakdown strength (Eb) and high energy storage density (242.26 kV/mm, 1.66J/cm3) when filled with only 4.37 vol% BNNS compared to pure PEN. Furthermore, effects of one-dimensional SiCws at different scales on formation of heat-conduction pathways and electrical insulation properties of PEN/Bm@BNNS composites were investigated. The findings display that PEN/Bm@BNNS/SiCws composites with large size SiCws (7.81 vol%) achieved a high λ of 2.376 W/m.K, which was 135.24 % and 87.09 % higher than pure PEN and PEN/Bm@BNNS composites, respectively. Thus, the thermal conductive pathways are constructed by line-plate structure (SiCws-BNNS), and insulating performance primarily on the core-shell structure (Bm@BNNS). Besides, the novel PEN/Bm@BNNS/SiCws hybrid materials are together with a low coefficient of thermal expansion of 38–89 ppm/°C and high Tg of 220 °C. Thus, it gives a promising insight to achieve highly λ polymer-based insulating film materials used for high-temperature-resistant fields.

Development of Positive Tone-Type Photosensitive Materials Based on A Phenolic Resin with A Low Coefficient of Thermal Expansion

Development of Positive Tone-Type Photosensitive Materials Based on A Phenolic Resin with A Low Coefficient of Thermal Expansion

A Comparative Analysis of Low and High SiC Volume Fraction Additively Manufactured SiC/Ti6Al4V(ELI) Composites Based on the Best Process Parameters of Laser Power, Scanning Speed and Hatch Distance.

Silicon carbide (SiC) exhibits intriguing thermo-physical properties such as higher heat capacity and conductivity, as well as a lower density than Ti6Al4V(ELI). These properties make SiC a good candidate for the reinforcement of Ti6Al4V(ELI) with respect to its use as a heat shield in aero turbines to increase their efficiency. The traditional materials used in aircraft structures were required to have a combination of good mechanical properties such as strength, stiffness, and hardness and low weight, as well as low thermo-physical properties such as coefficient of thermal expansion (CTE) and thermal conductivity. The alloy Ti6Al4V(ELI) has a density of 4.45 g/cm3, which is lower than that of structural steel (7.4 g/cm3) and higher than that of aluminium (2.5 g/cm3). Lower density benefits light weighting. Aluminium is the lightest of the traditional materials used but has relatively low strength. The CTE of SiC of 4.6 × 10-6/K is lower than that of Ti6Al4V(ELI) of 8.6 × 10-6/K, while the density of SiC of 3.21 g/cm3 is lower than that of Ti6Al4V(ELI) of 4.45 g/cm3. Therefore, from the theory of composites, SiC/Ti6Al4V(ELI) composites are expected to have lower densities and CTEs than those of Ti6Al4V(ELI), thus providing for lightweighting and less thermal related buckling or separation at their joints with carbon/epoxy resin panels. The specific strength, stiffness, and Knoop hardness of SiC of 75-490 kNm/kg, 132 MNm/kg, and 600-3800 GPa, respectively, are generally larger than those of Ti6Al4V(ELI) of 211 KNm/kg, 24 MNm/kg, and 880 GPa, respectively. Therefore, investigating reinforcement of Ti6Al4V(ELI) with SiC particles is worthwhile as it will lead to the formation of composites that are stronger, stiffer, harder, and lighter, with lower values of CTE. For additive manufacturing, this requires initial studies to optimise the process parameters of laser power and scanning speed for single tracks. To print single tracks in the present work, different laser powers ranging from 100 W to 350 W and scanning speeds ranging from 0.3 m/s to 2.7 m/s were used for different SiC volume fraction values of values. To print single layers, different values of hatch distance were used together with the best values of laser power and scanning speed determined elsewhere by the authors for different volume fractions of SiC. Through optical microscopy, the built tracks and their cross sections were examined. By using laser power and scanning speeds of 200 W and 1.2 m/s, and 150 W and 0.8 m/s, respectively, the best tracks at 5% and 10% volume fractions were obtained, whereas the best tracks at 25% volume fraction were achieved using a laser power of 200 W and a scanning speed of 0.5 m/s. Furthermore, the results showed that the maximum SiC volume percentage of 30% resulted in limited or no penetration. Therefore, it is concluded from the study that parts with improved mechanical properties can be produced at SiC volume fractions ranging from 5% to 25%, while parts produced at the high volume fraction of 30% would have unacceptable mechanical qualities for the final part.

Low-κ, low CTE, high-temperature epoxy resin with high storage modulus based on spirobisindane for high-frequency electronic circuit field

High-temperature thermosetting resin with low dielectric constant (κ), low thermal expansion coefficient (CTE), and high modulus are drawing more and more attention from scientists and engineers in the field of the high-frequency circuit, 5G and 6G communication networks to improve the signal transmission speed. Epoxy resin, as one of the important thermosetting resin members, possesses excellent properties such as heat resistance, cohesiveness, and reactivity. However, Epoxy resin was usually mixed with different inorganic fillers to meet the above requirements, especially to decrease the κ and CTE. In this work, a new class of spirobisindane epoxy resin monomer (TSDEP) was synthesized by a classic two-step method based on 3,3,3′,3′-tetramethyl-1,1′-spirobisindane-6,6′-diol (TSD). Due to the highly distorted rigid structure of TSD, the movement of the TSDEP molecular segment is subject to more restrictions after being cured, and the free volume will increase. After cured by 4,4′-diamino diphenyl sulfone (DDS), the TSDEP/DDS resin exhibited many desirable physical properties, e.g., low dielectric constant (∼3.45, 1 MHz), low dielectric loss (∼0.025, 1 MHz), low coefficient of thermal expansion (CTE, 72 ppm/ °C, 35–150 °C), high glass transition temperature (Tg > 241 °C) and high thermal stability (Td5%∼400 °C). Furthermore, TSDEP/DDS exhibited excellent mechanical rigidity with a storage modulus of ∼ 3.1 GPa. Compared with TSDEP/DDS, 4-methylhexahydrophthalic anhydride (MHHPA) cured TSDEP system showed lower κ (∼3.09) and dielectric loss (0.015) due to weaker polar ester groups instead of more polar hydroxy groups.

Study on the microstructure and properties of a laser cladding Fe–Ni–Al coating based on the invar effect

The purpose of this study was to investigate the effect of Al content on Fe–Ni–Al coatings. A Fe–Ni–Al coating was prepared using a semiconductor laser, and the influence of the Al content on the microstructure and properties of the coating was examined. The microstructure of the coating was characterized using scanning electron microscopy, X-ray diffraction, and energy-dispersive X-ray spectroscopy. The coefficient of thermal expansion of the coating was measured using a static thermomechanical analyzer. The microhardness and wear performance of the coating were analyzed using a microhardness tester and a wear testing machine. The results were as follows. The addition of Al to the Fe–Ni ferroalloy powder resulted in the in situ formation of an AlNi/Fe–Ni laser cladding layer. When the Al content was low, the coating mainly consisted of γ-[Fe,Ni] austenite. As the Al content increased, the matrix phase structure of the cladding layer transformed into the α phase. Consequently, the Invar effect was gradually compromised, leading to the generation of defects in the coating. When the Al content was 4%, the coating performance improved while maintaining a low coefficient of thermal expansion. At this point, there were relatively few cracks in the cladding layer, and it exhibited the best wear resistance.

Two-step modification strategy enhances carbon fiber/old corrugated container fiber flexible conductive film

Carbon fiber (CF) possesses inherent properties of low density, high strength, and environmental stability. Its high aspect ratio and knittability enable the formation of flexible conductive networks. Old corrugated container (OCC) is rich in cellulose and hemicellulose, rendering them flexible and exhibiting a low coefficient of thermal expansion. In this paper, CF/OCC/PVA flexible conductive films were prepared using polyvinyl alcohol (PVA) as the matrix, CF as the conductive filler and OCC as the flexible support material. Firstly, the coupling agent was grafted on the surface of CF to enhance their surface activity, improve the dispersion of CF in solution and the chemical bonding of CF to the matrix. Subsequently, sizing nanoparticles were applied to increase the roughness of the CF surface. This served to increase the volume of the conductive network and enhance the mechanical interlocking between CF and PVA. The results show that the two-step combined modification strategy have a significant positive impact on the interfacial chemical activity, contact angle, and roughness of CF. Moreover, it leads to notable improvements in various properties of the conductive film materials. This finding is relevant for the preparation of CF reinforced other matrix materials as well as for expanding the special properties and application value of CF conductive thin film materials.

A simple method for the preparation of cordierite ceramics with high strength and low thermal expansion coefficient

AbstractCordierite ceramics have great application prospects due to their very low coefficient of thermal expansion. However, the low purity of ceramics leads to their unsatisfactory fracture strength, which has always been a research focus. Herein, by applying external pressure to the green body of mixed raw materials and optimizing the synthesis temperature, high‐purity cordierite powder was prepared, and then it was used as the starting material for the fabrication of high‐strength cordierite ceramics. The optimal sample exhibited a flexural strength of 146 MPa, which is about 1.4 times that of the cordierite ceramics reported in the literature. This is attributed to applied external pressure increasing the contact area of raw materials, leading to a more thorough reaction, and the content of the α‐cordierite phase is 98.4 wt% in the sample synthesized at 1275°C. Concurrently, the samples possessed a thermal expansion coefficient of only 1.9 × 10−6°C−1 (room temperature to 800°C). In addition, the increase in columnar crystal volume fraction is also one of the reasons for the high strength and low thermal expansion coefficient of cordierite ceramics.

Automated Foreign Object Detection for Carbon Fiber Laminates Using High-Resolution Ultrasound Testing.

Carbon fiber laminates have become popular in the manufacturing industry for their many desirable properties, like good vibration damping, high strength-to-weight ratio, toughness, high dimensional stability, and low coefficient of thermal expansion. During the manufacturing process, undesirable foreign objects, such as peel-ply strips, gloving material, and Kapton film, can be introduced into the part which can lead to a localized weakness. These manufacturing defects can function as stress concentration points and oftentimes cause a premature catastrophic failure. In this study, a method using high-resolution pulse-echo ultrasound testing is employed for the detection and quantification of the dimensions of foreign object debris (FOD) embedded within carbon fiber laminates. This research presents a method to create high-resolution C-scans using an out of immersion tank portable housing ultrasound scanning system, with similar capabilities to that of a full immersion system. From the full-waveform dataset, we extract the FOD depth and planar dimensions with an automatic edge detection technique. Results from several carbon fiber laminates are investigated with embedded foreign objects that are often considered undetectable. Results are presented for FOD identification for two different shapes: circles with diameters ranging from 7.62 mm to 12.7 mm, and 3-4-5 triangles with hypotenuses ranging from 7.6 mm to 12.7 mm. CT imaging is used to confirm proper FOD placement and that the FOD was not damaged or altered during manufacturing. Of importance for the ultrasound inspection results, in every single case studied, the FOD is detected, the layer depth is properly identified, and the typical error is less than 1.5 mm for the primary dimension.

Microstructure and properties of Cu/Si composites for electronic packaging: Effect of tungsten layer on silicon particles

Cu/Si composite are ideal electronic packaging materials, but the intense formation of Cu-Si intermetallics during preparation leads to a significant decrease in their plasticity and thermal conductivity. In this paper, a W layer was formed on Si particles using the sol-gel method, and Cu/Si composites were prepared by hot pressing. The results show that the maximum thickness of the W layer is 1.64 μm, and the minimum thickness is only 809 nm. The W layer acts as a diffusion barrier, effectively inhibiting the Cu-Si interfacial reaction and intermetallics formation, thus preventing the deterioration of matrix and reinforcement properties. Compared with the Cu/Si composite, the elongation of the Cu/Si@W composite improves from 0.2 % to 1.7 %, and the thermal conductivity increases by 7 times to 233.9 W/(m·K). Additionally, among the four samples, the Cu/Si@W composite has the lowest coefficient of thermal expansion (CTE). The W layer enhances the mechanical properties and thermal conductivity while reducing the CTE of Cu/Si composite for improved electronic packaging application.

Green-process preparation and characterizations of optically transparent, thermally stable and mechanically superior regenerated silk-hyaluronate composite films

High-performance regenerated silk-hyaluronate composite films prepared by an environment-friendly process were highly desirable for medical dressing base material. In this study, sericin was removed from silk by steam treatment without using any chemical reagent, and a low concentration solution of Na2CO3 was used as a green process to dissolve silk fibers. Then the obtained silk fibroin was physically blended with sodium hyaluronate to generate optically transparent, thermally stable and mechanically superior regenerated silk-hyaluronate films. The results of structural characterizations and property tests showed that the insoluble silk short fibers prepared by the dissolution of Na2CO3 were dominated by a β-sheet crystalline structure while the soluble silk fibroins by an amorphous structure. Moreover, both insoluble silk short fibers and soluble silk fibroins could form uniform composite films with a low coefficient of thermal expansion after being blended with sodium hyaluronate, which were named as insoluble silk film (ISH) and soluble silk film (SSH), respectively. The tensile strength of ISH could reach 138.8 MPa and SSH reached 153.9 MPa, which were 65.7 % and 30.5 % higher than that of the commercial control insoluble fibroin film (83.8 MPa) and commercial control soluble fibroin film (117.9 MPa), and 173.2 % and 203.0 % higher than that of pure hyaluronate film (50.8 MPa), respectively. Also, ISH and SSH had a modulus higher than 3 GPa. In this study, the low-concentration Na2CO3 method provides a simple and green technique for the preparation of high performance silk-hyaluronate composite materials.

Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation

Owing to its cost-effectiveness and low coefficient of thermal expansion (CTE), micron Si is incorporated into sintered Ag matrix to develop an Ag@Si composite sintering strategy. The Si integration helps reduce cost and alleviate CTE-mismatch of Ag-sintered die attachments. An innovative Ag@Si composite sintering structure is achieved by low-temperature and pressure-less sintering process, where a possibly slight diffusion of native SiO2 on the Si surface toward Ag is indicated by TEM observation, enabling the integration of Ag and Si into one continuous network. Owing to the robust well-bonded composite sintering, the Ag@Si joining strategy provides mechanical/microstructural reliability far beyond the pure Ag sinter joining, demonstrating significant prospects in high-temperature interconnection applications. During the harsh thermal cycling (−50–250 °C), the mitigating effect of the Si addition on CTE mismatch is manifested through the substantial suppression of microstructure deterioration in Ag@Si joint that occurs in pure-Ag-sintered joint, while the shear strength retention rate is doubled. Detailed investigation into the mechanism for elevated performance was conducted by material property and Missies stress analysis. The incorporation of Si helps modify the CTE, elastic properties, and stress distribution of Ag@Si-sintered material, synergistically contributing to the satisfactory joining reliability.

Tribological behavior of alumina (Al2O3) and zirconia (ZrO2) plungers used in high pressure pumps

Ceramic materials are commonly used in plungers due to high resistance to wear, abrasion, and low coefficient of thermal expansion. Also, they are commonly used in dry conditions without permanent damage, ceasing of pump head and better corrosion resistance than metals due to their inert characteristics. Zirconia (ZrO2) ceramic is used due to its high strength whereas, alumina (Al2O3) is commonly used in industries for high pressure pumps. The toughness of zirconia ceramics is higher than alumina ceramics as it overcomes the inherent brittleness of ceramic materials. It also has higher wear resistance and extends the life of the product. Whereas alumina has better mechanical characteristics such as hardness compared to Zirconia. In this research work tribological behavior of Alumina and Zirconia ceramics used in high pressure pumps have been studied. The wear test using end face wear testing apparatus has been conducted under flat contact for both alumina and ceramic material considering a mean contact pressure of 10 N, 20 N, 30 N and 40 N and sliding velocity of 40 mm/s. The wear test was conducted for 30 min considering a total sliding distance of 1500 m and 3000 m. The wear test results indicate that both alumina and ceramic exhibit lower wear factors and superior mechanical properties. The findings also reveal that the wear rates of Al2O3 and ZrO2 are influenced by friction forces, subsequently impacting the overall wear rate. Also, as the load increases the surface contact area also increases which in turn increases the wear rate. However, zirconia could be a potential substitute for alumina due to its high strength and fracture toughness.

Promoting nanoprecipitates via prefabricated defects to pin dislocations and grain boundaries for trading off high-strength and low-thermal-expansion of invar alloys

Invar alloys that combine high strength with a low coefficient of thermal expansion (CTE) are urgently required for industrial applications. Based on the lower coarsening rate during aging and the CTE values of carbonitrides, a novel strategy is proposed to prepare carbonitrides by reducing carbon and increasing nitrogen to design high-strength and low-thermal-expansion invar alloys. The V(C, N) nanoprecipitate was introduced into the invar alloy, and its effects on the microstructure, thermal expansion behavior, and mechanical properties were investigated. The direct-aged alloy exhibited an enhanced tensile strength of 525 MPa and a ductility of 47.6%. The cold-deformation aging alloy achieved an enhanced tensile strength of 815 MPa while retaining 7.4% ductility and a low CTE value of 1.23×10−6 /°C. The V(C, N) nanoprecipitates effectively immobilized dislocations and grain boundaries, leading to a high dislocation density and small grain size in the alloy. The contributions of each strengthening mechanism were calculated, and the precipitation and dislocation strengthening were found to be the main mechanisms of strength enhancement. These results provide a novel approach for preparing high-strength and low-CTE invar alloys.

Microstructure, Thermal and Mechanical Properties of AlN-MgO Composites Prepared by Spark Plasma Sintering

AlN-MgO composites with different compositions were prepared by spark plasma sintering, and the effects of their composition on their microstructure, thermal properties, and mechanical properties were systemically investigated. MgO compositions in the AlN-MgO composites were controlled from 20 to 80 wt%. The results indicated that a phase transition did not occur during the sintering process, and different solid solutions were formed within the MgO and AlN lattices. The AlN-MgO composites exhibited finer-grain microstructures than those of the sintered pure AlN and MgO samples. Transmission electron microscopy analysis showed that both oxygen-rich, low-density grain boundaries and clean boundaries with spinel phases were present in the composites. The sintered pure AlN sample exhibited the highest thermal conductivity (53.2 W/mK) and lowest coefficient of thermal expansion (4.47 × 10<sup>-6</sup> /K) at 100 °C. And, the sintered pure MgO sample exhibited moderate thermal conductivity (39.7 W/mK) and a high coefficient of thermal expansion (13.05 × 10<sup>-6</sup> /K). With increasing MgO contents in the AlN-MgO composites, however, the thermal conductivity of the AlN-MgO composites decreased, from 33.3 to 14.9 W/mK, while their coefficient of thermal expansion generally increased, from 6.49×10<sup>-6</sup> to 10.73×10<sup>-6</sup> /K with increasing MgO content. The composite with an MgO content of 60 wt% exhibited the best mechanical properties overall. Thus, the composition and microstructure of AlN-MgO composites have a determining effect on their thermal and mechanical properties.