Two-dimensional (2D) materials are currently recognized as key materials for device miniaturization due to their advantages such as perfect surface, high carrier mobility, and the ability to reduce short-channel effect. Despite significant progress in n-type two-dimensional semiconductor materials, van der Waals semiconductors with high hole mobility as the main carriers still face challenges. Tellurium layered material thin films have attracted widespread attention due to their low processing temperature and high hole mobility characteristics. Compared to other p-type 2D materials, tellurium layered material thin films offer superior uniformity and environmental durability. In this work, high-quality single-crystal p-type two-dimensional semiconductor tellurium layered material thin films were grown using low-temperature physical vapor deposition and pulsed laser annealing. This technique offers precise control over material thickness, minimal surface roughness, high uniformity, reduced defects, and improved hole carrier mobility. Electron backscatter diffraction (EBSD) analysis revealed that untreated tellurium layered material thin films had grain sizes of up to 3 micrometers. Following pulsed laser treatment, grain sizes increased to over 4 micrometers, with the main grain direction changing from (01-10) to (10-10). X-ray diffraction (XRD) results post-pulsed laser annealing showed higher peak intensities and smaller full width at half maximum (FWHM) compared to untreated and conventionally thermal annealed conditions, confirming significant enhancements in crystallinity and grain size. Additionally, minimal color change was observed in the tellurium layered material thin films after pulsed laser annealing from KAM spectra. Furthermore, significant crystallinity enhancement was also observed from high-resolution transmission electron microscopy (HRTEM) and Raman spectra. Figure 1
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