We have demonstrated a novel method of depositing ALD-Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> /PECVD-SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> bi-layer dielectric to passive the surface channels of the hydrogen-terminated diamond (H-diamond). After Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> /SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> passivation, the surface current increased with time and then tended to be saturated. Afterwards, it became much more stable and showed a larger current than an unpassivated counterpart. The H-diamond MOSFETs were fabricated by using this bi-layer passivation structure and an extremely low Ohmic contact resistance of 0.87 Ω·mm was obtained. The H-diamond RF MOSFET with gate length of 0.45 μm achieved a high current density of -549 mA/mm and an extrinsic fT/fmax of 15/36 GHz. By load-pull measurement, a high output power density of 1.04 W/mm was obtained at frequency of 2 GHz. The results reveal that it is a promising solution for high-stable and high-power diamond transistors by using the Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> /SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> bi-layer passivation.