Low Coefficient Of Thermal Expansion Research Articles

Influence of reinforcement with multimodal distribution on thermophysical properties and fracture behavior in Al-Si/SiC composites infiltrated under super-gravity field

Super-gravity field assisted infiltration is reported as an effective method to obtain the nearly fully-dense Al-Si/SiC composites at relatively lower temperature, which inhibit the interfacial reaction and result in the enhancement of thermal conductivity (TC) and bending strength (BS). Currently, SiC reinforcement with multimodal distribution was designed to further enhance the TC and BS with lower coefficient of thermal expansion (CTE) of Al-Si/SiC composites. For the composites with monomodal SiC distribution, enlarging the size of SiC results in an enhancement of TC with the sacrifice of BS. Interestingly, for the composites with multimodal SiC distribution, the TC can be stabilized within an extended range (175-187W/m·K at 373K) with reduced CTE and higher BS. When the large to small size ratio was 1:2, the optimal comprehensive properties (CTE: 8.66×10-6K-1 ranged from 323 to 373K, TC: 179.2W/m·K at 373K, BS: 309 ± 9MPa) can be obtained. Hasselman-Johnson, Turner, and Kerner models are established to better understand the thermophysical properties, while the fracture behavior is discussed based on the track of crack propagation.

High-frequency 5G substrate: Low dielectric biphenyl polyimide with low CTE and high thermal stability

Polyimide (PI) faces new challenges in meeting the requirements of low coefficient of thermal expansion (CTE), low dielectric content/loss, and high thermal stability to be utilized effectively as a substrate for flexible electronic materials. At present research, the CTE of PI films can be reduced to around 5 ppm/K, with Tg > 420 °C. However, it is difficult to balance low CTE and high Tg at the same time, and reducing dielectric performance is even more difficult. This study focused on synthesizing four types of PI films (using BPDA as the dianhydride) by employing biphenyl structure diamines (PDA, BZD, DPT, DMP) with an increasing number of benzene rings. The improvement in CTE, dielectric properties, and thermal stability was observed with an increase in the number of benzene rings and a decrease in the number of imine rings in the PI horizontal structure. The Tetraphenylene PI-DMP exhibited values of ε and tanθ as 3.31 and 4.73 ‰ respectively under 10 GHz. Additionally, the biphenyl PI films demonstrated commendable thermal stability (Tg = 442°C), outstanding mechanical properties (elastic modulus >10 GPa), and a low CTE (2 ppm/K within the temperature range of 50–300 °C, and close to the 3.6 ppm/K CTE of monocrystalline silicon). The low CTE, high thermal stability, and low dielectric properties that 5G flexible substrate materials need to be qualified are simultaneously reflected in this study. MS theoretical calculations were used to analyze the results. The excellent consistency with experimental results can promote the feasibility of MS theory in PI dielectric properties at high-frequency (10 Ghz). This innovative approach is anticipated to provide foldable chip fields with intrinsic biphenyl PI materials possessing low dielectric, low CTE, and high thermal stability.

Review of recent research on thermal management of diamond/metal composites

Diamond/metal composites have attracted much attention due to their excellent thermal conductivity (TC) and low coefficient of thermal expansion (CTE). This paper introduces two significant interface modification means which can improve interface bonding between diamond and metal. And the key factors affecting the TC of composite are analysed, making the thermal management of diamond/metal composites more efficient.

Research on the microstructure and properties of SiCp-SiO2/6061Al composites based on ball milling time

In this study, SiCp-SiO2/6061Al composites were synthesized by integrating SiC and SiO2 particulates into a 6061Al matrix, followed by ball milling and hot isostatic pressing sintering. The impact of ball milling duration on microstructure, mechanical properties, corrosion resistance, and thermal properties was evaluated. After 10h of ball milling, reinforcement particles were uniformly dispersed, achieving a material density of over 98%. Extending milling to 15h enhanced tensile strength to 253.53MPa and flexural strength to 433.56MPa, with a maximum elongation at break of 6.4%. Uniform SiO2 distribution improved corrosion resistance, evidenced by a self-corrosion potential of -1209 mV and a self-corrosion current density of 53.02µA·cm-2. After 20h, the lowest thermal expansion coefficient, 19.87×10-6·K-1, was achieved. However, agglomerated particles after 5h resulted in inferior thermal properties, including a thermal expansion coefficient of 20.45×10-6·K-1 and thermal conductivity of 94W·m-1·K-1. The optimal ball milling duration for these composites was determined to be 10h, balancing performance and cost-effectiveness.

Influence of varying matrix/fiber concentration on mechanical properties of bi-directional carbon fiber reinforced polymer composite

The polymer composites comprising bi-directional carbon fabric incorporated in the epoxy matrix have been developed for various advanced applications in the field of automobile and aerospace sectors. The distinct advantages of using epoxy material with hardener are good adhesion, high tensile, compression and bending strengths, good corrosion, and heat resistance properties. Using carbon fiber enhances the stiffness, reduces the weight, and improves the chemical resistance apart from possessing high thermal conductivity and low coefficient of thermal expansion. Considering all the above aspects, the present work proposes to investigate the mechanical properties of carbon-reinforced epoxy composites with fiber matrix ratios of 40:60, 50:50, and 60:40 by wt% as these particular combinations have been limitedly addressed so far. The well-known hand lay-up technique has produced the laminates and the test samples prepared from the laminate are subjected to tensile, flexural, hardness, and impact strength properties. Based on the experimental work of the composites made in the laboratory, the fiber matrix ratio of 60:40 has revealed the best attributes in terms of higher mechanical strengths compared to the composites with fiber matrix ratio of 40:60 and 50:50 and the data obtained have been substantiated using scanning electron microscope analysis.

A cost-effective way to utilize low-grade Ti-rich clay: Preparing cordierite-mullite composite ceramics for thermal storage

Cordierite-mullite composite ceramics were prepared by solid-state method using Panzhihua low-grade Ti-rich clay, talc, and alumina. Influences of cordierite/mullite ratio, sintering temperature, and the chemical composition of clay on the phase composition, microstructure, physical properties, and thermal properties were investigated in detail. The results showed that the impurity oxides inside the Ti-rich clay had a great ability of forming liquid. Above 1300 °C, the reaction between TiO2 of the clay and Al2O3 produced stable Al2TiO5, which was conducive to decreasing the coefficient of thermal expansion (CTE). At 1300–1350 °C, the secondary mullitization caused the volumetric expansion, decreasing the bending strength and increasing the CTE. The optimum ratio of cordierite to mullite ranged from 90:10 to 80:20, and the sample fired at 1400 °C exhibited the lowest water absorption and porosity (0.64 % and 1.56 %, respectively), optimal bulk density, and bending strength (2.59 g cm−3 and 87.79 MPa), as well as better CTE, thermal conductivity, and thermal storage density (2.91 × 10−6 °C−1, 4.11 W/(m⋅K) (30 °C), and 1181 kJ kg−1, respectively). Compared with the reported values of cordierite-based thermal storage ceramics prepared by using the high-grade clay or minerals, the obtained samples showed the advantages such as lower costs for raw materials, higher bending strength, higher thermal conductivity (1.63–2 times higher), low CTE, and high thermal storage density. This study demonstrated that the low-grade Ti/Fe-rich clay has excellent cost-effective potential for the preparation of thermal storage ceramics.

Spodumene glass-ceramics with low thermal expansion coefficient prepared using gold tailings

Spodumene glass-ceramics with low thermal expansion coefficient prepared using gold tailings

Poly(ester imide)s with Low Linear Coefficients of Thermal Expansion and Low Water Uptake (VIII): Structure-Flame Retardancy Relationship.

A series of ester-linked tetracarboxylic dianhydrides containing multiple para-phenylene units (TA-pPhs) was synthesized to obtain novel modified polyimides, namely poly(ester imide)s (PEsIs). The flame retardancy and film toughness of PEsIs tended to deteriorate with the structural extension of the repeating units (or monomers) via ester groups. To identify the structural factors necessary for achieving the highest flame retardancy rank (UL-94, V-0), we systematically investigated the structure-property relationships of a series of TA-pPh-based PEsIs. Among them, a PEsI derived from para-quaterphenylene-containing TA-pPh (TA-DPQP) and p-phenylenediamine (p-PDA) exhibited the best property combination, featuring an extremely high glass transition temperature (Tg), very low linear coefficient of thermal expansion (CTE), low water uptake (WA), ultralow linear coefficient of humidity (hygroscopic) expansion (CHE), unexpectedly high film toughness, and excellent flame retardancy (V-0 rank). Moreover, we examined the effects of substituents of TA-pPh and discussed the mode of action for the increased film toughness. This study also investigated the structure-property relationship for a series of PEsIs derived from isomeric naphthalene-containing tetracarboxylic dianhydrides. Some of the PEsIs obtained in this study, such as the TA-DPQP/p-PDA system, hold promise as novel high-temperature dielectric substrates for use in flexible printed circuits.

An experimental and numerical study on the evolution of pores and its effect on the tensile properties of LPBF Invar36 with different energy density

Laser powder bed fusion (LPBF) Invar 36 alloy has attracted plenty of attention in cryogenic components or precision instruments due to its low coefficient of thermal expansion in a wide range of temperature. However, the LPBF Invar 36 has a significant anisotropic mechanical property due to the unique columnar grain morphology and pore feature. In this study, the influence of scanning speed on the anisotropic tensile properties were investigated, and the melt pool dynamics were analyzed by the numerical simulation. In this respect, tensile tests of specimens parallel and perpendicular to the building direction with a scanning speed from 200 to 1400 mm/s of LPBF Invar 36 alloy were conducted, and the microstructural influential factors on the anisotropic tensile properties were analyzed. Results show that as the volumetric energy density (VED) increases, the inhomogeneity of grain morphology decreases, while the pore feature changes from the lack-of-fusion (LOF) pore perpendicular to the building direction to the bubble-shaped spherical pore, which is resulted from the collapse of the key-holes. In this case, the grain orientation and size, as well as the dislocation density in the vicinity of pores are influenced by the pore morphology due to different thermal history. On the whole, the combined morphology of dislocation and stress concentration affected by the pore morphology are the main reason of the increased level of anisotropy in tensile properties.

Discovery of a Ni-based superalloy with low thermal expansion via machine learning

Traditional Ni-based superalloys are widely used due to their excellent high-temperature performance; however, their high thermal expansion at elevated temperatures limits their further application in the modern aerospace industry. To discover Ni-based superalloys with low thermal expansion for high-temperature environments, such as 900 °C. In this study, we developed a Support Vector Regression (SVR) model with a high coefficient of determination (R2 = 0.84) to predict the coefficient of thermal expansion (CTE) in Ni-based superalloys. Ten samples were selected and produced from a pool of candidates generated via genetic algorithm and the SVR model, revealing that seven of them exhibited superior CTE performance. Notably, the discovered alloy with the lowest CTE (11.0 e-6 °C-1 from RT to 900 °C) presented a remarkable 16.7 % reduction compared to the best performance in existing database. The finally selected alloy demonstrated both low thermal expansion and superior mechanical properties compared to traditional superalloys with low thermal expansion.

Enhanced thermophysical and mechanical properties of gadolinium zirconate ceramics via non-stoichiometric design

Rare-earth zirconate ceramics are potential materials for thermal barrier coatings due to their low thermal conductivity and excellent structural stability. However, the low thermal expansion coefficient and fracture toughness limit their application and further improvements are needed. In this work, non-stoichiometric gadolinium zirconate ceramics with fluorite phase structure were successfully prepared using solid-state reaction method. HRTEM, iDPC-STEM, and in-situ XRD were employed to investigate nanostructure, lattice defects, and phase stability. The non-stoichiometric ratio introduces more defects and forms special nanostructures, enhancing the thermophysical properties of gadolinium zirconate ceramics. The non-stoichiometric gadolinium zirconate ceramics have lower phonon thermal conductivity with higher hardness and fracture toughness compared to stoichiometric ratio ceramics. In addition, the non-stoichiometric gadolinium zirconate ceramics exhibit excellent structural stability in a wide temperature range. These performances provide further applications for non-stoichiometric gadolinium zirconate ceramics as thermal barrier coatings.

Synthesis and Characterization of Negative-Tone Photosensitive Polyimides with Low Coefficient of Thermal Expansion for Packaging Applications.

Negative-tone photosensitive polyimides (PSPIs) with a low coefficient of thermal expansion (CTE) were prepared by dissolving polyimide precursor-poly(amide ester) (PAE) resins, photoinitiators, photocrosslinkers and other additives in organic solvents. Using triamine as a monomer and dianhydride and diamine as polycondensates, tri-branched structure PAE resins with different molecular weights named PAE-1~5 were prepared. A series of corresponding PSPI films named PSPI-1~5 were prepared from PAE-1~5 resins with the same formulation, respectively. The PSPI-1~5 films prepared from resins of this structure have excellent mechanical, thermal and electrical properties after being thermally cured at 350 °C/2 h in nitrogen. The PSPI-1~5 films' coating solution also show good photolithographic performance and are able to obtain photolithographic patterns with a resolution of about 10 μm after homogenization, exposure and development. Among the PSPI-1~5 films, PSPI-2 has the most excellent lithographic properties with a weight average molecular weight (Mw) of 2.9 × 104 g/mol, a CTE of 41 ppk/°C, a glass transition temperature (Tg) of 343 °C and a 5% weight loss temperature (Td5) of 520 °C, making it suitable for industrial scale-up. The mechanical properties of elongation at breakage of 42.4%, tensile moduli of 3.4 GPa and tensile strength of 153.7 MPa were also measured.

Sintering Behavior and Thermal Properties of Cu-Graphite Materials by a Spark Plasma Sintering Method

The use of heat dissipation materials in various field such as power semiconductor device, LED and microelectronic system. Therefore, there is a need for heat dissipation materials using copper (Cu) and graphite (Gr). These materials have high thermal conductivity. In particular, graphite has high thermal stability with a low coefficient of thermal expansion. This study was conducted to enhance the thermal properties of Cu for use in heat dissipation materials, using a spark plasma sintering method. Cu-Gr powders were mixed by a shaking mixer and fabricated with volume fractions of 7:3, 6:4, 5:5, 4:6 and 3:7. The spark plasma sintering method is a uniaxial pressurization process, which can control the direction of Gr. The Cu-Gr powders were sintered at a temperature of 850 oC at a heating rate of 30 oC/min and a sintering pressure of 40MPa. Consequently, as the Gr contents were increased, the relative densities of the Cu-Gr composites decreased from 99.25 to 94.85%. Gr has high resistance to high-temperature deformation, which contributed to a decrease in shrinkage and relative density. The highest thermal conductivity was measured at 539.7 W/ m·K for a Cu-Gr volume ratio of 5:5. The thermal conductivity of the directionally controlled Gr was measured to be about 20-30 W/m·K higher than the uncontrolled sample. Furthermore, the TDP (Thermal distortion parameter), for which a lower value indicates better thermal stability, was systematically investigated.

Fabrication of matrix graphite with a high degree of graphitization for spherical fuel elements by using natural microcrystalline graphite fillers

Matrix graphite is used as a structural material, thermal conductor, moderator, and secondary fission product barrier for fuel elements in high-temperature gas-cooled reactors (HTRs). Due to its high graphitization degree and compressibility, natural flake graphite (NFG) is used as the main filler in traditional A3-3 matrix graphite, whereas artificial graphite (AG), with a lower graphitization degree than NFG, serves as an additive for toughness and gas permeability. Matrix graphite could be improved in terms of thermal conductivity, oxidation resistance, and irradiation performance by increasing the degree of graphitization. However, reports on the development of new matrix graphite formulations are scarce. In this study, MG-20 matrix graphite was prepared by mixing 60 wt% NFG, 20 wt% natural microcrystalline graphite (MG), and 20 wt% phenolic resin. Due to the high graphitization degree (higher than AG) and low coefficient of thermal expansion (CTE) of MG, MG-20 exhibited higher thermal conductivity (∼6%) and lower CTE (∼2.4%) than A3-3. Thus, MG-20 with higher graphitization degree and better thermal properties than A3-3 could improve the performance of HTR fuel elements in the future.

Highly efficient thermal conductivity of polyarylene ether nitrile composites via the introduction of hybrid fillers and tailored cross-linked structure

Polymer dielectrics with high thermal conductivity (λ) and excellent insulating properties are of interest in miniaturized and integrated electronic devices. However, most polymers are unable to fulfill this need due to their inherent structure. In this work, a polymer alloy with balanced thermal conductive and dielectric properties was successfully prepared by polyarylene ether nitrile(PEN), bisphthalonitrile-microsphere@boron nitride nanosheets(Bm@BNNS), and silicon carbide whisker (SiCws) at different scales. Specifically, introduction of Bm@BNNS fillers with core-shell structure into PEN resins results in heterogeneous interfaces, which effectively reduces the agglomeration and dosage of BNNS and synergistically improves the λ and dielectric performance. Besides, it has high breakdown strength (Eb) and high energy storage density (242.26 kV/mm, 1.66J/cm3) when filled with only 4.37 vol% BNNS compared to pure PEN. Furthermore, effects of one-dimensional SiCws at different scales on formation of heat-conduction pathways and electrical insulation properties of PEN/Bm@BNNS composites were investigated. The findings display that PEN/Bm@BNNS/SiCws composites with large size SiCws (7.81 vol%) achieved a high λ of 2.376 W/m.K, which was 135.24 % and 87.09 % higher than pure PEN and PEN/Bm@BNNS composites, respectively. Thus, the thermal conductive pathways are constructed by line-plate structure (SiCws-BNNS), and insulating performance primarily on the core-shell structure (Bm@BNNS). Besides, the novel PEN/Bm@BNNS/SiCws hybrid materials are together with a low coefficient of thermal expansion of 38–89 ppm/°C and high Tg of 220 °C. Thus, it gives a promising insight to achieve highly λ polymer-based insulating film materials used for high-temperature-resistant fields.

Development of Positive Tone-Type Photosensitive Materials Based on A Phenolic Resin with A Low Coefficient of Thermal Expansion

Development of Positive Tone-Type Photosensitive Materials Based on A Phenolic Resin with A Low Coefficient of Thermal Expansion

A Comparative Analysis of Low and High SiC Volume Fraction Additively Manufactured SiC/Ti6Al4V(ELI) Composites Based on the Best Process Parameters of Laser Power, Scanning Speed and Hatch Distance.

Silicon carbide (SiC) exhibits intriguing thermo-physical properties such as higher heat capacity and conductivity, as well as a lower density than Ti6Al4V(ELI). These properties make SiC a good candidate for the reinforcement of Ti6Al4V(ELI) with respect to its use as a heat shield in aero turbines to increase their efficiency. The traditional materials used in aircraft structures were required to have a combination of good mechanical properties such as strength, stiffness, and hardness and low weight, as well as low thermo-physical properties such as coefficient of thermal expansion (CTE) and thermal conductivity. The alloy Ti6Al4V(ELI) has a density of 4.45 g/cm3, which is lower than that of structural steel (7.4 g/cm3) and higher than that of aluminium (2.5 g/cm3). Lower density benefits light weighting. Aluminium is the lightest of the traditional materials used but has relatively low strength. The CTE of SiC of 4.6 × 10-6/K is lower than that of Ti6Al4V(ELI) of 8.6 × 10-6/K, while the density of SiC of 3.21 g/cm3 is lower than that of Ti6Al4V(ELI) of 4.45 g/cm3. Therefore, from the theory of composites, SiC/Ti6Al4V(ELI) composites are expected to have lower densities and CTEs than those of Ti6Al4V(ELI), thus providing for lightweighting and less thermal related buckling or separation at their joints with carbon/epoxy resin panels. The specific strength, stiffness, and Knoop hardness of SiC of 75-490 kNm/kg, 132 MNm/kg, and 600-3800 GPa, respectively, are generally larger than those of Ti6Al4V(ELI) of 211 KNm/kg, 24 MNm/kg, and 880 GPa, respectively. Therefore, investigating reinforcement of Ti6Al4V(ELI) with SiC particles is worthwhile as it will lead to the formation of composites that are stronger, stiffer, harder, and lighter, with lower values of CTE. For additive manufacturing, this requires initial studies to optimise the process parameters of laser power and scanning speed for single tracks. To print single tracks in the present work, different laser powers ranging from 100 W to 350 W and scanning speeds ranging from 0.3 m/s to 2.7 m/s were used for different SiC volume fraction values of values. To print single layers, different values of hatch distance were used together with the best values of laser power and scanning speed determined elsewhere by the authors for different volume fractions of SiC. Through optical microscopy, the built tracks and their cross sections were examined. By using laser power and scanning speeds of 200 W and 1.2 m/s, and 150 W and 0.8 m/s, respectively, the best tracks at 5% and 10% volume fractions were obtained, whereas the best tracks at 25% volume fraction were achieved using a laser power of 200 W and a scanning speed of 0.5 m/s. Furthermore, the results showed that the maximum SiC volume percentage of 30% resulted in limited or no penetration. Therefore, it is concluded from the study that parts with improved mechanical properties can be produced at SiC volume fractions ranging from 5% to 25%, while parts produced at the high volume fraction of 30% would have unacceptable mechanical qualities for the final part.

Low-κ, low CTE, high-temperature epoxy resin with high storage modulus based on spirobisindane for high-frequency electronic circuit field

High-temperature thermosetting resin with low dielectric constant (κ), low thermal expansion coefficient (CTE), and high modulus are drawing more and more attention from scientists and engineers in the field of the high-frequency circuit, 5G and 6G communication networks to improve the signal transmission speed. Epoxy resin, as one of the important thermosetting resin members, possesses excellent properties such as heat resistance, cohesiveness, and reactivity. However, Epoxy resin was usually mixed with different inorganic fillers to meet the above requirements, especially to decrease the κ and CTE. In this work, a new class of spirobisindane epoxy resin monomer (TSDEP) was synthesized by a classic two-step method based on 3,3,3′,3′-tetramethyl-1,1′-spirobisindane-6,6′-diol (TSD). Due to the highly distorted rigid structure of TSD, the movement of the TSDEP molecular segment is subject to more restrictions after being cured, and the free volume will increase. After cured by 4,4′-diamino diphenyl sulfone (DDS), the TSDEP/DDS resin exhibited many desirable physical properties, e.g., low dielectric constant (∼3.45, 1 MHz), low dielectric loss (∼0.025, 1 MHz), low coefficient of thermal expansion (CTE, 72 ppm/ °C, 35–150 °C), high glass transition temperature (Tg > 241 °C) and high thermal stability (Td5%∼400 °C). Furthermore, TSDEP/DDS exhibited excellent mechanical rigidity with a storage modulus of ∼ 3.1 GPa. Compared with TSDEP/DDS, 4-methylhexahydrophthalic anhydride (MHHPA) cured TSDEP system showed lower κ (∼3.09) and dielectric loss (0.015) due to weaker polar ester groups instead of more polar hydroxy groups.

Study on the microstructure and properties of a laser cladding Fe–Ni–Al coating based on the invar effect

The purpose of this study was to investigate the effect of Al content on Fe–Ni–Al coatings. A Fe–Ni–Al coating was prepared using a semiconductor laser, and the influence of the Al content on the microstructure and properties of the coating was examined. The microstructure of the coating was characterized using scanning electron microscopy, X-ray diffraction, and energy-dispersive X-ray spectroscopy. The coefficient of thermal expansion of the coating was measured using a static thermomechanical analyzer. The microhardness and wear performance of the coating were analyzed using a microhardness tester and a wear testing machine. The results were as follows. The addition of Al to the Fe–Ni ferroalloy powder resulted in the in situ formation of an AlNi/Fe–Ni laser cladding layer. When the Al content was low, the coating mainly consisted of γ-[Fe,Ni] austenite. As the Al content increased, the matrix phase structure of the cladding layer transformed into the α phase. Consequently, the Invar effect was gradually compromised, leading to the generation of defects in the coating. When the Al content was 4%, the coating performance improved while maintaining a low coefficient of thermal expansion. At this point, there were relatively few cracks in the cladding layer, and it exhibited the best wear resistance.

Two-step modification strategy enhances carbon fiber/old corrugated container fiber flexible conductive film

Carbon fiber (CF) possesses inherent properties of low density, high strength, and environmental stability. Its high aspect ratio and knittability enable the formation of flexible conductive networks. Old corrugated container (OCC) is rich in cellulose and hemicellulose, rendering them flexible and exhibiting a low coefficient of thermal expansion. In this paper, CF/OCC/PVA flexible conductive films were prepared using polyvinyl alcohol (PVA) as the matrix, CF as the conductive filler and OCC as the flexible support material. Firstly, the coupling agent was grafted on the surface of CF to enhance their surface activity, improve the dispersion of CF in solution and the chemical bonding of CF to the matrix. Subsequently, sizing nanoparticles were applied to increase the roughness of the CF surface. This served to increase the volume of the conductive network and enhance the mechanical interlocking between CF and PVA. The results show that the two-step combined modification strategy have a significant positive impact on the interfacial chemical activity, contact angle, and roughness of CF. Moreover, it leads to notable improvements in various properties of the conductive film materials. This finding is relevant for the preparation of CF reinforced other matrix materials as well as for expanding the special properties and application value of CF conductive thin film materials.