Low contact resistances are required to continue the miniaturization of CMOS devices and improve the performances of group IV semiconductors’ photodiodes and light emitting devices. In this study, we tried to enhance the electrical activation in in-situ boron-doped germanium by nanosecond laser annealing (NLA), an ultrafast, non-equilibrium process. Similar annealing regimes than that evidenced on SiGe thin layers were seen. Surface structures with shapes and orientations comparable to that after SiGe NLA were found in the surface melt regime. When the entire Ge:B layer was melted, we obtained a flat surface with a root mean square roughness of 1.51 nm. Laser annealing resulted in a redistribution of B, with the formation of electrically inactive clusters that did not contribute to strain. Accordingly, the sheet resistance increased by 70%, from 39.82 Ω/□ up to 68.62 Ω/□, when the layer was melted. This corresponded to an electrically active carrier loss of around 50%, from 8.1x1020 cm-3 down to 3.8x1020cm-3. Even multiple pulses with various energy densities at the same position were not able to improve electrical activation. However, there was some slight improvements of the sheet resistance in the sub melt regime, which needs to be confirmed in future experiments.