The development of nondestructive second-breakdown measuring techniques and equipment is described. Such apparatus is essential to the analysis of the "safe area of operation" of transistors for device development and particular circuit application. The present techniques for detecting second breakdown in both the forward-biased and the reverse-biased mode are discussed. When a transistor is operated in the forward-biased mode, hot spots may develop which produce second breakdown if temperature extremes are reached before this condition is recognized. With existing detection methods, the device may already have been damaged before this condition is recognized. Techniques for electronic detection of hot spots before such degradation occurs are illustrated and compared to phosphorus ultraviolet hot spot measurements. When these new detection techniques are used, transistors can be characterized for forward-biased "safe area of operation" for applications such as audio output stages, series regulators, and class AB linear RF power amplifiers. Another form of second breakdown occurs under reverse-biased conditions, when the transistor is in primary breakdown. Because of the small areas involved, second breakdown occurs much more rapidly in this mode than under forward-biased conditions. An accompanying oscillation in the control electrode has proved to be a reliable detection mechanism. This work was performed primarily on multiple-diffused power transistors, in which reverse-biased second breakdown is a major concern. Because a "safe area of operation" in the reverse-biased mode can be established by this test, reliable circuits can be designed for such applications as high-speed inverters, solenoid drivers, servo controls, and UHF class C power amplifiers. Life-test results have proven this test procedure to be a dependable and consistent method for establishing a "safe area of operation" for transistors. Illustrations of the new RCA second-breakdown equipment based on the research described are presented.