Advances in emerging technology of microelectromechanical systems, aka microsystems, are one of the most challenging tasks in today’s experimental mechanics. More specifically, development of these miniature devices requires sophisticated design, analysis, fabrication, testing, and characterization tools that have multiphysics and multiscale capabilities, especially as microsystems are being developed for use at harsh conditions. In harsh-environment and high-performance (military) guidance applications inertial sensors must be sensitive to low rates of rotation yet survive the high blast loads associated with the initial launch. In this multi-year study a set of tuning fork gyroscopes were subjected to a series of increasing g-loads (culminating at approximately 60,000 g’s) with measurements of shape made after each test. A custom set of test sample packages (aka articles) were hermetically sealed with glass lids to allow optical inspection of components while preserving the operating environment. Initial test measurements were made upon fabrication of the articles. Optical and interferometric measurements have been made prior to and after each shock g-loading. The shape of the tuning fork gyroscope test articles was measured using optoelectronic laser interferometric microscope methodology. Full field shape was determined and traces of pertinent structures were extracted for comparison. Failure of the die was observed in the form of fractures below the chip surface as well as fractures in the glass lid sealing the package. Potential causes of the failure are discussed as well as a recommendation for modified packaging techniques to mitigate future component failures.