SOI junctionless (JL) FinFETs are well-suited for future wireless communication systems; however, they suffer from the self-heating effect (SHE), which diminishes performance at higher temperatures. We proposed a novel structure called p-layer JL-FinFET (pL-JL-FinFET) to improve high-frequency performance at high temperatures. The Ge p-layer beneath the Silicon Fin increases electron current density and enhances device performance. Two high thermal conductivity 4H-SiC boxes are placed below the source and drain regions to overcome SHE. The pL-JL-FinFET exhibits the maximum transconductance of 148 μS, unity gain cut-off frequency of 455 GHz, and maximum available gain of 28.6 dB, which are improved by 208 %, 26 %, and 35 %, respectively, compared to regular JL-FinFET. Temperature analysis demonstrates suppressed SHE and better thermal stability than the regular JL-FinFET. Also, the pL-JL-FinFET shows superior thermal behavior in different fin shapes. The pL-JL-FinFET with a rectangular fin shape shows excellent linearity and high-frequency performance, achieving unconditional stability and minimum noise figure (NFmin) of less than 1 dB. An extracted small signal model is used to design a K-band low noise amplifier (LNA) with maximum NF and gain values of 0.75 dB and 18.7 dB. The pL-JL-FinFET opens opportunities for reliable, high-performance RF circuits while effectively managing thermal behavior.
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