Integration Of Electronic Systems Research Articles

China’s ICT Industry: Catch-Up Trends, Challenges and Policy Implications

This article provides a review of China’s information and communications industry by studying the following three segments: the integrated circuit and related electronic components, equipment and network systems and devices and applications for end users. A review of successful cases sheds light on the trends, challenges and policy implications. The four policies proposed by the authors are: promote local firms to be global technology leaders by constructing new standards in new paradigms, extend the edge enjoyed by the communications equipment segment to the integrated circuit and related components and devices segment via promoting the Internet of Things based on sensor network, encourage local governments to participate in the commercialisation of emerging technologies by establishing regional industry parks/bases and deregulate end users’ devices and internet applications to encourage various actors to participate in innovation.

Challenges of Adhesion Promotion for the Metallization of Glass Interposers

Ultra-miniaturization and 3D integration of electronic systems require interposers with a very high density of off-chip interconnections. Silicon and glass interposers are being developed widely to meet these needs. Through hole via formation or Through Package Via (TPV) in combination with the ability to handle of thin glass materials have already been demonstrated in combination with “polymer on glass” technologies at Georgia Tech Packaging Research Center and by industrial partners. However there is an increasing industry demand to plate electroless copper directly onto smooth glass substrates which is extremely challenging. This is being driven by the desire to be able to benefit from the ability to utilize existing infrastructure and therefore fully benefit from the cost advantages wet-chemical metallization can offer in the manufacturing of glass interposers. It is therefore worthwhile to investigate replacing adhesion promoting techniques such as sputtered metal seed layers or laminated polymer films with a pure wet chemistry alternative. In this study a modified sol gel processes were developed for the formation of metal oxide layers on the glass substrate. The impact of the sol composition on the resulting oxide's surface structure was examined. Centrifugal adhesion measurement allowed quantification of the mechanical anchoring provided by metal oxide layers prepared from different sol gel compositions. With regards to the interposer manufacturing process, the two possibilities of applying the sol gel coating prior to as well as after TPV formation are compared and their respective advantages are discussed.

Special Issue Dedicated to Professor Avi Bar-Cohen in Celebration of His 65th Birthday

We are delighted to dedicate this special issue to celebrate the 65th birthday of Professor Avi Bar-Cohen. Dr. Avram Bar-Cohen is an internationally recognized leader in thermal science and technology, an Honorary member of ASME, and Fellow of IEEE, as well as Distinguished University Professor in the Department of Mechanical Engineering at the University of Maryland. His publications, lectures, short courses, and research outcomes, as well as professional service in ASME and IEEE, have helped to create the scientific foundation for the thermal management of electronic components and systems and pioneered techniques for energy-efficient sustainable design of manufactured products. His current research focuses on two-phase microgap and microchannel coolers for high heat flux electronic components, on-chip thermoelectrics for hot spot remediation, thermal control of power amplifiers and photonics, and polymer-fiber composite heat exchangers. Bar-Cohen was the general chair for the 2010 International Heat Transfer Conference in Washington DC and is the President of the Assembly of International Heat Transfer Conferences. From 2001 to 2010, he served as the Chair of Mechanical Engineering at Maryland and is currently on assignment as a Program Manager in the Microsystem Technology Office at the Defense Advanced Projects Agency in Virginia.In addition to Honorary membership in ASME, Bar-Cohen’s honors include the Luikov Medal from the International Center for Heat and Mass Transfer in Turkey (2008), ASME’s Heat Transfer Memorial Award (1999), Curriculum Innovation Award (1999), Edwin F. Church Medal (1994) and Worcester Reed Warner Medal (2000), and the Electronic and Electrical Packaging Division’s Outstanding Contribution Award (1994) as well as the InterPack Achievement Award (2007). Bar-Cohen was the founding chair of the IEEE Intersociety Conference on Thermal Management in Electronic Equipment (ITHERM) in 1988 and was recognized with the IEEE CPMT Society’s Outstanding Sustained Technical Contributions Award (2002), the ASME/IEEE ITHERM Achievement Award (1998), and the THERMI Award from the IEEE/Semi-Therm Conference (1997).Bar-Cohen has co-authored Design and Analysis of Heat Sinks (Wiley, 1995) and Thermal Analysis and Control of Electronic Equipment (McGraw-Hill, 1983), and has co-edited 16 books in this field. He has authored/co-authored over 400 journal papers, refereed proceedings papers, and chapters in books; has delivered 70 keynote, plenary and invited lectures at major technical conferences and institutions, and he holds eight U.S. and three Japanese patents. He has advised to completion 64 Master’s and Ph.D. students at the University of Maryland, the University of Minnesota, and the Ben Gurion University (Beer Sheva, Israel), where he began his academic career in 1972. From 1998 to 2001, he directed the University of Minnesota Center for the Development of Technological Leadership and held the Sweatt Chair in Technological Leadership.Avram Bar-Cohen began his professional career at the Raytheon Company in Massachusetts in 1968 and for the past 44 years has been involved in the design, analysis, and optimization of thermal systems, with emphasis on the thermal packaging of electronic equipment. He has lectured widely, published extensively in the archival heat transfer and packaging literature, and taught many short courses on this subject, at universities and major conferences in the United States and abroad. He served as General Manager and Executive Consultant for packaging and physical modeling at Control Data Corporation, 1984–1989, held a succession of academic appointments, from Lecturer to Professor, in the Department of Mechanical Engineering at the Ben Gurion University of the Negev (Israel), 1973–1988, and was on the faculty at the Massachusetts Institute of Technology, 1977–1978, and the Naval Postgraduate School, 1982.Many of Professor Bar Cohen’s students are currently in leadership positions around the nation and around the globe. Some of them are authors of the papers included in this issue covering a wide range of topics related to electronic systems integration and packaging. The topics are very broad ranging, and cover issues from the device level up to the data center level. The technology issues include topics related to mechanical and thermo mechanical stresses at the device level, thermal interface materials using carbon nano-tubes and other materials, thermal and mechanical issues that arise in through silicon vias in chip stacks, thermo electric cooling at the module level and optimization of enclosed aisle Data Centers using bypass recirculation among many others. This broad range of topics as well as the outstanding nature of the research and publications is a direct measure of the impact that Professor Bar-Cohen has had and continues to have on research and development in the field of electronic systems integration and packaging.We are truly delighted to dedicate this special issue to Avi, on behalf of the electronics packaging community, as a thank you for all of his current and future contributions to the community.

Research of E-Government System Architecture Based on SOA-ESB

The current E-government system faced the problem of system heterogeneous and government information scattered. The traditional E-government system architecture can’t properly solve the problem of information islands because of its slow response, not easy to expand. This paper put forward system architecture based on SOA-ESB, and analyzed its principle. SOA (Service-Oriented Architecture) changed function into service, then the ESB (Enterprise Service Bus) provide the intelligent management and integrated to service, at the last, realize the electronic government affairs system integration and information sharing. The structure has characteristics of loose coupling, scalability and maintainability.

Characterization of Interconnects and RF Components on Glass Interposers

As a result of their myriad of advantages over silicon and other conventional substrate technologies, glass substrates have received significant attention from the electronic packaging and system integration community worldwide. So far, most of the research effort on glass has concentrated on developing methods for fabricating cylindrical through glass vias (TGVs). However, to fully evaluate the potential of glass as an interposer material for microelectronic systems with computing and communication functions, an extensive characterization of interconnects and RF components on these substrates must be carried out. In this contribution, we go beyond state-of-the-art research and present an in-depth characterization of TGVs, coplanar lines and 60 GHz coplanar excited patch antennas on two glass substrates. One of these substrates has a low alkaline content (Borofloat33®) and the other is alkaline-free (AF32®). The effects of these glass materials on the RF performance of TGVs, coplanar lines and 60 GHz antennas are extensively studied, and recommendations for performance optimization are proposed. For experimental verification, test samples are fabricated and measured. Very good correlation is obtained between the measurement and simulation results from 100 MHz to 100 GHz.

Micromachined High Density Embedded Capacitor Technologies for Silicon Interposers

We describe our work on micromachined, large surface area, thin and high-density capacitor technologies targeted at the growing interest and applications for embedded passive devices in thin silicon interposers. As integrated circuit I/O number, speed and density increase, chip current requirements grow and margins shrink leading to the requirement of large, distributed decoupling capacitance as close to the load as possible. The simple fabrication methods used to form our embedded capacitors can be used to alleviate the increasing demand for low impedance power distribution networks in high-density integrated electronic systems while maintaining required signal integrity through the interposer. We have investigated silicon dioxide-based capacitors of varying oxide thickness, with and without integrated parallel metal Schottky barrier capacitors or pn junction capacitors. These device structures have been fabricated using standard MEMS processing techniques such as DRIE and thermal oxidation to enhance the available surface area and increase capacitance per chip foot-print. We have characterized the performance of the various capacitor structures using both time and frequency response measurements. Time response measurements are performed using a capacitive charge and discharge ringdown test. High frequency (> 1GHz) performance characterization and modeling of these devices has also been performed. In general, measurement results correlate with simulation. We will describe the challenges associated with fabricating, testing and integrating these passive devices. On-going measurement and simulation work that will be reported includes modification of device structures to evaluate the range of achievable capacitance density, minimize leakage current, minimize effective series inductance / resistance, and achieve thinned capacitor structures integrated into our Si interposer technology that incorporates electroplated through-Si vias (TSVs) of varying sizes and densities. The results of these efforts will be presented.

Nanobonding Technology Toward Electronic, Fluidic, and Photonic Systems Integration

In this paper, a review of surface-activation-based nanobonding technology for packaging and integration is presented. In this paper, the focus will be on nanobonding technology for electronic, photonic, and fluidic devices for miniaturized biomedical and environmental-sensing systems. We describe four different nanobonding techniques that have been developed and successfully implemented in a wide range of materials that include metals, semiconductors, flexible laminations, and ionic materials. Nanobonding technologies are particularly attractive because they offer void-free, strong, and nanoscale bonding at room temperature or at low temperature (<;200°C), and without the need for chemicals, adhesives, and high external pressure. Therefore, there are significant potential and opportunities for nanobonding technologies in the development of low cost, low loss, and high-speed miniaturized emerging systems based on a combination of electronic, fluidic, and photonic devices.

Decision Trees – A Perspective Of Electronic Decisional Support

Without substitute decision-maker, decision support system, through their components, can facilitate the work of decision-maker by provid ing useful clues to solving problems and identifying opportunities. Choosing an optimal solution in case of complex dec ision making processes, with a degree of uncertainty, involving a series of interdependent decisions, performed in several periods of time, can be achieved using deci sion trees. Suggestive and simple properties propel decision trees among the tools with a high d egree of adoption and integration in electronic decisional systems.

1278 Impact of Integration of Who Electronic Growth Charts Into Emr System of a Pediatric Primary Care Department

1278 Impact of Integration of Who Electronic Growth Charts Into Emr System of a Pediatric Primary Care Department

Actor-Network Theory and its role in understanding the implementation of information technology developments in healthcare

BackgroundActor-Network Theory (ANT) is an increasingly influential, but still deeply contested, approach to understand humans and their interactions with inanimate objects. We argue that health services research, and in particular evaluations of complex IT systems in health service organisations, may benefit from being informed by Actor-Network Theory perspectives.DiscussionDespite some limitations, an Actor-Network Theory-based approach is conceptually useful in helping to appreciate the complexity of reality (including the complexity of organisations) and the active role of technology in this context. This can prove helpful in understanding how social effects are generated as a result of associations between different actors in a network. Of central importance in this respect is that Actor-Network Theory provides a lens through which to view the role of technology in shaping social processes. Attention to this shaping role can contribute to a more holistic appreciation of the complexity of technology introduction in healthcare settings. It can also prove practically useful in providing a theoretically informed approach to sampling (by drawing on informants that are related to the technology in question) and analysis (by providing a conceptual tool and vocabulary that can form the basis for interpretations). We draw on existing empirical work in this area and our ongoing work investigating the integration of electronic health record systems introduced as part of England's National Programme for Information Technology to illustrate salient points.SummaryActor-Network Theory needs to be used pragmatically with an appreciation of its shortcomings. Our experiences suggest it can be helpful in investigating technology implementations in healthcare settings.

Centre for Integrated Electronic Systems and Biomedical Engineering – CEBE

Centre for Integrated Electronic Systems and Biomedical Engineering – CEBE

A Flexible Converter With Two Selectable Topologies

In order to satisfy the requirement of wide adaptability for standard power modules in the scheme of power electronics system integration, a novel conception of flexible converter is proposed. Next, a practical case of flexible converter with two selectable topologies based on LLC resonant converter with frequency modulation is also proposed. This converter can operate under two various topologies to satisfy various applications only by altering the connecting mode of the output pins. This converter is suitable for two applications of V/I output and 2V/(I/2) output and the voltage stresses and current stresses of all main components are peer to peer under these two applications. The design considerations of small-signal, electromagnetic compatibility, and layout for the flexible converter are also discussed. A prototype with selectable output of 110 V/10 A and 220 V/5 A is built to verify the aforementioned analysis and the highest efficiency is above 96%.

Compact design for high precision machine tools

Due to raising functional integration in micro fluidic, micro mechanic, micro electronic and micro optical systems the trend to scaling down the work piece sizes while increasing its complexity requires high precise machine accuracy. With respect to the process and geometrical parameters, most of the finishing manufacturing processes can be covered by milling and grinding operations with three or five machine axes. But whereas the available machine tools hardly achieve the required process dynamic and accuracy in all degrees of freedom, the requirements still increase. For this reason the Fraunhofer IPT has developed high precise machine tools following a compact design strategy by reducing the overall machine dimensions as far as conventional machine components such as measuring or drive systems were available. The developments of two compact machine tools exemplify the dynamic and accuracy enhancement by compact design and are described in the following.

Two-Dimensional and Three-Dimensional Integration of Heterogeneous Electronic Systems Under Cost, Performance, and Technological Constraints

Present day market demand for high-performance high-density portable hand-held applications has shifted the focus from 2-D planar system-on-a-chip-type single-chip solutions to alternatives such as tiled silicon and single-level embedded modules as well as 3-D die stacks. Among the various choices, finding an optimal solution for system implementation deals usually with cost, performance, power, thermal, and technological tradeoff analyses at the system conceptual level. It has been estimated that decisions made in the first 20% of the design cycle influence up to 80% of the final product cost. In this paper, we discuss realistic metrics appropriate for performance and cost tradeoff analyses both at the system conceptual level in the early stages of the design cycle and in the implementation phase, for verification. In order to validate the proposed metrics and methodology, two ubiquitous electronic systems are analyzed under various implementation schemes and the performance tradeoffs discussed. This case study is used to highlight the importance of a cost and performance tradeoff analysis early in the design flow.

Lifetime modelling for microsystems integration: from nano to systems

Due to the rapid development of IC technology the traditional packaging concepts are making a transition into more complex system integration techniques in order to enable the constantly increasing demand for more functionality, performance, miniaturisation and lower cost. These new packaging concepts (as e.g. system in package, 3D integration, MEMS-devices) will have to combine smaller structures and layers made of new materials with even higher reliability. As these structures will more and more display nano-features, a coupled experimental and simulative approach has to account for this development to assure design for reliability in the future. A necessary “nano-reliability” approach as a scientific discipline has to encompass research on the properties and failure behaviour of materials and material interfaces under explicit consideration of their micro- and nano-structure and the effects hereby induced. It uses micro- and nano-analytical methods in simulation and experiment to consistently describe failure mechanisms over these length scales for more accurate and physically motivated lifetime prediction models. This paper deals with the thermo-mechanical reliability of microelectronic components and systems and methods to analyse and predict it. Various methods are presented to enable lifetime prediction on system, component and material level, the latter promoting the field of nano-reliability for future packaging challenges in advanced electronics system integration.

ESTC, 2008 – 2nd Electronics System Integration Technology Conference, 1-4 September 2008, The University of Greenwich, London

ESTC, 2008 – 2nd Electronics System Integration Technology Conference, 1-4 September 2008, The University of Greenwich, London

ESTC 2008 – 2nd Electronics System Integration Technology Conference, 1-4 September 2008, The University of Greenwich, London

ESTC 2008 – 2nd Electronics System Integration Technology Conference, 1-4 September 2008, The University of Greenwich, London

Tympanic-ossicular prostheses and MEMS technology: whats and whys

Conclusions. Microelectromechanical systems (MEMS) technology fulfils the requirements of implantable middle ear devices and consequently it becomes an excellent option to design and develop the related transducers. Objectives. To present a summarized overview of the fundamentals of mechanical technologies in relation to middle ear implants research. Materials and methods. Analysis of the possibilities, limitations and practical applications of MEMS as regards the research, development, transference and fabrication processes. Results. MEMS is a new technology with the potential to develop small integrated mechanical and electronic systems that share many processes of integrated circuits technology and its wide application potential. Middle ear prostheses are essentially special implantable transducers that mimic the properties of the tympano-ossicular system: electromechanical systems that deliver low energy pulses safely and efficiently into the labyrinth fluids. They primarily require: active mechanisms to preclude potential damage levels; minimum energy consumption; adequate dimensions for the middle ear; and biotolerable materials. Additionally, development and translational aspects of the selected technology are of utmost importance in this field.

An Assessment of µ-Czochralski, Single-Grain Silicon Thin-Film Transistor Technology for Large-Area, Sensor and 3-D Electronic Integration

Single-grain (SG) thin-film transistors (TFTs) fabricated inside location-controlled silicon grains using the mu-Czochralski method are benchmarked for analog and RF applications. Each silicon grain is defined by excimer laser recrystallization of polysilicon. Thin-film transistors may be fabricated in this manner on silicon or low-cost flexible plastic substrates as processing temperatures remain below 350degC, making the SG-TFT a potential enabling technology for large-area highly integrated electronic systems or systems-in-package with low manufacturing cost. Operational amplifier and voltage reference circuits of varying complexity were designed and measured in order to evaluate the effects of channel position and processing variation on analog circuits. A two-stage telescopic cascode operational amplifier fabricated in an experimental 1.5 mum SG-TFT technology demonstrates a DC gain of 55 dB (unity-gain bandwidth of 6.3 MHz), while a prototype CMOS voltage reference with a power supply rejection ratio (PSRR) of 50 dB is also demonstrated. With fT comparable to single-crystal MOSFETs of comparable gate length, the SG-TFT can also enable RF circuits for wireless applications. A 12 dB gain RF cascode amplifier with on-chip inductors and operating in the 433 MHz ISM band is demonstrated. Excellent agreement with simulations is attained using a modified BSIM-SOI model extracted from measurements of experimental SG-TFT devices.

On models of fractal networks

AbstractA couple of iterative models for the theoretical study of fractal networks whose topologies are generated via iterated function systems is presented: a lumped‐parameter impedor‐oriented one and a two‐port‐network‐oriented one. With the former, the voltage and current patterns give a detailed understanding of the electromagnetic fields' self‐similar distribution throughout the network; on the other hand, model complexity exponentially increases with the prefractal iteration order. The latter ‘black‐box’ model only controls port‐oriented global parameters that are the ones commonly used in the integration of different electronic systems, and its complexity is independent of prefractal order. Sierpinski gasket and carpet topologies are reported as examples. Copyright © 2008 John Wiley &amp; Sons, Ltd.