Abstract
In this paper, a review of surface-activation-based nanobonding technology for packaging and integration is presented. In this paper, the focus will be on nanobonding technology for electronic, photonic, and fluidic devices for miniaturized biomedical and environmental-sensing systems. We describe four different nanobonding techniques that have been developed and successfully implemented in a wide range of materials that include metals, semiconductors, flexible laminations, and ionic materials. Nanobonding technologies are particularly attractive because they offer void-free, strong, and nanoscale bonding at room temperature or at low temperature (<;200°C), and without the need for chemicals, adhesives, and high external pressure. Therefore, there are significant potential and opportunities for nanobonding technologies in the development of low cost, low loss, and high-speed miniaturized emerging systems based on a combination of electronic, fluidic, and photonic devices.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Journal of Selected Topics in Quantum Electronics
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
