Integration Of Electronic Systems Research Articles

Formation of Nanoporous Electrode on Aligned CNT Films Using Dealloying

Eco-power systems and recyclable energy are in high demand in low-carbon societies for practical applications of power devices. In these power-device fields, there is a requirement for the development of electronic packages for the radiation of heat. Carbon nanotubes (CNTs) have high thermal conductivities, large electron mean free paths, and large maximum current densities, as compared to metals. For these reasons, the application of CNTs in semiconductor packaging and three-dimensional wires is expected. It is reported that CNTs that have high densities and are well aligned are formed by the surface decomposition of SiC, which is the substrate of the power transistor [1]. However, the contact resistance between the CNTs and the electronic circuit is high. On the other hand, metal nanoparticles have been known to possess various properties that are not present in the bulk and are expected to have applications in various fields such as electronics and biotechnology. Metal nanoparticles have achieved low melting points and high chemical reactivity. Lower temperatures for some processes are expected when using nanosized particles. Au is applied in micro/nano electrochemical systems and in biotechnology applications because it exhibits superior stability and conductivity over other metals. Dealloying is the method used to construct a nanoporous structure by the selective etching of the poor metal from a bimetal consisting of a noble metal and a base metal. We have attempted to form nanoporous structures of Au–Ag films using the electrochemical method and a low-temperature dealloying process [2]. We tried to form metal nanoparticles of Au–Ag on the CNTs to get good contact resistance by dealloying. The purpose of this study is to clarify the initial growth mechanism of the electrodeposited films and nanoporous structures on the aligned CNT films, and to propose an electrode structure with good thermal-emission characteristics.

Smart Assembly for Soft Bioelectronics

Biology is soft and curvilinear, whereas wafer-based electronics are rigid and planar. The mechanical mismatch impedes the effective integration of electronic systems with biological tissues or skins, paving the way for the construction of device materials (i.e., semiconducting composites) onto soft, biocompatible elastomers with the ability to be stretched, bent, and twisted. Advances in mechanics allow the rather brittle device materials to accommodate large levels of strain (≫1%) and therefore retain their functionality under repeated mechanical deformations in use. A large array of emerging products ranging from skin-like wearable health-monitoring systems to stretchable, bioresorbable electronic implants exist at a prototyping or commercializing phase. This article reviews recent developments in advanced assembly techniques to integrate various device materials with bio-related soft substrates and their applications in emerging biomedical devices.

Leakage Inductance Analytical Calculation for Planar Components With Leakage Layers

Planar magnetic components are promising solutions for the integration of power electronic systems. The leakage inductance of such components plays an essential role in power converters. In this paper, an analytical modeling method for leakage inductance computation is developed for planar components with plastoferrite leakage layers. This method is based on the solution of Poisson's equations for magnetostatic using multilayered Green's functions. The obtained formulations are general and precise and have been validated by numerical tests. Experimental characterizations have been performed on two magnetic components: A planar LLC and planar common-mode choke. The obtained results show that with the described method, the static leakage inductance of planar components can be accurately estimated.

The Characteristics of Planar EMI Filter with Bi-Ground Layers Considering Impedance Mismatching

Planar electromagnetic interference (EMI) filter has significant engineering significance to power electronic system integration and miniaturization. However, the value of differential mode capacitance cannot meet the demand of noise suppression because of the size limit of ceramics. In this case, the EMI filter of novel multilayers is recommended to address this issue. A novel integrated structure of EMI filter based on multilayer ceramic is proposed in this study. The inductance and capacitance of the new structure can be designed separately, which is an advantage in manufacturing. Insertion loss is measured more closely to the actual situation in this study, which is different from the condition where source and load impedances are both 50 Ω. In the process of designing a novel EMI filter, noise impedance is considered. Moreover, the prototype is created and applied to a small switching power supply, which verifies the effectiveness of the developed EMI filter.

54-1: Parallel Fabrication for Integration of Electronic and Microelectromechanical Systems

We have developed a four mask top gate a-Si:H based process that allows for the parallel production of TFTs, Schottky diodes and surface MEMS elements on large area glass substrates. Simple electronical and micromechanical devices as well as a complex active matrix driven MEMS display demonstrator have been produced for process verification. Furthermore, the process seems to be feasible for applications like ultrasonic transducers or energy harvesting.

Integration of electronic system with electro-thermally cooled IR detector: thermal analysis

The paper presents thermal investigations of an idea of encapsulation in common, miniature package both preamplifier circuit and infrared photodetector cooled with the aid of four-stage thermoelectric module. Conducted numerical simulations show that the presence of electronics at printed circuit board with either ceramic or laminate substrate negligibly affects operation of thermoelectric cooler and hence, the operating conditions of the detector. Higher thermal loads are reported when placing wideband electronic system on the additional thermoelectric module. Even though, such solution reduces temperature difference between infrared sensor and the other part of electronics, additional cooler increases the amount of heat that must be dissipated from the package to the ambient.

Experiencias en contexto para generar competencias en carreras de Ingeniería

In response to the need of engineering careers for permanent updates within this world of drastic technological changes, this study analyzes the development of competencies and skills during the education of future professionals in the fields of electronic and control engineering. The developments in electronics and control are currently centered on the integration of mechanical, electronic, and computer information systems applied to robotics and to integrated production systems. Thus, teaching materials and educational training modules are developed. The topics to be developed include industrial controllers, applied robotics, communication networks, supervision software, and technology-integrating devices. Based on practical situations organized from what is known as the “laboratory of applied technologies”, questions will be formulated that favor a wide exposition of the knowledge of the students; then, new situations of growing complexity continue that are compatible with the level of the students to promote the evolution of the initial models; finally, conclusions, knowledge structures, and application activities are established. The study describes a series of devices (materials and methods) to improve education in applied technologies in the field of electronic and control engineering for university students through in-context experiences. These experiences are expected to favor the comprehension of basic concepts of science and technology in an integrated educational framework.

Mechatronic design and manufacturing of an affordable healthcare robotic bed.

The design and manufacturing of affordable medical assistive devices represents a major challenge for developing countries where resources are much more limited than in rich countries. The engineering design process focuses on developing better devices and systems with a low impact on the environment and the most functional and efficient performance, at the lowest possible price. In this context, the mechatronic design is perhaps the most complete way of thinking about performing concurrent design tasks which provide fully of mechanical, electronic, informatics and intelligent control systems integration. This design process can take advantage of many computer-aided tools, which play a key role in the modern methods of optimization and reduce the cost of prototyping. This work presents the mechatronic design process of an affordable assistive robotic bed, from the main requirements through the mechanical design and up to the integration of the electronics and the embedded control, while industrial design suitably merges to all the modules of the robotic bed. The work was developed in cooperation with a set of experts at the Hospital Juarez de Mexico who provided their very specific necessities for the designers and more important for the patients.

Structural health monitoring of a damaged church: design of an integrated platform of electronic instrumentation, data acquisition and client/server software

A practical view is provided on the integration of electronic instrumentation, data acquisition, and software development systems applied to the analysis of pathological structural processes. This system will enable researchers to remotely monitor constructions; compile a register of historical data, creating files for postprocessing; and establish computer-based protocols for evaluation of information, defining automatic alarms when the monitored data exceed preset limit values. This integration is based on the implementation of a remote terminal unit architecture in an industrial PC along with some other elements, namely, the following: suitable data acquisition cards for the type of sensors used, which continuously collect the data the sensors gather; the installation of an application server that periodically communicates with the system, extracting data while guaranteeing persistence; and finally, a web server, which provides remote access to both the data themselves and the system configuration, using a client application developed in JavaFX, a platform for developing rich Internet applications. As an example of the integration, the architecture of a system deployed in a Church in Comillas, Spain, is shown. The work carried out related to the register of existing damage is reported in order to explain the choice of the zones for deployment of the monitoring devices as well as the tasks involved in the installation of the sensors and other devices. Finally, the evolution is presented of the measurements taken during more than 1.5 years of monitoring, as well as their validation through comparison with those obtained by discrete in situ measurement. Copyright © 2015 John Wiley & Sons, Ltd.

Cost-Efficient Integration of Industrial Applications Using Smart Power Gate Arrays

Due to high functional variety, wide power rating range, and relatively low product volumes, electronic systems for industrial application are difficult to economically be integrated on a chip. This paper presents the smart power gate array (SPGA), a novel application-specific integrated circuit (ASIC) platform exactly aimed at enabling cost-efficient single-chip integration of industrial electronic systems. The SPGA combines a low-voltage mixed-signal gate array with a structured high-voltage smart-power core, allowing for single-chip integration of signal conditioning, data processing, power management, actuator driving, and line communication functionalities required for industrial applications. Simultaneously, it offers low nonrecurring engineering cost and high design flexibility owning to the utilized gate array technology. In this paper, the SPGA concept is introduced to overcome integration limitations of existing ASIC technologies. Then, design and capabilities of the SPGA functional modules are described. Finally, a practical SPGA application example of single-chip integrated solenoid valve control and monitoring system is demonstrated.

RETRACTED: Influence of temperature and microstructure on the mechanical properties of sintered nanosilver joints

This article has been retracted: please see Elsevier Policy on Article Withdrawal (http://www.elsevier.com/locate/withdrawalpolicy). This article has been retracted at the request of the Editor-in-Chief. Please note that the reason for this retraction has been updated in July 2015, as follows: The authors have plagiarized part of a paper that had already appeared in 'Electronic System-Integration Technology Conference (ESTC), 2010 3rd', 1-6, 101109/ESTC.2010.5642948. One of the conditions of submission of a paper for publication is that authors declare explicitly that their work is original and that no substantial portion has appeared in a publication elsewhere. As such this article represents an abuse of the scientific publishing system. The scientific community takes a very strong view on this matter and apologies are offered to readers of the journal that this was not detected during the submission process.

Advances in Fine Pitch Off-Chip Interconnections Through the Use of a Novel Surface Finish

One constant in electronic system integration is the continuous trend towards smaller devices with increased functionality, driven by emerging mobile and high-performance applications. This brings the need for higher bandwidth at lower power, translating into increased I/O density, to enable highly-integrated systems with form factor reduction. These requirements result in the necessity of interconnection pitch-scaling, below 30 μm in the near future, and substrates with high wiring densities, leading to routing with sub 5 μm L/S where standard surface finishes (ENIG, ENEPIG) are no longer applicable. Copper pillar with solder caps technology is currently the prevalent solution for off-chip interconnections at fine pitch, dominating the high performance and mobile market with pitches as low as 40 μm in production. However, this technology faces many fundamental limitations in pitch scaling below 30 μm, due to solder bridging, IMC-solder interfacial stress management, and poor power handling capability of solders. All-copper interconnections without solder are very sought after by the semiconductor industry and have been applied to 3D-IC stacking, however no cost effective, manufacturable and scalable solution has been proposed to date for HVM and application to non CTE matched package structures. The low temperature Cu-Cu interconnection technology without solder recently patented by Georgia Tech PRC is one of the most promising solutions to this problem. The main bottleneck of copper oxidation is dealt with by application of ENIG on the Cu bumps and pads, enabling formation of a reliable metallurgical bond by thermocompression bonding (TCB) at temperatures below 200°C, in air, with cycle-times compatible with HVM targets. However, to ensure a bump collapse of 3 μm to overcome non-coplanarities and warpage, a pressure of 300MPa is used in the Process-of-Record (PoR) conditions, limiting the scalability of this technology. This paper introduces a novel Electroless Palladium / Autocatalytic Gold (EPAG) surface finish process, to enable the next generation of high density substrates and interconnections. With circa 100nm-thin Pd and Au layers, the EPAG finish can be applied to fine L/S wiring, with no risk of bridging adjacent Cu traces, even with spacing below 5 μm. Further, the EPAG finish is compatible with current interconnection processes; such as wire bonding, and the Cu pillar and solder cap technology for fine-pitch applications. For further pitch reduction, the EPAG surface finish was coupled to GT PRC's low-temperature Cu-interconnections, in an effort to reduce the bonding load for enhanced manufacturability without degrading the metallurgical bond or reliability. This paper is the first demonstration of such interconnections. The effect of the surface finish thickness and composition on the bonding load, assembly yield, quality of the metallurgical bond was extensively evaluated based on analysis of the metal interface microstructures and the chemical composition of the joints. The current PoR using Electroless Nickel / Immersion Gold (ENIG) coated Cu pillars and pads was used as reference. A novel surface finish is introduced, which allows formation of Cu-Cu interconnections without solder at lower pressure, between a silicon die and glass, organic or silicon substrate at fine pitch, allowing the performance improvements demanded by the IC Packaging Industry.

Development of an autonomous unmanned aerial vehicle using gas-powered RC helicopter

This paper describes the development of a small unmanned aerial vehicle (UAV) with autonomous flight capability. It is the result of integrating a commercial off-the-shelf autopilot system with a low-cost gas-powered RC helicopter. Researchers face several challenges when developing UAVs using gas-powered RC helicopters. To avoid the corruption of the structural vibration to the avionics hardware system, an innovative vibration isolation technique is developed to mechanically isolate the vibrations from the gas engine and rotors. Furthermore, a dynamics model for the vehicle is created to support the autonomous flight control development work. Further, a loss-recover method using Kalman filter is employed for estimating the attitude and position statuses when GPS signal is lost. Several other key challenges related to electromagnetic interference shielding and safe flight testing are also effectively solved in the project. The integration work has been completed and the test flights done so far show that the developed autonomous UAV works well under the integration of the mechanical system, electronic system, and controller software.

A 65nm CMOS low-power MedRadio-band integer-N cascaded phase-locked loop for implantable medical systems.

This paper presents a low-power MedRadio-band integer-N phase-locked Loop (PLL) system which is composed of two charge-pump PLLs cascade connected. The PLL provides the operation clock and local carrier signals for an implantable medical electronic system. In addition, to avoid the off-chip crystal oscillator, the 13.56 MHz Industrial, Scientific and Medical (ISM) band signal from the wireless power transmission system is adopted as the input reference signal for the PLL. Ring-based voltage controlled oscillators (VCOs) with current control units are adopted to reduce chip area and power dissipation. The proposed cascaded PLL system is designed and implemented in TSMC 65-nm CMOS technology. The measured jitter for 216.96 MHz signal is 12.23 ps and the phase noise is -65.9 dBc/Hz at 100 kHz frequency offset under 402.926 MHz carrier frequency. The measured power dissipations are 66 μW in the first PLL and 195 μW in the whole system under 1-V supply voltage. The chip area is 0.1088 mm(2) and no off-chip component is required which is suitable for the integration of the implantable medical electronic system.

Research and Application of Workflow-based Modeling Approval in Dispatching Automation Master System

Dispatching automation system is the nerve center of power grid. When using the system, it usually needs grid model diagrams, such as plant station wiring diagram, flow calculation diagram, etc. In addition, the model files are used for grid monitor, dispatching analysis, etc. Thence before use, these files need to be approved strictly for ensuring the security of the running power grid system. This paper briefly describes the dispatching automation master system iES600Pro of Integrated Electronic Systems Lab Co. Ltd. (iESLab). Moreover, it proposes a system optimization scheme based on workflow technology, thus the system can implement complete approval process of model files. The process is flexible, convenient and customizable. Furthermore, it presents the implementation of scheme including the architecture of system after the optimization, the description of interfaces between system components, the design of business data table, a sample of approval process, and finally the testing platform and results. The results show that the proposed scheme improves the system function and approval efficiency. It is more conducive to the security of grid dispatching.

Study on Electronic License System and Operation

Electronic license operating system is mainly including passive electronic license applications and information technology systems integration of physical construction ideas. This paper introduces a practical application of the anti-metal UHF RFID tag antenna, relying on the existing license plate, the metal plate as part of the antenna to solve UHF RFID tag for metal surface problems. Establishment of cloud computing, combining sea calculation the physical integration of information systems to meet the needs of car networking operations.

Representation and automated transformation of geometric statements

The emergence of a large quantity of digital resources in geometry, various geometric automated theorem proving systems, and kinds of dynamic geometry software systems has made geometric computation, reasoning, drawing, and knowledge management dynamic, automatic or interactive on computer. Integration of electronic contents and different systems is desired to enhance their accessibility and exploitability. This paper proposes an equivalent transformation framework for manipulating geometric statements available in the literature by using geometry software systems. Such a framework works based on a newly designed geometry description language (GDL), in which geometric statements can be represented naturally and easily. The author discusses and presents key procedures of automatically transforming GDL statements into target system-native representations for manipulation. The author also demonstrates the framework by illustrating equivalent transformation processes and interfaces for compiling the transformation results into executable formats that can be interpreted by the target geometry software systems for automated theorem proving and dynamic diagram drawing.

Laser Surface Processing of Integrated Thin Film Systems on Arbitrarily Shaped Components

Thin film deposition and laser patterning enable production of integrated electronic thin film sensors on component surfaces. The process consists of two major processing steps: In a first step the component surface is deposited by isolation and sensor films. The sensor film is subsequently patterned by a scanning laser beam in order to generate strain sensor structures. By using a scanning laser beam, in principle any complex shaped surface can be processed. However, scanning of a focused laser beam on curved surfaces requires advanced process knowledge and machine control techniques compared to conventional flat-field laser scanning. We have developed a 3D capable laser scanning process using a femtosecond laser source, a 3-axis galvanometer scanner and a dynamic intensity modulator. The laser process is demonstrated by patterning a NiCr strain sensor on a complex component surface. The results indicate the potential for integration of electronic thin film systems onto the surface of complex component surfaces.

Modification of Abiotic–Biotic Interfaces with Small Molecules and Nanomaterials for Improved Bioelectronics

Low efficiency of charge extraction (and conversely charge injection) across biotic–abiotic interfaces constitutes an obstacle to the integration of biological and electronic systems in high-performance bioelectronic devices. Advances in the promotion of charge transport across these typically nonconductive interfaces will have far-reaching implications in important applications such as alternative energy generation, bioelectrosynthesis, diagnostics, and environmental monitoring. This review highlights the use of synthetic materials to improve electrical interfacing between biological systems and electrodes, focusing specifically on whole cell bioelectrochemical systems. By taking advantage of a rich variety of materials chemistry and synthetic methodologies, significant improvements to the facilitation of charge transport across abiotic–biotic interfaces have been realized. The modifications of the bioelectronic interfaces presented herein include the use of organic small molecules, semiconducting and redox active polymers, inorganic nanoparticles, carbon nanotubes, graphene, hybrid organic–inorganic systems, and micro-/nanoelectrodes. However, design rules to guide material selection and choices regarding device architecture remain ambiguous. Establishment of a clearer understanding of bioelectronic charge transfer phenomena, their constituent pathways, and means of stimulating or selecting for different pathways is still work in progress. As such, great opportunities exist for materials scientists to contribute to these topics through design and implementation.

Immunologic and Tissue Biocompatibility of Flexible/Stretchable Electronics and Optoelectronics

Recent development of flexible/stretchable integrated electronic sensors and stimulation systems has the potential to establish an important paradigm for implantable electronic devices, where shapes and mechanical properties are matched to those of biological tissues and organs. Demonstrations of tissue and immune biocompatibility are fundamental requirements for application of such kinds of electronics for long-term use in the body. Here, a comprehensive set of experiments studies biocompatibility on four representative flexible/stretchable device platforms, selected on the basis of their versatility and relevance in clinical usage. The devices include flexible silicon field effect transistors (FETs) on polyimide and stretchable silicon FETs, InGaN light-emitting diodes (LEDs), and AlInGaPAs LEDs, each on low modulus silicone substrates. Direct cytotoxicity measured by exposure of a surrogate fibroblast line and leachable toxicity by minimum essential medium extraction testing reveal that all of these devices are non-cytotoxic. In vivo immunologic and tissue biocompatibility testing in mice indicate no local inflammation or systemic immunologic responses after four weeks of subcutaneous implantation. The results show that these new classes of flexible implantable devices are suitable for introduction into clinical studies as long-term implantable electronics.