The purpose of this paper is to evaluate the detection capability of deep learning-based surface scratches in semiconductor package dies and to determine whether deep learning can be employed as an objective inspection tool. To achieve this aim, detection capabilities are compared and evaluated based on a conventional image processing-based appearance inspection algorithm for examining equipment operating in the semiconductor package inspection process. In this study, a ResNet, which is the widely used CNN-based deep learning model, is used. The dataset was generated by collecting images of semiconductor packages being inspected in the semiconductor package appearance inspection process, which were cropped to focus on the parts necessary for the study. Three experiments were conducted for comparison. In the first experiment, the results of each detection using the Hough transform and ResNet-50 were compared. In the second experiment, the comparison was conducted in the same environment as in the first experiment by adding over-examination images. In the third experiment, the Hough transform algorithm and ResNet-50 were further compared by learning the over-examination images. Based on the results, an objective evaluation was conducted to determine whether deep learning could be applied to image processing-based machine inspection facilities.
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