AA7075 is known to a show high strength/weight ratio but suffers from localized corrosion, such as filiform corrosion, pitting, crevice corrosion, and stress corrosion cracking in Cl-containing environments. It has been proposed that Cu-containing intermetallics deteriorate the corrosion resistance and are the initiation sites of pitting. When AA7075 is immersed in an aqueous solution containing NaCl, the intermetallic compounds dissolve, and Cu-enriched particles are formed on and around the intermetallic compounds. Then, the Cu-enriched particles act as a cathode for the oxygen reduction and hydrogen generation reactions, and a strong alkali is locally generated. As a result, it is considered that the Al matrix dissolves, and local corrosion occurs. Therefore, alloy elements that suppress the cathode reaction on the Cu-enriched particles were studied.The samples were prepared from the arc-melting of AA7075 and pure Sn. The concentration of Sn was changed from 0.1 to 5 mass%. After casting, the ingots were heated to 430°C and rolled to a thickness of 2 mm. A solution treatment was performed at 500°C for 2 h. After the heat-treatment, the sample surfaces were polished with a diamond paste down to 0.25 µm.In order to characterize the shape and distribution of the intermetallic particles in the samples, the sample surfaces were observed with an optical microscope and SEM-EDS. The open circuit potentials of AA7075 were measured in 0.1 M NaCl adjusted to pH 6.0 for 16 h. The area exposed to the electrolyte was 10 mm × 10 mm. The measurements were performed in a naturally aerated solution, and Ag/AgCl (3.33 M KCl) was used as a reference electrode. After immersion, the sample surfaces were inspected. Anodic polarization curves of AA7075 were measured in 0.1 M NaCl adjusted to pH 6.0. The measurements were performed in the aerated solution, and the electrode area was 10 mm × 10 mm. In addition, that of pure Sn was also measured. The number of intermetallic compounds in AA7075 with 0.1 mass% Sn was low compared with AA7075. In the initial stage of immersion of AA7075 and Sn-added AA7075, the open circuit potentials were located approximately – 1.0 V and increased with time. Finally, the potential reached around – 0.7 V. The lower potential duration was prolonged by the Sn addition. After immersion, filiform-like corrosion and pitting were observed on the samples. In addition, the Al-matrix and the intermetallic compounds discolored by dissolution. The pitting potential of AA7075 and the 0.1 mass% Sn-added AA7075 alloy was -0.65 V, and no difference was observed.