IC Development Research Articles

Chiplets and Heterogeneous IC Packaging: Building Blocks and Tradeoffs

Chiplets-based IC packages have arrived. This year, many more customers are developing and qualifying their products at Amkor and in the outsourced semiconductor assembly and test (OSAT) and foundry space at large. The rationale for this surge into new multi-die embodiments has been well documented and discussed. In the final analysis, the chiplets approach has become the preferred alternative to large system on chip (SoC) designs. The chiplets approach often permits a better product performance, while lowering total silicon costs. This also enables more transistors in the package than an equivalent SoC, and most importantly, reuse flexibility that reduces time-to-market (TTM) for follow-on products. Heterogeneous IC packages are more expensive than traditional alternatives, for example a single-die Flip Chip ball grid array (FCBGA), but this increase is often offset by lower total silicon cost and the positive time-to-market benefits. However, moving to a heterogeneous approach requires a strong infrastructure to be established for: 1) design, 2) new IC and package structure development and fabrication techniques, and 3) electrical test. IC packaging options to support chiplets have now consolidated into just a few primary constructions that are being developed in the industry and entering early production. These package configurations are much simpler than the now-confusing terminology currently present in the industry. This presentation will review these constructions, simplify their attributes and provide some groundwork for doing the tradeoff analyses during the package construction evaluation and down-selection phase of a project. These higher density integration approaches create modules which integrate the die or chiplets that need ultra fine-line routing for die-die interfaces. Today, these are: (a) modules based on silicon interposers – 2.5D Through Silicon Via (TSV), (b) modules based on High-Density Fan-Out (HDFO) multi-layer redistribution layer (RDL) approaches or (c) modules with bridges. Silicon die can be singular planar devices or combinations using 3D die integration achieved with copper (Cu)-hybrid construction. 1. (c) Bridges (S-Connect) (RDL + Bridge(s)) In Amkor, 2.5D TSV with silicon interposers technology has been in high volume manufacturing (HVM) since 2017. HDFO packaging is internally qualified and currently being qualified for multiple customer products.

Identification of diagnostic signature and immune infiltration for ischemic cardiomyopathy based on cuproptosis-related genes through bioinformatics analysis and experimental validation

BackgroundIschemic cardiomyopathy (IC) is primarily due to long-term ischemia/hypoxia of the coronary arteries, leading to impaired cardiac contractile or diastolic function. A new form of cell death induced by copper, called “cuproptosis” is related to the development and progression of multiple diseases. The cuproptosis-related gene (CuGs) plays an important role in acute myocardial infarction, while the specific mechanisms of CuGs in ischemic cardiomyopathy remain unclear. MethodsThe expressions of CuGs and their immune characteristics were analyzed with the IC datasets obtained from the Gene Expression Omnibus, namely GSE5406 and GSE57338, identifying core genes associated with IC development. By comparing RF, SVM, GLM and XGB models, the optimal machine learning model was selected. The expression of marker genes was validated based on the GSE57345, GSE48166 and GSE42955 datasets. Construct a CeRNA network based on core genes. Therapeutic chemiacals targeting core genes were acquired using the CTD database, and molecular docking was performed using Autodock vina software. By ligating the left anterior descending (LAD) coronary artery, an IC mouse model is established, and core genes were experimentally validated using Western blot (WB) and immunohistochemistry (IHC) methods. ResultsWe identified 14 CuGs closely associated with the onset of IC. The SVM model exhibited superior discriminative power (AUC = 0.914), with core genes being DLST, ATP7B, FDX1, SLC31A1 and DLAT. Core genes were validated on the GSE42955, GSE48166 and GSE57345 datasets, showing excellent performance (AUC = 0.943, AUC = 0.800, and AUC = 0.932). The CeRNA network consists of 218 nodes and 264 lines, including 5 core diagnostic genes, 52 miRNAs, and 161 lncRNAs. Chemicals predictions indicated 8 chemicals have therapeutic effects on the core diagnostic genes, with benzo(a)pyrene molecular docking showing the highest affinity (-11.3 kcal/mol). Compared to the normal group, the IC group,which was established by LAD ligation, showed a significant decrease in LVEF as indicated by cardiac ultrasound, and increased fibrosis as shown by MASSON staining, WB results suggest increased expression of DLST and ATP7B, and decreased expression of FDX1, SLC31A1 and DLAT in the myocardial ischemic area (p < 0.05), which was also confirmed by IHC in tissue sections. ConclusionIn summary, this study comprehensively revealed that DLST, ATP7B, FDX1, SLC31A1 and DLAT could be identified as potential immunological biomarkers in IC, and validated through an IC mouse model, providing valuable insights for future research into the mechanisms of CuGs and its diagnostic value to IC.

Growing intercultural speakers in novice Italian: A virtual versus face‐to‐face comparison

AbstractIntercultural competence (IC) has been identified as a crucial outcome of world language education. The purpose of the study is to compare possible differences in IC development between face‐to‐face and asynchronous virtual modes of delivery that were taken as emergency measures early in the COVID‐19 pandemic for a beginning Italian course with 18‐ to 22‐year‐old students. The American Association of Colleges &amp; Universities Intercultural Knowledge and Competence Valid Assessment of Learning in Undergraduate Education Rubric serves as a theoretical framework to determine learning outcomes and guide qualitative assessment. Applying a mixed‐methods approach, the study collects quantitative data using the Intercultural Knowledge and Competence Short Scale and qualitative data from student reflection assignments for both face‐to‐face (2019) and asynchronous virtual (2020) courses. A comparison of IC development between the two cohorts shows similar achievement of intercultural learning in both modes. Implications for IC development in language classrooms are discussed.

Hardware Trojan Detection Using Machine Learning: A Tutorial

With the growth and globalization of IC design and development, there is an increase in the number of Designers and Design houses. As setting up a fabrication facility may easily cost upwards of $20 billion, costs for advanced nodes may be even greater. IC design houses that cannot produce their chips in-house have no option but to use external foundries that are often in other countries. Establishing trust with these external foundries can be a challenge, and these foundries are assumed to be untrusted. The use of these untrusted foundries in the global semiconductor supply chain has raised concerns about the security of the fabricated ICs targeted for sensitive applications. One of these security threats is the adversarial infestation of fabricated ICs with a Hardware Trojan (HT) . An HT can be broadly described as a malicious modification to a circuit to control, modify, disable, or monitor its logic. Conventional VLSI manufacturing tests and verification methods fail to detect HT due to the different and un-modeled nature of these malicious modifications. Current state-of-the-art HT detection methods utilize statistical analysis of various side-channel information collected from ICs, such as power analysis, power supply transient analysis, regional supply current analysis, temperature analysis, wireless transmission power analysis, and delay analysis. To detect HTs, most methods require a Trojan-free reference golden IC. A signature from these golden ICs is extracted and used to detect ICs with HTs. However, access to a golden IC is not always feasible. Thus, a mechanism for HT detection is sought that does not require the golden IC. Machine Learning (ML) approaches have emerged to be extremely useful in helping eliminate the need for a golden IC. Recent works on utilizing ML for HT detection have been shown to be promising in achieving this goal. Thus, in this tutorial, we will explain utilizing ML as a solution to the challenge of HT detection. Additionally, we will describe the Electronic Design Automation (EDA) tool flow for automating ML-assisted HT detection. Moreover, to further discuss the benefits of ML-assisted HT detection solutions, we will demonstrate a Neural Network (NN) -assisted timing profiling method for HT detection. Finally, we will discuss the shortcomings and open challenges of ML-assisted HT detection methods.

Computer Interface for Electroluminescence (EL)

The goal of Computer aided device start from the physical description of integrated circuit devices, considering both the physical configuration and related device properties and build the link between the broad range of physics and electrical behavior models that support circuit design. Physics-based modeling of devices, is distributed and lumped form is an essential part of the IC process development. It seeks to quantify the underlying understanding of the technology and abstract that knowledge to the device design level, including extraction of the key parameters that support circuit design and statistical metrology [1][2]. IC development for more than a quarter-century has been dominated by the MOS technology. In the 1970s and 1980s NMOS was favored owing to speed and area advantages, coupled with technology limitations and concerns related to isolation, parasitic effects and process complexity. During that era of NMOS-dominated LSI and the emergence of VLSI, the fundamental scaling laws of MOS technology were codified and broadly applied [3]. It was also during this period that Computer Aided Device reached maturity in terms of realizing robust process modeling (primarily one-dimensional) which then became an integral technology design tool, used universally across the industry [4]. At the same time device simulation, dominantly two-dimensional owing to the nature of MOS devices, became the work-horse of technologists in the design and scaling of devices [5]. The transition from NMOS to CMOS technology resulted in the necessity of tightly coupled and fully 2D simulators for process and device simulations [6][7].

Development of Si Power ICs and Evolution to SiC Large Electric Capacity Power ICs

Development of Si Power ICs and Evolution to SiC Large Electric Capacity Power ICs

Integrating Homogeneous Current-Saturation Graphene Transistors Into High-Linearity Amplifiers

In this work, a new type of graphene ICs only comprising multiple graphene field-effect transistor (GFET) components is first reported. Based on the GFET design that enables homogeneous electrical characteristics in batch-made devices, the practicality and functionality significances of multi-GFET integration are experimentally demonstrated via high-fidelity amplifiers for baseband analog signals. Different from the quadratic relationship of the gate-controlled current output (in saturation region) in the traditional silicon-based MOSFETs, the saturation current output of GFETs relating to the gate-controls possesses high linearity. This advantage overcomes the inherent nonlinear distortion issues in the existing silicon MOSFET amplifiers and potentially provides a promising scenario for the accurate preamplification of weak analog signals. Besides, the novel circuit configuration and signaling principle may expand the developmental paradigm of analog amplifiers and set groundwork for the development and practicalization of advanced carbon-based nanoelectronic ICs.

Analytical and Measurement-Based Method for Diagnosing the Fault of Channels in TSV-Based 3D ICs

Three-dimensional integrated circuits (3D ICs) based on through silicon via (TSV) technology can effectively solve many bottlenecks in the development of ICs. It has rapidly developed into a key cutting-edge technology representing the medium and long-term sustainable development of microelectronics industry. Process fluctuation causes TSV process defects, resulting in the change of structural parameters of RDL and TSV interconnection structure. Finally, it leads to the degradation of performance parameters and functional failure of 3D interconnection and devices. Aiming at the high-resistance and open-circuited faults of 3D ICs, this paper develops an analysis method based on micro nano machining and detection technology. The electrical characteristics and images of typical chain TSV interconnections are analyzed by scanning electron microscope high-resolution imaging. The mechanism of fault diagnosis is based on potential difference and electron transfer.

English Teaching for Intercultural Communication in China: Past, Present and Future

Abstract There have been papers published in the Chinese mainland or Taiwan or outside of China exploring the relationship between intercultural communication studies and English teaching in China. The present study, applying historicism, points out that these papers, though informative, are far from adequate for lack of equal importance attached to journal papers and books, and to some events of historic significance. The objective of the present study is, therefore, to make up for some missing links in these papers. A rhetorical approach out of various perspectives on ICS is called for so that teachers and students of ICS in China would be better informed to realize effective intercultural communication in English. To this end, this paper first points out that to trace the origin of the relationship between language and culture is a bit far-fetched, for no one could possibly pin down exactly when the relationship was perceived between culture and FLE in general and English teaching in particular. Then a more comprehensive account is made of the development of ICS in China for English Teaching. Third, some barriers in furthering ICS for English teaching in China are clarified as well as their causes. Fourth and finally, a rhetorical approach is suggested to ICS both for descriptions of cultural differences and evaluations of cultural elements that comprise a given culture.

Remote Device Management via Smart Contracts

With the continued scaling of transistor feature size, the cost of IC development has been escalating. The economics of semiconductor IC development favors high volume manufacturing, while high volume cannot be attained without developing an IC that serves many applications. Some of these applications are in low-margin Internet of Things (IoT) devices, where an SoC cannot command a high price. Consequently, without the ability to customize IC features after production, its lowest-priced application will determine an IC’s price. This motivates the manufacturers to develop chips with provisions for post-manufacturing IC customization. This paper explores how an IC can be programmed repeatedly and securely using blockchain-based smart contracts to allow users to upgrade or <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">rent</i> features. The availability of such a system could, for example, allow a buyer to upgrade her processor from a low-end to a high-end part by making an additional payment to the manufacturer. Implementing such a system will require remote device management capabilities. Remote device management presents unique design considerations, such as, necessity for transparency of the actions that a device takes on behalf of a user; the requirement of a trusted arbiter; and provision for management of these devices beyond the intended lifespan. To overcome the challenges of transparency, longevity, and the necessity of a trusted arbiter, we propose embedded smart contracts in concert with a blockchain. Our proposed smart contract takes the device feature configuration request as input and outputs the corresponding configuration. To support remote, secure, and authorized updates, we propose an on-die hardware module which communicates with the smart contract and enforces its functionalities. This was prototyped using a programmable system-on-chip working in concert with Ethereum blockchain. The prototype demonstrates the feasibility and practicality of the proposed solution.

CONCEPTUAL AND TERMINOLOGICAL APPARATUS OF PROBLEM RESEARCH OF INNOVATIVE CULTURE DEVELOPMENT OF THE FUTURE MANAGER OF THE GENERAL SECONDARY EDUCATIONAL INSTITUTION IN THE MASTER’S TRAINING PROCESS

Formulation of the problem. The need for a categorical interpretation of the thesaurus is due to methodological priorities for scientific, objectivity, systemic, integrity, unity, complexity and logic of the study. The correctness of the use of relevant concepts and categories is determined by the accuracy of their definitions, fully depends on the verification of the presented innovative culture concept of the leader. Consequently, there is a need for a comprehensive research analysis of conceptual and terminological apparatus of problem research of innovative culture development of the future manager of the general secondary educational institution in the master’s training process. Materials and Methods: Solving the highlighted aim, a set of methods of scientific research adequate to them were used, theoretical: a comparative analysis of conceptual and terminological apparatus of problem research of innovative culture development of the future manager of the general secondary educational institution in the master’s training process; a systematic analysis of conceptual and terminological apparatus of problem research of innovative culture development of the future manager of the general secondary educational institution in the master’s training process. Results. The article presents the innovation culture development of the future manager of general secondary educational institution as a systematically organized, respectively providing process in master's training, determined by the needs of society, state and customers of educational services and institutionalized, which substantiates the relationship and interdependence of innovation culture, which correlate with the content and pedagogically appropriate methodological systems of professional training at higher education. It is determined the IC development of the future manager of general secondary educational institution. Conclusions. Thus, modern theories of social development make it possible to identify the specifics of the innovative culture development and give grounds to conclude that the innovation and innovation culture development is a natural, necessary, historically determined and self-organized process of objectification and institutionalization of innovative content at the social and individual levels. It is important to understand that the emergence of innovation and innovation culture is possible only if the dialectical and synergetic nature of life is taken into account. For the innovation culture development is exceptional importance the openness of educational systems, the presence of the environment and mechanisms for the natural struggle of contradictory and opposing forces, the absence of authoritarian and artificial interference in the institutionalization of innovation culture.

Hybrid integrated circuit design for particular application

An important achievement of microelectronics is the development of a new electronic component base, in particular, integrated circuits. In the development of radio electronic means, the main difficulty is the production of microcircuits, which play a decisive role in the functioning of the printed circuit assembly. The actual problem is that it is necessary to develop a microcircuit for a certain RES, since there is no way to choose from those existing on the market. The article describes in detail the algorithm for the development and design of ICs for private use, which meets the given electrical and technological requirements of the device. A technique for calculating the geometric dimensions of resistors and capacitors is described. The developed IC contains precision resistors and capacitors that are not possible to manufacture in production. As a result, these resistors will be made in the form of a trimmer structure, the capacitors will be made in the form of a hinged structure. The article describes in detail the algorithm for their calculation, as a result of which all the data for their manufacture is obtained. A detailed calculation of the geometric dimensions of the trimmer resistor, thin-film capacitors and resistors is provided. The development of the design and technology of a thin-film hybrid IC is carried out in three stages. The stated algorithm for the development of ICs is universal for all types of microcircuits, it solves the problem posed – it allows the development of ICs with the required characteristics and is possible for implementation in production.

Эволюция государственного управления в странах постсоветского пространства. Азербайджанская Республика

In the article, the forma- tion and development of public administration in the Azerbaijan Republic is considered, firstly, in the context of the country’s history and culture, its natural, geographical, social, economic features; secondly, through the prism of the principles of sustainable development and the emerging trend in the formation of e-government. It is shown that over the years since independence, the Republic has managed to resolve a number of internal and external political problems, to overcome the consequences of a severe systemic crisis of the 1990s. Invariably the focus of attention of state bodies over the years has been economic issues, the problems of its diversifi- cation and the social and humanitar- ian sphere, its state, prerequisites and conditions for development. A comparative analysis based on offi- cial reports of international organi- zations shows that a number of important economic and social indi- cators of Azerbaijan are now at the same level as those of the G7 coun- tries. The achieved level of econom- ic development and implemented successful social policy became possible due to the formation of an adequate system of state and municipal government in the Republic. The article reveals the connection between the formation of an effective public administration system and the spiritual, moral, and cultural condition of society. The support by citizens of public admin- istration structures on the basis of trust creates a positive situation of synergy of management and social self-organization. It is emphasized that maintaining a sustainable development of society, its inclusive nature is possible with an advanced personnel policy in the field of public administration and the use of inno- vative technologies.

Making strategy critical? Part II: Strategy redux – Macro perspectives

We attempt to answer the following research question: how is time understood and acted upon in connection to different types of ICoriented management accounting processes within organizations? In other words, what role does time play in IC-related management accounting practices? Alvesson and Deetz’s (2000) critical management research framework was selected for the examination. The temporal dimensions of IC and its related measurement and management accounting processes are discussed and questioned from a time-oriented micro-process (practice) perspective. The main findings are the following. First, IC can be considered as a “temporal boundary object”. Second, the development of IC time-related indicators for IC should be problematized to increase understanding. Moreover, this study lends sharp focus to the need for considering more than just the amount of time spent engaging in IC activities, but the quality of that time as well. Third, we confirm that IC tends to change over time. Consequently, IC concepts, methods and tools are not stable in practice, but rather are reflective of a specific time horizon. Forth, time-lags relating to IC creation and development tend to be overlooked and, hence, are not as clearly understood.

Data science methods for comprehensive assessment of regional economic development

The paper deals with the assessment of the socio-economic development of Ukrainian regions using Data Science methods and multidimensional analysis, including taxonomy, n-dimensional classification, and ensemble decision trees methods. The methodological bases of economic regions devel¬opment by the economic and mathematical modeling methods were investigated. The necessity of improving and further developing estimation models of the regional economic development using business analytics tools and multidimensional scaling methods was investigated. The ensemble decision trees methods was applied for the classification model of economic development of the Ukrainian regions according to the conceptual base of the research on regional econom¬ic development. It will increase the quality level of administrative decisions making on regional de¬velopment asymmetry equalization. It is determined that in Ukraine, there is a significant imbalance of regions clusters with high and low economic level. Here was investigated the relationship between the two groups of economic development indicators – the indicators of the economic development regional performance and the group of economic potential. The results of the classification model allow identifying the set of indicators that have significant impact on the overall economic development. The developed ensemble model allows carrying out qualitative recognition and prediction of the state probability of economic development. It will improve the quality of decision making pro¬cesses on equalization of regional development asymmetry. The further research gives the possibility to develop the system of levers directions of regional development imbalance equalization, to determine priority vectors of sustainable development of both the regions and the country.

Increased Usage of Syntactic Resources in Turn-taking as the Indicators for IC Development

Increased Usage of Syntactic Resources in Turn-taking as the Indicators for IC Development

Longitudinal associations between inhibitory control and externalizing and internalizing symptoms in school-aged children.

Inhibitory control (IC) deficits have been associated with psychiatric symptoms in all ages. However, longitudinal studies testing the direction of the associations in childhood are scarce. We used a sample of 2,874 children (7 to 9 years old) to test the following three hypotheses: (a) IC deficits are an underlying risk factor with a potentially causal role for psychopathology, (b) IC deficits are a complication of psychopathology, and (c) IC deficits and psychopathology are associated at the trait level but not necessarily causally related. We used the go/no-go task to assess IC, the parent-rated Strengths and Difficulties Questionnaire to evaluate externalizing/internalizing symptoms, and the random intercepts cross-lagged panel model to test the hypotheses. The results showed no support for the underlying risk factor hypothesis, suggesting that IC unlikely has a causal role in this age group's psychopathology. The complication hypothesis received support for externalizing symptoms, suggesting that externalizing symptoms may hamper the normal development of IC. IC deficits and both externalizing and internalizing symptoms were correlated at the trait level, indicating a possible common origin. We suggest that it may be useful to support children with externalizing symptoms to promote and protect their IC development.

Разработка модели новой парадигмы развития индустрии культуры

The development of the cultural industry can prevent unnecessary loss of time and various resources in the process of organizing the interaction of participants in the life cycle of the cultural industry services. To assess the effectiveness of the functioning and development of creative industries, the method of «analysis of the functioning environment» is used. In the paradigms framework of the support mechanism for the IR discusses several components: classification services culture; classification of the market of cultural industries; formation of the complex system of services in the cultural industry (IR); state support, forms of public-private support (PPP); risk minimization; the formation and implementation of programs services culture within integrated service systems (Integs). Economic support measures include the main elements: assessing the potential of IR; the formation of information-analytical database (IABD) IR; creation of economic-mathematical models support IR services; optimization of costs (creating Integs IR); improving the efficiency of IR (economic, social, cultural). The vertical of realization of the organizational and economic mechanism of integral support of the culture industry is defined. Theoretical and methodological basis for the development of integrated support for EC services OEM solve an important state task to improve the living standards of the population and economic growth of the RF subjects and the formation of a new paradigm of the RF IC development. The proposed model of the new paradigm of IC development reflects the logic of actions and is aimed at the formation of integrated support for the system of cultural services of the Russian Federation, taking into account the needs of a particular subject of activity and is a way of coordination and allocation of resources, a condition for effective realization of the potential of the subject of activity.

Топологические особенности разработки микросхем сприменением технологии монтажа flip-chip и wire bond

Топологические особенности разработки микросхем сприменением технологии монтажа flip-chip и wire bond

EFFECTS OF INFORMATION AND COMMUNICATION TECHNOLOGY ADOPTION ON MSMEs IN THE RETAIL SECTOR MARKETING PERFORMANCE IN CIBADUYUT AREA, BANDUNG CITY

Micro, small and medium enterprises (MSMEs) have become priority for economic development as an effort to increase the competitiveness of MSMEs . Moreover, MSMEs have the potential and also become the driving force of the Indonesian econom ic development . Cibaduyut area, which is the main center of the textile industry and processing in Bandung City. However, MSMEs in this area have faced great pressure since the enactment of the ASEAN-China Free Trade Area (ACFTA) in 2010. There have been efforts made by business men , especially the retail sector in this area to increase the company competiti on by adopting Information and Communication Technology (ICT). T h is study aims to find out how the ICT effects on company performance in the retail sector MSMEs in Cibaduyut area , especially towards m arketing p erformance. Respondents in this study were sampled using proportionate stratified random sampling to determine the number of samples based on the size of the business. The analysis technique used is multiple regression analysis using the SPSS 22.0 application. The results showed that there are significant effects between Information Technology , Communication Technology and also between Information Technology and Communication Technology on M SMEs Marketing Performance in the retail sector in Cibaduyut, Bandung City.