Abstract
Топологические особенности разработки микросхем сприменением технологии монтажа flip-chip и wire bond
Published Version
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https://doi.org/10.17587/nmst.21.416-421
Copy DOIJournal: Nano- i Mikrosistemnaya Tehnika | Publication Date: Jul 22, 2019 |
Топологические особенности разработки микросхем сприменением технологии монтажа flip-chip и wire bond
Join us for a 30 min session where you can share your feedback and ask us any queries you have
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