The SiOx layer and Si∕SiOx interface formed on Si(100) substrates, held at 493K, by oxidation from a beam of hyperthermal (5eV) atomic oxygen and upon exposure to thermal molecular oxygen were characterized by a variety of microcharacterization and surface science techniques. The amorphous silica formed by atomic oxygen was nearly twice as thick, more ordered (similar to a quartz structure), and more homogeneous in composition, than the oxide formed by molecular oxygen. The Si∕SiO2 interface formed by atomic oxygen was atomically abrupt and no suboxides were detected near the interface or throughout the oxide. In contrast, the Si∕SiOx interface that developed from molecular oxygen exposure was atomically rough, and a large fraction of suboxides was found near the interface. The differences in the oxide films grown by exposure to atomic and molecular oxygen are discussed in the context of a thermionic emission model of silicon oxidation.
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