We report the fabrication of cesium-doped mixed cation perovskite solar cells (PSCs) (FTO/c-TiO2/mp-TiO2/Perovskite/spiro-OMeTAD/Au). A few key processing issues and their solutions are introduced. The smooth, shiny, and dark perovskite film is deposited by using the anti-solvent method through spin-coating. First, the deposition of a pinhole-free c-TiO2 layer with a smooth surface is critical. Here, we introduce a new TiO2 solution using titanium isopropoxide (TiO2 99.99%) to tackle the issue the issues related to the conventional TiO2 solutions. Compared to the conventional one, the spin-coating of the new solution provides a pinhole-free, efficient hole-blocking layer without cracks and still cheaper and quicker than the latter one. Highly reproducible PSCs with an average power conversion efficiency (PCE) of 15.4% are fabricated using this solution compared to the conventional solution utilizing both spin-coating and spray pyrolysis with average PCEs of 10.6% and 13.78%, respectively. The anti-solvent method was usually used with chlorobenzene (CBZ), but CBZ cannot dissolve the Li-TFSI particles which may be present on the surface of mp-TiO2 right after Li-doping process. In this case, we should use a solvent that can dissolve the Li-TFSI particles completely. Both diethyl ether (DEE) and the mixed of CBZ and DEE (volume ratio of 4:1) can dissolve the Li-TFSI particles easily. It improves the size of perovskite particles which leads to lower density of defects in the film compared to the one with smaller particles. The overall PCE is enhanced to 15.9% for samples with CBZ:DEE compared to the PCE of 14.76% for samples with CBZ in the same processing conditions. Moreover, a thin layer of silver (Ag) is introduced as the interlayer between the hole transport layer (HTL) and the Au. We deposited a 2-5nm of Ag on top of the HTL followed by 80 nm of Au. By this, the adhesion of the Au layer to the device is improved according to the simple tweezer tool test. A pure Au film can easily come off from the surface of the HTL, however, the Au films with 2-5nm of silver buffer layer show strong adhesion to the device. Interestingly, the employment of 2nm silver film improved the current density and, finally the PCE of the devices by both improving the adhesion of the back electrode onto the device and increasing the light reflection in the PSC. Finally, a reproducible fabrication procedure of PSCs with an average PCE of 16.5%, and a maximum PCE of 17.43% for an active area of 0.08 cm2 is achieved.