Hole Filling Research Articles

Reducing Rejected Workflows using WSHF Algorithm in Cloud

Workflow ensembles of interdependent tasks for a larger scale application have to be managed efficiently to get accurate results within a stipulated time and it is a challenging task. In this paper, we address a problem of efficient scheduling of workflow ensembles within the budget and deadline constraints and also the workflow ensembles that deviates the budget and deadline constraints. We consider the benefits of both the resource providers and the users in our paper. We simulate our work and analyze the performance of our paper using cloudsim. The incoming tasks with respect to any criteria are admitted based on the admission and feedback procedure. The proposed work also concentrates on the workflows that is of beyond the budget and deadline The tasks that are within the budget and deadline criteria are handled directly and admitted by the queue, whereas the tasks that isof beyond the budget and deadline are readmitted by Workflow Shuffling and Hole Filling Algorithm (WSHFA). The algorithm achieves the minimization of rejected tasks by recycling it, thereby reducing the idleness of resources and maximizing the resource utilization in cloud.

Depth Image Based View Synthesis: New Insights and Perspectives on Hole Generation and Filling

View synthesis with depth-image-based rendering (DIBR) has attracted great interest in that it can provide a virtual image at any arbitrary viewpoint in 3-D video and free-viewpoint TV. An inherent problem in the DIBR view synthesis is occurrence of holes in a synthesized image, which is also known as disocclusion problem. The disoccluded regions need to be handled properly in order to generate a synthesized view of good quality. This paper provides a fundamental examination of hole generation mechanism in the DIBR oriented view synthesis process. A necessary and sufficient condition of hole generation is first shown, and the corresponding hole location and length is obtained analytically. Furthermore, in view that the conventional hole filling algorithms may fail to fill up a hole correctly when lacking (adequate) visible background information, we propose utilizing the occluded (invisible) information to identify and locate the relevant background pixels around a hole. We then make use of the visible and invisible background information together to perform hole filling. Experimental results validate our hole generation model demonstrating agreement to our analytical results, while our proposed hole filling approach shows superior performance in terms of visual quality of synthesized views.

DIGITAL SPECTROPHOTOMETER EVALUATION OF THE INFLUENCE OF SCREW COLOR AND ACCESS HOLE FILL ON THE COLOR OF SCREW- RETAINED IMPLANT CROWNS

Statement of problem: Although screw-retained implant crowns are commonly preferred by clinicians, there remain a limited number of studies on how color affected by screw color and access hole fill. purpose: The purpose of this study was to determine the influence of screw color, opaque shade and composite thickness on the color of screw-retained implant crowns with use of digital spectrophotometer. materials and methods: eighty specimens were divided into two groups ,gray group (pure titanium) and golden-colored group (anodized titanium) which used as two backgrounds. Composite discs with 1mm, 2mm,0.5mm opaque+0.5mm composite and 0.5mm opaque+1.5mm composite were fabricated. Titanium specimens and composite discs were placed into a collective mold in various tested groups for color measurements. reSultS: Quantitative in concern to clinical color matching tolerance, It was found that, group 4A and 4B recorded the lowest ∆E as they could not detected by human eyes. Quantative color matching evaluation showed, no significant differences between gray and golden colored titanium(background), (P >0.05) while golden colored titanium gave higher ∆E than grey titanium group. For grey titanium; it was found that Group (4A) was the lowest ∆E value (1.20±0.4), followed by Group(2A) (4.00±1.3∆E), then Group (3A) (5.55±1.8 ∆E)while Group (1A) was the highest (7.6±2.53∆E) The difference in color change was significantly where (P= 0.001<0.05). For golden colored titanium; it was found that Group(4B) recorded the lowest ∆E value (1.15±0.38) followed by Group (2B)(3.65±1.26∆E) then Group (3B) (4.15±1.3∆E) while Group (1B) was the highest (5.55±01.8∆E). The difference in color change was significantly where (P= 0.0001<0.05). conclusion: composite thickness and opaque shade composite affected ∆E values (p 0.05) of the color of final restoration. clinical implications: Screw color and access hole fill play an important role on the color of screw-retained implant crowns. In present study, regardless the implant color, the use of 0.5mm opaque composite covered by 1.5 mm composite resin affected the color of final restoration significantly.

To Fill or Not to Fill: Sensitivity Analysis of the Influence of Resolution and Hole Filling on Point Cloud Surface Modeling and Individual Rockfall Event Detection

Monitoring unstable slopes with terrestrial laser scanning (TLS) has been proven effective. However, end users still struggle immensely with the efficient processing, analysis, and interpretation of the massive and complex TLS datasets. Two recent advances described in this paper now improve the ability to work with TLS data acquired on steep slopes. The first is the improved processing of TLS data to model complex topography and fill holes. This processing step results in a continuous topographic surface model that seamlessly characterizes the rock and soil surface. The second is an advance in the automated interpretation of the surface model in such a way that a magnitude and frequency relationship of rockfall events can be quantified, which can be used to assess maintenance strategies and forecast costs. The approach is applied to unstable highway slopes in the state of Alaska, U.S.A. to evaluate its effectiveness. Further, the influence of the selected model resolution and degree of hole filling on the derived slope metrics were analyzed. In general, model resolution plays a pivotal role in the ability to detect smaller rockfall events when developing magnitude-frequency relationships. The total volume estimates are also influenced by model resolution, but were comparatively less sensitive. In contrast, hole filling had a noticeable effect on magnitude-frequency relationships but to a lesser extent than modeling resolution. However, hole filling yielded a modest increase in overall volumetric quantity estimates. Optimal analysis results occur when appropriately balancing high modeling resolution with an appropriate level of hole filling.

The obtainment and recognition of raw silk defects based on machine vision and image analysis

At present, the raw silk defects detection is traditional seriplane inspection that is greatly influenced by human factors and poorly repeatable. We introduce a method of machine vision and image analysis to intuitively detect the main kinds of raw silk defects which are loops and loose end in this paper. During the experiment, we develop an image acquisition system that includes a charge coupled device line scan sensor, a telecentric lens, a light source, and a raw silk winding device to capture the raw silk images continuously and steadily. After the image capture stage, the defect segmentation using thresholding and morphology operations, such as opening, hole fill up, and image subtraction, is carried out to extract the geometrical features accurately. To describe the defects under visual property, four geometrical features are extracted, which will be used as the input of BP neural network. A BP neural network is designed as a classifier to recognize the test samples. Experimented results indicate that the proposed method can successfully detect and recognize the main kinds of raw silk defects.

Electron backscatter diffraction characterization of blind hole fillings by electrolytic Cu deposition

Blind hole (BH) filling by electrolytic Cu deposition is widely used in high density interconnection technology for printed circuit boards. In this study, we investigated Cu deposition behavior in a BH structure using optical microscopy and field-emission scanning electron microscopy in combination with electron backscatter diffraction (EBSD). According to the deposition morphology/rate, the BH filling process was divided into three distinct regimes: (1) the initial deposition regime (t=20–25min), (2) the bottom up deposition regime (t=25–35min), and (3) the final deposition regime (t=35–80min). EBSD analyses showed that the Cu grains were predominantly in the [111]||TD (TD: transverse direction) orientation in the first regime. The [111] Cu grains were predominantly oriented with a takeoff angle of ~20° in the bottom up deposition regime. In the final deposition regime, the [111]||RD (RD: rolling direction) and [101]||RD orientations became dominant in the BH fillings. In addition, we characterized the grain boundaries in the Cu deposits with respect to t. The microstructural/crystallographic information presented in this study will improve the understanding of how the electrolytic Cu filling process occurs in a BH structure.

Finite Element Simulation of Exit Hole Filling for Friction Stir Spot Welding – A Modified Technique to Apply Practically

Friction Stir Spot Welding (FSSW) is a solid state joining process which uses a rotating tool consisting of a shoulder and/or a probe. Though it has proven its potential in joining difficult to weld materials, one of the drawbacks of process is prevalence of exit hole at the end of the process. In the recent past new techniques have been developed to eliminate this draw back by filling this unwanted hole. Determining the appropriate tool design and parameters to fill a hole for given situation is a challenge. The article demonstrates the effective method of obtaining these desired parameters a priory. A three dimensional (3D) model is developed in finite element (FE) commercial code DEFORM 3D/Implicit. It was found that internally filleted shoulders help in filling of holes. The obtained optimized process parameter (tool rotation speed of 900rpm, plunge velocity of 30mm/sec and plunge depth of 0.2mm) for AA2024 plate (5mm thick) have potential to reduce number of experiments.

Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles

We reported filling of nanoscale holes with high aspect ratio by Cu electroplating with a supercritical carbon dioxide suspension (EP-SCS). The Cu film electrodeposited by the EP-SCS was smooth. The nanoscale holes with 70nm in diameter and aspect ratio of 2 and 5 can be filled by electrodeposited Cu with no voids and pinholes by the EP-SCS. Gap-filling capability of the EP-SCS is high for the nanoscale holes with high aspect ratio even when using Cu electrolyte originally designed to fill holes with 70nm diameter and aspect ratio 1 by conventional method.

Small Hole Filling in ITK

This code provides an implementation of a simple technique to fill small holes in an image. We use a multi-pass method that fills pixels on the border of a hole with the average of its non-hole 8-connected neighbors. This process is repeated until all holes are filled.The code is available here: https://github.com/daviddoria/SmallHoleFiller

Z-axis Interconnections for Next Generation Packaging

In this paper, the use of electrically conducting adhesives (ECA) to form z-axis interconnections for next generation packaging is discussed. In particular, current efforts related to Z-axis interconnections for device level fabrication, integration, and electrical performance are highlighted. A few optimized ECAs were used for hole fill applications to fabricate Z-axis interconnections in laminates. Conductive joints were formed during composite lamination using the ECA. Around 5,000 to 200,000 through holes in the joining cores, formed by laser or mechanical drilling, and having diameters ranging from 50 μm to 750 μm, were filled with an optimized conducting adhesive. The adhesive-filled joining cores/layers were laminated with circuitized subcomposites to produce a composite structure. As a case study, a variety of z-axis interconnect constructions for a flip-chip plastic ball grid array package, rigid-flex, rigid-rigid, package-interposer-package (PIP), RF structures, and PWBs were fabricated and evaluated at both the subcomposite and composite levels to understand structural and electrical integrity. Electrically, S-parameter measurements showed very low loss at multi-gigahertz frequencies. The losses were low enough to support typical SERDES up to 15 Gbps over 750 mm. The present process allows fabrication of z-interconnect conductive joints having diameters in the range of 55 to 500 μm. The processes and materials used to achieve smaller feature dimensions, satisfy stringent registration requirements, and achieve robust electrical interconnections are discussed.

The Effect of Acid on Through Hole Filling by Cu Electroplating

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The Influence of Supporting Electrolyte on Through Hole Filling by Copper Electroplating

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Study on Hole Filling of Porous PU/PEG Membrane and its Mechanical Properties

Study on Hole Filling of Porous PU/PEG Membrane and its Mechanical Properties

Hole Filling of a 3D Model by Flipping Signs of a Signed Distance Field in Adaptive Resolution

When we use range finders to observe the shape of an object, many occluded areas may occur. These become holes and gaps in the model and make it undesirable for various applications. We propose a novel method to fill holes and gaps to complete this incomplete model. As an intermediate representation, we use a Signed Distance Field (SDF), which stores Euclidean signed distances from a voxel to the nearest point of the mesh model. By using an SDF, we can obtain interpolating surfaces for holes and gaps. The proposed method generates an interpolating surface that becomes smoothly continuous with real surfaces by minimizing the area of the interpolating surface. Since the isosurface of an SDF can be identified as being a real or interpolating surface from the magnitude of signed distances, our method computes the area of an interpolating surface in the neighborhood of a voxel both before and after flipping the sign of the signed distance of the voxel. If the area is reduced by flipping the sign, our method changes the sign for the voxel. Therefore, we minimize the area of the interpolating surface by iterating this computation until convergence. Unlike methods based on Partial Differential Equations (PDE), our method does not require any boundary condition, and the initial state that we use is automatically obtained by computing the distance to the closest point of the real surface. Moreover, because our method can be applied to an SDF of adaptive resolution, our method efficiently interpolates large holes and gaps of high curvature. We tested the proposed method with both synthesized and real objects and evaluated the interpolating surfaces.

Filling in Holes : Television Music as a Recuperation of Popular Music on Television

When it comes to the scholarly study of popular music, television, in its various global, historical, and industrial manifestations, has a bad reputation. For example, in a 2002 Popular Music article, Simon Frith, after documenting rock music's debt to British television for spreading and popularizing it, determines that 'TV, for all its influence on rock performance, was never really part of its culture.' (Frith 2002, p. 288) That academic critics and journalists believe this to be true is indicated by the scant amount of engaging and potentially productive work about the combination of the two media and their industries.1 This critical lacuna may just speak to the newness of the discipline of popular music studies, although I fear that it emanates from the effect of the ideology of authenticity that, like it or not, continues to inform scholarship in the field.The study of popular music on television now faces challenges from another front, as what media historian Michele Hilmes describes as the 'always emerging, never emerged' field of sound studies may have finally surfaced (Hilmes 2005). Sound studies conferences, interest groups within larger scholarly organizations, and anthologies proliferate. This is a welcome development. Of concern is the possible submergence of the specificity and materiality of popular music under the more abstract notion of 'sound', and the potential development of a scholarly hierarchy in which film sound will once again trump television sound. In this scenario, it is possible if not likely that the study of popular music and television runs the risk of further marginalization. More optimistically, the institutionalization of sound studies could open the door for greater legitimization of popular music as an object of study within and through fields that study visual culture in all of its incarnations, including television, film, and new media. It could also, as will be discussed toward the conclusion, solidify popular music's status as media.The nature of audience engagement with both television and music is changing, as both are at the same time more portable and bigger than ever. Television viewing is no longer an 'event' that requires participation and attention at a particular time in a particular place. Digital technology makes television programming mobile and frees it more than ever from synchronous time. As television hardware and transmission technology advances, so does its sound quality. Devices such as the iPod miniaturize video programming as well as music, and store them both on the same piece of hardware that governs their use and access with the same metaphors (e.g. playlists). Concurrently, television is more an event than ever, and sound is very much invited to the party. High-definition television technology spawns high-definition sound technology, and both meet at the 50 LCD or plasma screen connected to a state of the art surroundsound system, all in the comfort of one's home. New media, which I interpret to mean digital or digitally-enhanced technologies, therefore threaten to render the boundary between popular music and television meaningless. The time is right to approach the study of music and television with fresh ideas and without ideological baggage. Changing the terms of analysis is a move in the right direction.For example, much qualitative research about the intersection of popular music and television focuses upon music video or music television, or uses them as reference points. Often this leads to work that is the scholarly equivalent of comparing apples to oranges by de-historicizing both popular music and television in the service of making them conform to a current model of their relationship.2 Music video usually refers to what are essentially commercials for new radio-friendly releases by bands signed to major labels. Music television refers to the cable television networks that (used to) air these commercials, but the two terms are often used interchangeably. …

3D VSP in the deep water Gulf of Mexico fills in subsalt ‘shadow zone’

One of the biggest challenges that exists for seismic imaging is subsalt. In the Mad Dog field, a complex salt body creates illumination problems with surface seismic imaging, resulting in ‘shadow zones’ where the surface seismic is blind to areas of subsalt structure. Figure 1 is a representative seismic section. Here the red line indicates the area around the crest of the structure that is poorly imaged by surface seismic. For subsalt imaging - it is well known that the salt geometry will strongly affect whether or not seismic signals can pass through the salt twice and so potentially be recorded at the surface and used to image the subsurface. A dipping base of salt has a strong effect here - as the dip of the base of salt increases beyond the critical angle no rays transmit through the top of salt twice and so will not be received by surface seismic acquisition systems (Muerdter et al., 2001). In this case one possibility to fill in these illumination holes is to place the receivers below the salt, resulting in only one travel path through the salt. In this paper we look at the use of 3D VSP using geophones placed below the obscuring salt to image structure at Mad Dog where the surface seismic is blind.

Parametrizations for triangular G k spline surfaces of low degree

In this article, we present regularly parametrized G k free-form spline surfaces that extend box and half-box splines over regular triangular grids. The polynomial degree of these splines is max{4 k + 1, ⌈3k/2 + 1⌉r}, where r ∈ ℕ can be chosen arbitrarily and determines the flexibility at extraordinary points. The G k splines presented in this article depend crucially on low-degree (re-)parametrizations of piecewise polynomial hole fillings. The explicit construction of such parametrizations forms the core of this work and we present two classes of singular and regular parametrizations. Also, we show how to build box and half-box spline surfaces of arbitrarily high smoothness with holes bounded by only n patches, in principle.

Problems of PCB microvias filling by conductive paste

The using of conductive paste for the through holes and the blind holes filling in PCBs were analyzed. Such processes seem to be easy and can be applied instead of common used electrochemical plating process. The performed investigations have shown that these processes are not so simple. To understand more problems connected with microvias filling, the influence of adhesive rheology and printing parameters for the quality of small diameter through holes filling and small diameter blind vias were investigated. The performed analysis was supplemented by electrical measurements as well as observation of microvia cross sections. The FR-4 laminate test samples with through holes with 0.3, 0.5 and 0.8 mm diameters as well as blind holes diameters 0.15, 0.3 and 0.45 mm were used in experiments. The average single fills resistances in the range 50 mΩ for through hole fillings diameter 0.5 mm and below 20 mΩ for blind holes diameter 0.3 mm was obtained. The adhesive fill resistance is stable after dump heat and thermal cycling tests.

Filling of nano-via holes by laser-assisted direct imprint

A new technique for filling narrow and high-aspect ratio nanoscale via holes by laser-assisted direct imprint has been proposed and developed. In the process, the filling material (e.g., metals or Si) is first deposited onto the nano-via holes by a deposition method that has a poor step coverage and hence fills the holes partially with voids. Then a mirror-flat transparent plate (mold) is pressed against the substrate, while an excimer laser pulse (XeCl, 308 nm wavelength, 20 ns pulse duration) shines through the mold. The laser pulse melts the filling material, and the flat mold presses the molten materials into the holes, filling them completely without voids. As examples, we successfully filled a hole array having 100 nm diameter, 500 nm depth (aspect ratio 5) and 200 nm inter-hole spacing (pitch) with e-beam evaporated silicon and copper. Besides superior step coverage and negligible thermal budget, this technique is fast and simple and doesn’t need a seed layer. Furthermore, it can planarize the wafer surface in addition to filling the holes. Clearly, this technique could be extended to other materials important for ICs metal interconnect, and may become an alternative to the dual damascene and CVD tungsten plug process used in the current ULSI fabrication.

Environment-Friendly Electronics: Lead-Free Technology

Environment-Friendly Electronics: Lead-Free Technology