Abstract
We reported filling of nanoscale holes with high aspect ratio by Cu electroplating with a supercritical carbon dioxide suspension (EP-SCS). The Cu film electrodeposited by the EP-SCS was smooth. The nanoscale holes with 70nm in diameter and aspect ratio of 2 and 5 can be filled by electrodeposited Cu with no voids and pinholes by the EP-SCS. Gap-filling capability of the EP-SCS is high for the nanoscale holes with high aspect ratio even when using Cu electrolyte originally designed to fill holes with 70nm diameter and aspect ratio 1 by conventional method.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
