In order to increase productivity and reduce the cost of wafers, we have developed a high temperature chemical vapor deposition (HTCVD) method that can realize the high-speed growth of 4H-SiC crystals. Tokuda et al. reported an interesting study in which the carrier lifetime of a substrate grown by HTCVD (HTCVD substrate) was considerably shorter than that of the substrate grown by physical vapor transport (PVT); moreover, bipolar degradation was highly suppressed when the HTCVD substrate was applied to PiN diodes [1]. Herein, we demonstrate that the short carrier lifetime of the HTCVD substrate is mainly attributable to the carbon vacancy (VC) and that VC particularly diffuses from the HTCVD substrate to the epitaxial layer.