A thin layer of gold grown epitaxially in a 3C–SiC/Si interface is observed using conventional (CTEM) and high-resolution electron microscopy (HREM) methods. This interlayer was formed after an extended thermal treatment, at 500°C for 500 h, of a 3C–SiC/Si system on which Au was deposited on the surface of SiC for the formation of a Schottky diode. Misfit dislocations are observed in both SiC/Au and Au/Si interfaces having Burgers vectors b= 1 2 〈1̄ 1 0〉 parallel to the interfaces. Such an epitaxy is made in spite of the very high misfit in the Au/Si interface. The net of the misfit dislocations is visible only by cross-section HREM observations. The position of the extra half-planes of the interfacial dislocations is illustrated. An explanation for the mechanism of the Au mass transport through the unaffected SiC film is given. This is attributed to pipe diffusion through the partial dislocations bounding the stacking faults and inversion domain boundaries that pre-exist in 3C–SiC. The same diffusion mechanism allows the transport of Si from the 3C–SiC/Si interface to the top surface of SiC on which islands of Si and Au are formed.
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