For modern large area coatings reactive dual magnetron sputtering (DMS) is a widespread technology. Economic constraints and advanced technology calls for increasing process flexibility regarding target utilization as well as the use of new materials. This in turn raises demands to the arc handling capabilities of the power supplies. On the one hand, a stable process at high arcing rates demands short arc blanking times and fast recovery to full output power. On the other hand, some materials tend to the formation of so-called “hard” arcs, with hot cathode spots. In this case, longer treatment times are needed. The benefit of modern arc handling capabilities is demonstrated for reactive SiO2 deposition from heavily used targets. For other demanding materials with low melting point, favourable operating modes are investigated.
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