We investigated the growth characteristics and interfacial properties of HfO₂ films deposited on Ge substrate through atomic layer deposited (ALD) by using an in-situ medium energyion scattering analysis. The growth kinetics of HfO₂ grown on a GeO₂/Ge substrate through ALD is similar to that grown on an SiO₂/Si substrate. However, the incubation period of HfO₂ deposition on Ge is shorter than that on Si. The HfO₂ grown on the GeO/Ge substrate shows a significant diffusion of Hf atoms into the substrate interface and GeO volatilization after annealing at 700℃. The presence of low-quality Ge oxide or suboxide may degrade the electrical performance of device.