The microelectronics industry has undergone significant technological advances in recent years. For example, the increase of circuit densities has required the introduction of the leadless chip carrier (LCC) and a redesign of conventional packaging. The extreme compactness of modern systems also requires weight reduction of the printed wire boards (PWBs). This weight reduction has been accomplished by the use of reinforced polymer/fibre composites which, because of their excellent mechanical properties, also improve the PWBs. The printed wire boards normally are made with epoxy and/ or polyimide polymers and are reinforced with E or S glass fabrics. Because some of the new speciality electronic systems must perform over a wide temperature range, they must be able to expand and contract during service. The major problem associated with mounting hermetic chip carriers (HCC) on PWBs is that the boards crack under thermal stresses because of unmatched coefficients of thermal expansion (CTEs). The HCC packages are usually made of alumina having a CTE value in the x, y directions of approximately 6 to 6.5 x 10-6/1m (/~m°C) ~ over the 5 0 to 130°C temperature range. On the other hand, the conventional polymer/fibre laminates have CTEs in the x, y directions of ,,~12 to 16 x 10-6/zm (/~m°C)1. The thermalexpansion characteristics of the PWB and the ceramic chip carrier can be more closely matched by replacing the glass fabric in the laminates with other materials, such as Kevlar 49, quartz, or ceramic fabrics, or with a combination of any two reinforcements which have lower coefficients of thermal expansion than glass. The ratio of polymer to reinforcement must be closely controlled to produce the required mechanical properties of the laminate and the CTE match. Conventional thermogravimetric analysis (TGA) is the preferred method to determine the amounts present in the polymer. However, when an organic reinforcement or a combination of organic and inorganic fibres are used, determining the laminate's composition is difficult, because under ordinary conditions all organic materials are lost during oxidation in air. More precisely, in the case of organic matrix composites containing aramid fibres, no accurate or accepted method of analysis exists. In this letter, we propose the use of differential thermogravimetric analysis (dTG) as an approach to obtain the desired measurements. However, complementary techniques such as Fourier-transform infrared spectroscopy (FTIR) and pyrolysis gas chromatography/mass spectrometry (GC/MS) must be used to describe fully the measured weight losses. The PWB samples used for this study were prepared by lamination techniques described elsewhere [1]. Several laminates were made, which contained quartz (J. P. Stevens and Co.) and/or Kevlar 49 (du Pont de Nemours and Co.) fabric as well as a fully imidized polyimide (Kerimid 601, Rhone Pomlene) and, in some instances, also an epoxy resin (proprietary formulation) to improve wetting of the Kevlar 49 fabric with the organic matrix. The TG measurements were made with a Mettler 3000 system operating under a stream of air at a heating rate of 20°C min -~. The dTG signals were obtained by data manipulation using a Mettler TC-10 microprocessor. Fig. 1 shows typical dTG curves, as a function of heat-up rate obtained for a laminate containing eight quartz layers, seven Kevlar-49 fabric layers, and cured Kerimid 601. At least three weight losses can be observed. The resolution of
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