Abstract
Abstract Dielectric, thermomechanical (TMA), dynamic mechanical analysis (DMA) and mechanical testing were used to study the changes which occurred due to varying heat-up rate during fabrication of two commercially available epoxy film adhesives, 3M Co. AF-163 and Hysol EA-9649. The mechanical strength of bonded joints decreased by approximately twenty-five percent when processed above a critical heat-up rate. The glass transition temperature (Tg) of the cured adhesive bonds was found to change in opposing directions with increasing heat-up rate for the two adhesives. This different response has been interpreted in terms of the chemistry associated with the rubber additive and catalysts used in the adhesive formulations.
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