Growth Interface Research Articles

Improvement of mid-wavelength InAs/InAsSb nBn infrared detectors performance through interface control

We report our study to optimize the growth of mid-wavelength InAs/InAsSb nBn infrared detectors through interface control method with AlSb/AlAs superlattices as electron barrier. The dark current model was employed to investigate the dominant dark current mechanism at various operating temperatures. We extracted the minority carrier lifetime of InAs/InAsSb material grown by different interface growth methods. Electrical and optical characterizations indicated superior performance of the device grown by migration-enhanced epitaxy (MEE) with a 3 s As and Sb soak time. With −0.3 V applied bias and 150 K operating temperature, the optimal device shown a dark current density of 8.95 × 10−6 A/cm2 and peak specific detectivity of 7.12 × 1011 cm Hz1/2/W at 3.8 µm.

Effects of the grain size and orientation of Cu on the formation and growth behavior of intermetallic compounds in Sn-Ag-Cu solder joints

The rapid development of semiconductor packaging technology has accelerated the applications of flip-chip bonding technology using fine-pitch micro bumps and Cu pillar bumps. These micro-bump systems are composed of metallic Cu and Sn. The properties of the Cu- and Sn-based bonding materials applied in these technologies have a significant effect on the mechanical properties and long-term reliability of micro-joints. This study focuses on the effects of the grain size and orientation of the Cu substrate on the formation and growth of intermetallic compounds (IMCs) at the Sn/Cu interface. The Cu substrate was annealed from 200 to 1000 °C to alter its grain size, which was measured via electron backscatter diffraction analysis. Sn-3.0Ag-0.5Cu (SAC) solder paste was printed onto the Cu substrate, and the Sn/Cu interfacial microstructure was observed by scanning electron microscopy and energy-dispersive X-ray spectroscopy after the reflow soldering process. A thin IMC formed on substrates with small grain sizes, whereas larger grain sizes resulted in the formation of thick and elongated IMCs. In addition, the IMC growth exhibited a specific directional preference in the (21̅1̅0) direction on substrates annealed at 1000 ℃. The effects of the Cu grain size and orientation on the interfacial reactions and growth of IMCs were compared and analyzed by observing IMCs formed at the SAC/Cu interface. Microstructural analysis revealed that controlling the Cu grain size and orientation significantly impacts the reliability of the solder joints. This study shows that the effect of grain size and orientation can be utilized to micro-solder joints, which can significantly enhance their mechanical strength and reliability.

The snowball effect in electrochemical degradation and safety evolution of lithium-ion batteries during long-term cycling

Lifespan and safety are the most critical issues for the application of lithium-ion batteries (LIBs). During long-term service, the degradation mechanisms and safety evolution of LIBs remain unclear, posing significant obstacles to battery design and management. This study analyzes the electrochemical degradation mechanisms of LIBs under normal temperature cycling (NTC) and high-temperature cycling (HTC) conditions, linking these mechanisms to the evolution of battery safety. The findings reveal that during NTC, there is a “snowball effect” in performance degradation and safety evolution, leading to sudden death of battery and posing serious safety risks. The degradation pattern of LIBs during NTC and HTC is consistently dominated by the increase of internal resistance and the loss of lithium inventory (LLI). In the aging process, electrolyte consumption and the growth of the solid electrolyte interface (SEI) cause localized lithium plating on the anode, resulting in accelerated capacity decay. However, in batteries subjected to NTC, rapid accumulation of localized lithium plating can trigger a snowball effect, causing electrode deformation, internal short-circuit (ISC) and separator melting. These interacting catastrophic events form a vicious cycle, ultimately leading to battery sudden death and pose significant safety hazards. Additionally, thermal safety analysis reveals the correlation between thermal safety parameters and state of health (SOH), quantifying the thermal safety degradation caused by sudden death. Sudden death directly alters the evolution pattern of battery safety, leading to a severe decline in battery safety. These findings offer new insights into potential safety hazards associated with long-term use of LIBs.

SnPbInBiSb high-entropy solder joints with inhibited interfacial IMC growth and high shear strength

The rapid advancements in microelectronic devices towards miniaturization and multifunctionality have led to an increasing demand for solder joints that exhibit enhanced mechanical properties and reliability. This study focuses on investigating the high-shear strength of SnPbInBiSb/Cu high-entropy solder joints. The analysis encompasses the microstructure evolution, interfacial reactions, and shear behavior of these solder joints after reflowing at 180 °C. The study reveals the formation of very thin intermetallic compound (IMC) layers, specifically Cu6Sn5 and Cu3Sn, at the SnPbInBiSb/Cu interface with an average thickness of about 1.04 μm following a 10min reflow. Transmission electron microscopy (TEM) analysis illustrates the presence of nanoscale precipitates of InSn3 or Sn3Sb phases dispersed within the Cu6Sn5 IMC. The high mixing entropy of the SnPbInBiSb solder contributes to the suppression of the interfacial IMC growth rate during the reflow process. Notably, the shear strength and fracture behavior of the SnPbInBiSb high-entropy solder joints are significantly influenced by the thickness of the interfacial IMC. In particular, solder joints reflowed at 180 °C for 10 min exhibit a high shear strength of 102.4 MPa with a ductile fracture mode.

Effect of Soret diffusion on the growth of spherical crystals in supercooled alloy melts under oscillatory flow.

The growth of spherical crystals in binary alloy melts with thermal diffusion effects under oscillatory flow is investigated analytically. Using the multiple scale method, we derive approximate analytical solutions for both the crystal interface growth rate and the solute concentration. Our results demonstrate that the Soret effect significantly influences both the solute concentration near the crystal interface and the crystal growth rate. Specifically, with a positive Soret coefficient, the growth rate of spherical crystals in a binary dilute alloy melt decreases as the coefficient increases, while the solute concentration near the interface increases. In contrast, with a negative Soret coefficient, the growth rate of the spherical crystals increases as the coefficient decreases, and the solute concentration near the interface decreases. Additionally, the presence of oscillatory flow markedly promotes the grain refinement induced by the Soret effect.

Influence of Substrate Polarity on Thermal Stability, Grain Growth and Atomic Interface Structure of Au Thin Films on ZnO Surfaces

Influence of Substrate Polarity on Thermal Stability, Grain Growth and Atomic Interface Structure of Au Thin Films on ZnO Surfaces

Effect of GPa-level pressure on the microstructure and properties of Cu-8Ni-1.8Si alloy

Reducing or completely eliminating the reticular grain boundary phases in alloys is crucial for enhancing the mechanical and electrical properties of Cu-Ni-Si alloys with high nickel and silicon content (Ni + Si > 5wt.%). In this study, we investigated the microstructure, mechanical properties, and electrical conductivity of Cu-8Ni-1.8Si (wt.%) alloy prepared by high-pressure solidification (HPS) and subsequent aging treatment. The interfacial growth stabilizes as the pressure reduces the crystal growth rate, inhibits the diffusion of solute atoms, and increases the solute partition coefficient. The reticulated Ni31Si12 and granular Ni2Si phases disappear under 6GPa pressure, forming a complete Cu (Ni, Si) solid solution. After direct aging treatment, the precipitated phase of the HPS alloy is β-Ni3Si at the early stage of aging. At the peak aging state, β-Ni3Si and δ-Ni2Si phases coexist in the matrix. Additionally, the Avrami equations for the phase transition kinetics of HPS alloys at different aging temperatures were derived from the electrical conductivity data, and the strength contributions from solid solution strengthening and precipitation strengthening were calculated. The alloy aged at 450 °C exhibited the largest volume fraction and the smallest average size of precipitates, resulting in a more pronounced obstruction effect of nano precipitates on dislocation bypassing and demonstrating the best precipitation strengthening effect. At the peak aging states, the alloy's hardness reaches 367.5 HV, and the compressive yield strength reaches 788.2MPa. These results indicate that high pressure is an effective method to improve the solid solution degree of alloying elements and enhance the mechanical properties of Cu-Ni-Si alloys.

Dendrite-Free Lithium Batteries Enabled by an Artificial High-Dielectric Biopolymer Interface Layer.

Lithium (Li) metal batteries face challenges, such as dendrite growth and electrolyte interface instability. Artificial interface layers alleviate these issues. Here, cellulose nanocrystal (CNC) nanomembranes, with excellent mechanical properties and high specific surface areas, combine with polyvinylidene-hexafluoropropylene (PVDF-HFP) porous membranes to form an artificial solid electrolyte interphase (SEI) layer. The porous structure of PVDF-HFP equalizes the electric field near metallic lithium surfaces. The high mechanical modulus of CNC (6.2 GPa) effectively inhibits dendrite growth, ensures the uniform flow of lithium ions to the lithium metal electrode, and inhibits the growth of lithium dendrites during cycling. The synergy of high polarity β-phase poly(vinylidene fluoride) (PVDF) and CNC provides over 1000 h of stability for Li//Li batteries. Moreover, Li//LiFePO4 (LFP) full cells with this artificial protective layer perform well at 5 C, showcasing the potential of this film in lithium metal batteries.

Microstructure of ternary Sn-Bi-xCu alloy on mechanical properties, current endurance and corrosion morphology via cycling corrosion test

Low melting temperature of Sn-58 wt% Bi (SB) solders adding 0.5 wt% Cu (SB05C) and 1.7 wt% Cu (SB17C) concentrations were evaluated for the signal transmission in the 3D IC package. Microstructure combined with phase analysis and Pandat simulation were together with to explain the relationship among the mechanical property, electrical endurance and corrosion resistance. By Cu decoration, the presence Cu6Sn5 intermetallic compound (IMC) acts as heterogeneous nucleation sites to reduce surface free energy and generate fine Bi grain that resulted in higher hardness value. The power-law was used to explain the mechanism of interfacial IMC growth, both Cu6Sn5 and Cu3Sn formation were speculated to be volume diffusion control and surface reaction domination, respectively. The fracture morphology by shear testing indicates that earliest plastic deformation accompanied with brittle rupture were major factors due to the intergranular fracture and Cu6Sn5 compound induced bulk fracture. By cycling corrosion test (CCT), the lump shape of SnO2 by-product was found among solders at three cycling. After seven cycling, Sn phase has been completely corroded and Cu6Sn5 IMC began to be corroded forming circle shape of Cu2O but Bi phase still not be corroded among solders. In the electrical endurance, dense Cu6Sn5 dispersed in solder bulk and fine grain size were feasible to induce current crowding and joule heating, thus Cu deteriorated SB solders is easily failed.

Growth mechanism and SERS effect of Ag nanowire arrays prepared by solid-state ionics method

Solid-state ionic method has attracted more and more attention due to its simple operation and controllable preparation, but its growth mechanism is still uncertain. In this work, Ag nanowire (Ag NW) arrays prepared by solid-state ionics method at 5 μA impressed currents using fast ionic conductor RbAg4I5 films and different metal electrodes were reported. The conduction mode of Ag+ in RbAg4I5 films, the growth mechanism of Ag NW arrays prepared by solid-state ionics method and the effect of microscopic morphology on surface-enhance Raman scattering (SERS) performance were investigated. The results show that Ag nanoparticles (Ag NPs) with diameters from 40 nm to 70 nm were attached to the surface of Ag NW arrays with diameters of 80–150 nm prepared with different metal electrodes, which lead to Ag NW arrays have high surface roughness. The conduction velocity and stability of Ag+ in RbAg4I5 films are closely related to the morphology of Ag NW arrays. The irregular electrode interface and apical growth advantage resulted in the fractal dimension of Ag NW arrays prepared with Ag electrodes is 1.69 due to macroscopic dendritic structure. Ag NW arrays have excellent SERS performance due to the many Ag NPs attached to the surface of the closely aligned Ag NWs, the limit of detection (LOD) for Basic Fuchsin (BF) and Crystal Violet (CV) detected by Ag NW arrays SERS substrates prepared with Ag electrodes are as low as 10−11and 10−14mol/L, respectively. This paper provides a reference for the preparation method of metal nanostructures, Ag NW arrays have good potential for application in the field of trace analysis.

Numerical model for the solidification of a chondrule melt

In this study, we propose a novel numerical method to simulate the growth dynamics of an olivine single crystal within an isolated, multicomponent silicate droplet. We aimed to theoretically replicate the solidification textures observed in chondrules. The method leverages the phase-field model, a well-established framework for simulating alloy solidification. This approach enables the calculation of the solidification process within the ternary MgO–FeO–SiO2 system. Furthermore, the model incorporates the anisotropic characteristics of interface free energy and growth kinetics inherent to the crystal structure. Here we investigated an anisotropy model capable of reproducing the experimentally observed dependence of the growth patterns of the olivine single crystal on the degree of supercooling under the constraints of two-dimensional modeling. By independently adjusting the degree of anisotropies of interface free energy and growth kinetics, we successfully achieved the qualitative replication of diverse olivine crystal morphologies, ranging from polyhedral shapes at low supercooling to elongated, needle-like structures at high supercooling. This computationally driven method offers a unique and groundbreaking approach for theoretically reproducing the solidification textures of chondrules.

Tailored micro-arc oxidation coatings to match with parylene for enhanced tribological performance of Ta-12W alloys

To improve the tribological properties of tantalum-tungsten alloys, dual-layer composite coatings are designed using micro-arc oxidation (MAO) and chemical vapor deposition (CVD) techniques. By adjusting the concentrations of NaOH and NaF additives as well as the oxidation mode (constant current/voltage) of MAO process, the microstructure and properties of underlying MAO layers are tailored for better matching with the top parylene layer, aiming to develop composite coatings capable of service under heavy loads. A comprehensive study is conducted to evaluate the effect of these parameters on the growth, microstructure, bond strength, and mechanical properties of MAO coatings, along with their subsequent impact on the friction and wear behavior under various loads for composite coatings. The findings reveal that increasing the concentration of either NaOH or NaF significantly increases the coating thickness, surface porosity, crystallinity, and hardness of MAO coatings, by promoting the spark discharge activities. However, distinct interfacial growth behavior is observed due to anionic effects caused by OH− and F−. The oxidation mode plays a crucial role in determining the mechanical quality of coatings; the constant voltage mode facilitates dense coatings with high adhesion due to its self-repairing mechanism. Furthermore, wear tests confirm that the enhanced mechanical properties and open-porosity of the MAO coatings markedly improve the tribological performance of composite coatings. This improvement is attributed to the excellent load-bearing capacity provided by hard MAO layers, as well as the anchoring and storage capabilities of the textural porous surfaces. The optimized composite coating demonstrates long-lasting low friction even under heavy loads up to 80 N.

Thiol-functionalized conductive Co-MOF and its derivatives S-doped Co(OH)2 nanoflowers for high-performance supercapacitors

The low conductivity of many traditional metal–organic-framework (MOF)-based electrode limits their developments in the field of electrochemical energy storage and still of great challenge. The controllable preparation of various kinds of nanomaterials using thiol-functionalized MOF shows great prospects. In this work, a thiol-functionalized metal–organic framework sheet structure (Co-MOF/NF) on nickel foam was successfully prepared by in situ interfacial growth synthesis, which was transformed into its derivatives S-doped β-Co(OH)2 nanoflowers Co-x/NF (x = 1, 2 and 6) in different concentrations of KOH solutions through ion etching/exchange reaction. The pristine thiol-functionalized Co-MOF/NF and its derivatives Co-x/NF (x = 1, 2 and 6) nanoflower-like arrays could be used as positive electrode materials for effective supercapacitors. Among them, the transformation of the nanoflower-like Co-1/NF electrode exhibits excellent electrochemical properties with high areal capacitance (1925 ± 23 mF/cm2 at 1 mA/cm2), good rate performance, excellent conductivity and decent cycling stability. The Co-1//AC ASC device provides a high energy density of 0.176 mWh/cm2 (92.6 Wh/kg) at a power density of 0.745 mW/cm2 (392.1 W/kg). And this Co-1//AC ASC device exhibits a good cycling stability and practical application in energy storage field. This study provides a new strategy for the pristine thiol-functionalized MOF and its conversion nanostructures for energy storage applications.

(Invited) In-Situ Observation of Silicon Solution Growth: Observation Principle and Effect of Al Addition to Si-Cr Solvent

The in-situ interface observation of silicon carbide (SiC) solution growth effectively elucidates various phenomena occurring at the growth front. To investigate this observation technique from the perspective of the optical transmission properties of SiC, the optical absorption properties of 3C-, 4H-, and 6H-SiC were measured over a wide range of temperatures. The obtained absorption properties indicate the optical conditions necessary for in-situ observation and the possibility of identifying different polytype inclusions. Furthermore, the effect of Al addition to the Si-Cr solvent on the SiC growth interface, where Al addition is known to be effective for growing high-quality SiC, was investigated by in situ observations. It was clarified that the presence of Al suppressed the formation of step pinning, resulting in preventing the formation of bunching steps and subsequent roughening of the growth interface.

Molecular insights into the synergistic inhibition mechanisms of antifreeze protein and methanol on carbon dioxide hydrate growth

The formation of CO2 hydrates during CO2 transportation and deep-sea injection poses a significant risk of pipeline blockage. Combining kinetic (KHIs) and thermodynamic hydrate inhibitors (THIs) serves as a promising efficient and economical strategy to mitigate this issue, whose performance and microscopic mechanisms yet are still poorly understood. This study employs molecular dynamics simulations to explore the effects of the combination of winter flounder antifreeze protein (wf-AFP) as a KHI and methanol as a THI on CO2 hydrate growth. We find that methanol and wf-AFP exhibit an intriguing synergistic inhibition performance on hydrate growth. In the AFP-only system, AFP serves as a spatial hindrance near the hydrate growth interface. However, in the AFP + methanol system, AFP changes its position due to the attractive force of methanol. Part of the AFP fragment remains on the hydrate interface, while the rest surrounds the CO2 droplet. Methanol, in addition to disrupting the water structure, combines with AFP to act as a double barrier to CO2 dissolution into the aqueous solution, thereby significantly reducing the gas source for hydrate growth. These findings provide molecular-level insights into hydrate inhibition mechanisms and guide the design of efficient inhibitors for safe CO2 transportation and injection.

Unraveling conditions for W-shaped interface and undercooled melts in Cz-Si growth: A smart approach

In Cz-Si growth, concave and W-shaped solid–liquid interfaces and undercooled melts are primary contributors to the degradation of crystal quality, particularly structure loss, defect generation, non-uniform dopant distribution, and crystal twisting, making their avoidance crucial. We employed a classification tree machine learning approach to investigate the importance of 15 process and furnace design parameters and their critical ranges for the formation of various types of W-shaped interfaces and undercooled melts at different scales, both in dimensional and dimensionless forms, and across a wide range of process conditions. Moreover, symbolic regression was used to predict minimal melt temperature based on the aforementioned inputs. Training data were obtained by CFD modeling. The classification tree for combined output identified the Grashof, Reynolds for crystal, and Stefan numbers, along with the percentage of silicon solidified, as the most decisive inputs. Symbolic regression for the temperature of undercooled melt highlighted crucible diameter, pulling rate, and the power of the bottom heater as key parameters.

Interfacial characteristics and thermal stability of polymer-derived SiCf/Ti composite fabricated by powder hot isostatic pressing

The novel SiCf/Ti composite is prepared by hot isostatic pressing (HIP) with polymer-derived (PD) SiC fiber and powder titanium alloy as raw materials in this work. The interfacial characteristics and thermal stability of the PD SiCf/Ti composite have been systematically investigated. The interfacial properties of the PD SiCf/Ti composites are quantified to discuss the interfacial reaction mechanisms and kinetics. The results show that with the proposed HIP process, the powder matrix can be near-fully dense, and the matrix and SiC fiber are well bonded with a uniform interfacial layer. The major interfacial products are C-Ti compounds and Si-Ti compounds, which are formed by atomic diffusion reaction. During subsequent thermal exposure conditions, the interfacial layer growth is temperature-dependent and diffusion-controlled, following the parabolic relation and Arrhenius law. The frequency factor k0 is 102–103 times lower than that in the chemical vapor deposition (CVD) SiCf/Ti composites, showing better interfacial thermal stability. After thermal exposure, the element diffusion becomes significant, and the microhardness of the near-interface zone is noticeably greater than the matrix microhardness because of the atomic diffusion of C. The microhardness of both the matrix and near-interface zone reaches the highest value after 900 °C/9 h thermal exposure. It is concluded that the PD SiCf/Ti composites with good thermal stability can be successfully fabricated by powder HIP.

Alkaline-resistant covalent organic framework membranes for selective hydroxide ion separation

Alkali holds a pivotal role in the chemical industry, however, the substantial discharge of alkaline wastewater causes a severe waste of resources and environmental pollution. Conventional polymer membranes have ether bonded backbones and form randomly assembled nanochannels, suffering from a weak alkali resistance and a low hydroxide ion selectivity. Covalent organic frameworks (COFs), known for their robust framework structure, highly ordered channels, and tunable channel chemistry, have been considered as the competent candidate for alkaline-resistant membranes for selective hydroxide ion separation. Herein, we fabricate a β-ketoenamine COF (TpTAPB) membrane with a high alkaline resistance via the interfacial growth strategy. After post-sulfonation, the negatively charged channels of sulfonated TpTAPB membrane allows OH- with smaller size and lower charges to pass through while repulsing WO42- ions, achieving a selectivity of OH-/WO42- up to ∼ 60 and surpassing commercial and most reported polymeric membranes. This work expands the application scope of COF membranes in selective alkali separation.

The Evolution of Interfacial Intermetallic Compound Growth and Solder Joint Strength of Sn-40Pb/Cu under Thermal Aging

The Evolution of Interfacial Intermetallic Compound Growth and Solder Joint Strength of Sn-40Pb/Cu under Thermal Aging

Effect of Fe-Co catalysis on the temperature field distribution during the growth of 3C-SiC fibers synthesised by microwave heating

Microwave heating produce local hot spots on materials, which result in uneven heating and other issues. Regulate the microwave temperature field using different catalyst combinations such as Fe (NO3)3·9H2O and Co (NO3)2·6H2O. The electromagnetic and temperature field distributions of 3C–SiC fibers and the molecular dynamics of the SiC interfacial growth process and interfacial oxidation reaction during microwave heating in the presence of a catalyst were simulated and calculated respectively. The results show that the combination of Fe and Co at 9 wt% catalyst concentration can effectively improve the electromagnetic loss capability of SiC fibers. The Fe and Co bimetallic catalysed synthesis of 3C–SiC fibers follows a vapor–liquid–solid growth mechanism. The Fe–Si and Fe–Co–Si alloy phases can induce 3C–SiC growth along (111) crystal faces. The simultaneous exothermic reactions provide a highly catalytically active growth environment that facilitates the enhancement of microwave temperature field uniformity. This phenomenon facilitated the synthesis of 3C–SiC fibers.