Glass Packages Research Articles

Glass Package With Multiple Embedded Dies for mmWave Applications

Glass Package With Multiple Embedded Dies for mmWave Applications

A Conceptual Study on Usage of Cloth and Glass package for the Reduced Plastic Footprint Which Arises due to Impulsive Buying in E-Commerce Platforms

Abstract: E-commerce platforms have proliferated, revolutionising consumer purchasing behaviour and enabling more convenient shopping from any location at any time. But because of its ease, there has been a marked increase in impulsive purchases, which has greatly increased the amount of plastic waste. This study investigates the relationship between the rise in plastic waste that occurs from impulsive purcphasing on e-commerce platforms. The purpose of this study is to demonstrate the negative environmental effects of the current e-commerce ecosystem and offer viable solutions to reduce plastic waste by examining consumer behaviour, packaging standards, and waste management concerns. The relationship between impulsive purchasing on e-commerce platforms and the rise in plastic waste is examined in this qualitative study. The study attempts to determine the reasons behind through in-depth interviews and thematic analysis

Energy Consumption Analysis in SCADA: A Case Study in the Glass Container Industry

Given the present geopolitical scenario and global energy crisis, there is a growing demand to cut energy use, particularly in industry. The glass package manufacturing business has been severely hit by the rise in energy prices in recent years, and most likely this trend will continue. There is a lack of instruments for effiectively anticipating furnace usage when it comes to managing the infrastructure's energy expenditure in the glass industry, which is the case of the BA Glass Avintes company. Because the furnaces are the key energy expenditure source in the plant, getting a thorough understanding of their energy consumption is an important step towards making educated decisions. The purpose of this study is to undertake a detailed analysis of gas and electricity usage for the three furnaces at the BA Glass Avintes facility using data obtained from PowerStudio SCADA. It was investigated which regression model produced the best accurate results when precisely adjusted to the BA Glass Avintes shop-floor setting. The findings indicate that linear regression models may not be appropriate for this application, however tree-based methods, notably the decision tree model, provide promising outcomes. Furthermore, for increased model performance, the study emphasises the necessity of a bigger training dataset and a shorter prediction interval.

Losartan potassium liquid formulation for paediatric hospital use: development and stability evaluation

ObjectivesThis study aimed to develop a liquid oral formulation containing losartan potassium, an angiotensin II receptor antagonist drug used for its antihypertensive activity, and to perform a preliminary stability assessment...

A BIOCOMPATIBLE GLASS-ENCAPSULATED TRIAXIAL FORCE SENSOR FOR IMPLANTABLE TACTILE SENSING APPLICATIONS.

This paper reports a microfabricated triaxial capacitive force sensor. The sensor is fully encapsulated with inert and biocompatible glass (fused silica) material. The sensor comprises two glass plates, on which four capacitors are located. The sensor is intended for subdermal implantation in fingertips and palms and providing tactile sensing capabilities for patients with paralyzed hands. Additional electronic components, such as passives and IC chips, can also be integrated with the sensor in a hermetic glass package to achieve an implantable tactile sensing system. Through attachment to a human palm, the sensor has been shown to respond appropriately to typical hand actions, such as squeezing or picking up a bottle.

Glass Package and Through Glass Via (TGV) for MEMS

Menlo Microsystems has introduced a glass-based MEMS switch that utilizes through glass via (TGV) technology. Created in the R&D labs at GE, these MEMS solutions combined with utilization of glass packaging, has enabled the creation of the highly reliable Ideal Switch™. It is the world’s smallest, most reliable, and efficient micro-mechanical switch that can be used for numerous applications, including power. Several advantages are gained by taking advantage of the low electrical loss of glass and hermetic TGV. The TGV technology enables >60% smaller package size relative to wirebond. Parasitics are reduced by >75% and devices have a wide operational bandwidth from DC to > 50 GHz. Devices can have dozens of switches in a small form factor that give reliable performance over billions of cycles. Leading up to the volume production of these devices, Menlo has helped drive the glass supply chain to an increased level of maturity. In this talk we will provide an overview of Menlo’s glass package for the Ideal Switch™ technology as well as discuss the growing maturity and emerging capabilities in the glass/TGV supply chain.

Glass Devices for Next-Generation Packaging and RF Signal Conditioning

The push for higher communications frequencies, greater system integration, and smaller space imparts many unique challenges on RF and packaging engineers in the development of next generation cellular products for 5G, WiFi 6, Military, and other applications. Traditional materials, such as LTCC, organic laminates, and silicon face major limitations to dramatically improve system size, weight, and performance (SWAP). Photosensitive Glass-Ceramics (PSG) have gained a lot of attention as a next generation RF and RF packaging substrate for their ability to simultaneously solve these two important challenges. In this paper the authors will present on our work using PSG for RF and RF packaging solutions. We will share (1) the advantages of using PSG for advanced RF packages, and (2) our work demonstrating glass as an RF substrate integrating discrete components and embedded die for passive RF filters, and (3) our work towards building vertically stacked glass packages for advanced RF systems-in-package (SiP). The described work presents a manufacturing platform for the production of vertically stacked glass substrates with integrated high Quality Factor passive devices, such as inductors and capacitors, and heterogeneously integrated surface mount devices for advanced RF systems-in-package. The presented material demonstrates a production and assembly process for the manufacturing of advanced systems. In this paper, we present design, production, assembly considerations that impact size, weight, and performance (SWAP) metrics for a variety of product definitions and multiple simulation vs. product testing to demonstrate a reliable design to product flow.

Investigating the price effects of honey quality attributes in a European country: Evidence from a hedonic price approach

AbstractThis study investigates the price effects of honey quality attributes in Spain. Price and product characteristics are collected from 264 honey labels found on the shelves of the main representative retail stores available in the national territory. The marginal effects and the implicit prices of honey characteristics are assessed through a hedonic price approach. Results show that the prices of honey are affected by leader brands sold in gourmet stores and hypermarkets in glass packages compared to producer brands sold in discounts stores and supermarkets in plastic packages. The organic production and the protected designation of origin quality labels generate positive marginal effects on the prices of honey, as well. Regarding the origin of honey, the highest relative and absolute consumer price premiums are received for honey coming from the European Union and Spain compared with blend honey coming from EU and non‐EU countries. Consumer implicit prices are also influenced by mono‐floral and gourmet honey with additional properties (e.g., ginseng) compared with the multifloral varieties. These findings are a useful source for a better understanding of the evolution of honey in the Spanish market. Spanish beekeepers who can differentiate their honey, may use these results as an orientation for their business strategies.

Effect of Light on the Oxidative Stability and Phthalate Levels of Black Cumin Oil-Corn Oil Blends in Plastic and Glass Bottling.

Black cumin oil (BC) contains certain phytochemicals, including phenolics, tocopherols, and sterols, which show strong oxidation stability. In this study, BC was blended with refined corn oil (CO) at two concentrations (5% and 10%, w/w) and stored in plastic and glass bottles under light and dark conditions. Under light-storage conditions, blended oils in plastic bottles showed lower peroxide value (PV) and conjugated diene value (CD) compared to the control sample than dark-storage. It was also aimed to examine the phthalate levels in oil samples and evaluate the products' safety. Five main phthalates, namely di(2-ethylhexyl) phthalate (DEHP), dibutyl phthalate (DBP), butyl-benzylphthalate (BBP), diisononyl phthalate (DiNP), and diisodecyl phthalate (DiDP), were evaluated. In dark and light storage conditions, the phthalate level was determined below the LOQ value in CO without added BCO in the plastic and glass bottles. In the plastic-packaged blended samples, DEHP was determined above the LOQ value in dark storage, while BBP was detected in addition to DEHP in the samples stored under the light. On the other hand, phthalate values were determined below the LOQ value in all samples stored in glass packages under the light. DEHP was the most abundant phthalate in plastic-packaged blended oils under light storage, ranging from below the LOQ (0.23 mg/kg) to 0.83 mg/kg. Based on the present findings, BC improved the stability of CO under light storage, and the phthalate levels of blended oils did not exceed the specific migration limits (SMLs) for each phthalate.

Glass Package for Radar MMICs Above 150 GHz

This work presents a novel sensor packaging and a novel transition concept for radar applications above 150 GHz based on glass material. By using laser induced deep etching (LIDE) technology, glass vias and cavities are fabricated without degrading the mechanical stability of glass, as micro-cracks are completely avoided. Especially at high millimeter wave (mm-wave) frequencies, precise structuring on low dielectric loss materials and a high integration density are essential for low loss transitions. In this paper, an ultra compact FMCW radar monolithic microwave integrated circuit (MMIC) at 160 GHz is used to demonstrate this packaging technology. In addition, the high frequency signal is guided by a low loss transition to a deposed antenna via a dielectric waveguide (DWG) providing the antenna front end with mechanical flexibility. Thus, using plated through glass vias (TGVs) and a circulating solder ring, the package is hermetically sealed. The optical transparent glass package has a size of only <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">${5.8}\,\rm {mm}\times {4.4}\,\rm {mm}\times {0.9}\,\rm {mm}$</tex-math></inline-formula> . A minimum measured insertion loss of 2.85 dB at 162 GHz from chip to DWG is achieved. The complete radar system with a range resolution of 12 mm is demonstrated via radar measurement.

Application of Life Cycle Assessment to chemical recycling of post-use glass containers on the laboratory scale towards circular economy implementation

Large quantities of post-use glass packages are produced globally, that so need to be treated as waste: this is cause of a global environmental concern. Therefore, efforts are required for optimisation and promotion of re-use and recycling practices with a waste valorisation-oriented approach in a circular economy context.In this context, the study was aimed at documenting environmental damages and improvements related to recycling glass cullet into sodium silicate in water solution on a lab-scale chemical process. Life Cycle Assessment was applied for this purpose according to the specialised International Standards.The study highlighted that the environmental hotspots of the process stay in the production of electricity and of sodium hydroxide as both required for the chemical reaction development. Those two input items contribute 81.94% and 14.33% of the total damage associated with the whole lab process, that is equal to nearly 36.5 μpt.A 64% environmental damage reduction could be obtained by sourcing the process electricity requirements by means of a photovoltaic plant.Furthermore, through a sensitivity analysis, the authors proved that the investigated sodium silicate is appreciably more environmentally sustainable than the virgin-origin counterpart, whose environmental profile was measured in nearly 43 μpt.The study can be considered as a proof that, already in the design phase on a lab-scale dimension, it is possible to identify recycling paths that may contribute to implementing sustainable circular models of the economy.

High Stability of Liquid-Typed White Light-Emitting Diode with Zn0.8Cd0.2S White Quantum Dots

In this study, we demonstrate a new design of white light-emitting diode (WLED) with high stability and luminous efficiency as well as positive aging. Colloidal ternary Zn0.8Cd0.2S (named Zn0.8) white quantum dots (WQDs) were prepared by chemical route and dispersed in xylene, integrating them into an ultraviolet light-emitting diode (UV-LED) to form WQD-white light emitting diode (WQD-WLED). High efficiency, high color quality and excellent reliability of WQD-WLED with neutral white correlated color temperature (CCT) can be obtained. The experimental results indicate that the stability of relative luminous efficiency and color rendering index (CRI) of the WQD-WLED can reach up to 160 and 82%, respectively. Moreover, the WQD-WLED can operate more than 1000 h under 100 mA, and the quantity of WQDs in the glass package can be reduced.

Influence of Packaging Material on Polyphenol Content and Antioxidant Activity in Some Commercial Beers

Using two methods (ferric reducing antioxidant power and radical scavenging activity), the total polyphenol content (Folin–Ciocalteu reagent) and polyphenol patterns (HPLC) in 10 commercial lager beer brands produced in Romania was determined. Samples bottled in glass, plastic and aluminium packages were analysed for each brand when available. Results have indicated considerable variations in the total and individual phenolic contents as well as antioxidant activity across beer brands. Gallic and feulic acids were the dominant phenolic compounds identified samples. The statistical analysis indicates a significant difference between the levels of antioxidant activity detected using DPPH and FRAP, for all three types of material considered. The statistical test ANOVA indicates that the polyphenol concentration is similar across all types of material.

High-Gain Millimeter-Wave Holographic Antenna in Package Using Glass Technology

A novel concept for a holographic antenna in package is presented, enabling the seamless integration of high-gain antennas at millimeter-wave frequencies. The antenna is based on a holographic impedance approach stimulating a leaky wave mode at 150 GHz. Since the antenna structure is placed on top of the glass package, a large antenna aperture with high angular beamwidth and efficiency was achieved. The surface wave launcher of the antenna connected to the integrated active circuitry is designed in a very compact fashion using a vertical through-glass-via and solder balls. The performance of the proposed holographic antenna package has been investigated by an analytic model and full-wave simulations. The measurement results of the antenna prototype on glass using anisotropic unit cells show excellent agreement to the simulated values. A maximum gain of 24.7 dBi, a sidelobe level of 15 dB, and a 3 dB beamwidth of 4.7 $^\circ$ are achieved. The measured 3-D radiation pattern shows a highly directive pattern in all cuts.

Effect of UV Irradiation on Storage of Riviera Olive Oil in Glass Bottles Coated with BNNSs/PVB Multilayer Thin Film

UV absorbers are used to reduce the harmful effects of UV rays and to ensure that the properties of the materials are adequately protected. To protect against UV rays, one of the UV absorber molecules can reduce the combined energy of radiation to thermal energy that provides less energy in a photophysical process. Inorganic materials such as metal oxide semiconductors can effectively absorb UV irradiation and exhibit good heat-resistance properties. TiO2, CeO2, and ZnO are inorganic compounds with UV protective properties. Since some of these compounds are colored, their use is limited. Boron nitride nanosheets (BNNSs) are alternative UV inhibitors to these inorganic compounds. In this study BNNSs/PVB multilayer thin films were produced for the protection of glass packages using the dip-coating method. Riviera olive oil (RO-oil) samples in the both coated and uncoated bottle were exposed to UV irradiation for different times (75, 170, 360 and 720 hours). After the UV irradiation at different times, the total phenol and antioxidant contents in RO-oil were determined by Folin Ciacalteu and DPPH methods. The color change of RO-oil after UV irradiation was determined by UV visible spectrophotometer. Specific absorption coefficients K232 and K270 in the ultraviolet region were measured to determine the oxidation degree of RO-oil after degradation. Free fatty acid (FFA) of RO-oil after UV irradiation was determined by the titration method. According to the results of the analysis, the acidity values of RO-oil were preserved 20 times compared to the uncoated glass bottle after 720 hours UV. BNNSs/PVB coating was also effective in preserving total phenol, antioxidant contents and oxidation state of RO-oils under long term UV irradiation.

Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias

This article presents the design and demonstration of a high-bandwidth antenna-in-package (AiP) module focusing on low-loss interconnects and Yagi–Uda antenna performance fabricated on a 100- $\mu \text{m}$ low coefficient-of-thermal-expansion (CTE) glass for the 28-GHz band. It shows the modeling, design, and characterization of key technology building blocks along with the process development of advanced 3-D glass packages. The building blocks include impedance-matched antenna-to-die signal transitions, Yagi–Uda antenna, and 3-D active–passive integration with backside die assembly on 100- $\mu \text{m}$ glass substrates. The design and stack-up optimization of antenna-integrated millimeter-wave (mm-wave) modules is discussed. Process development to achieve high-density interconnects and precise dimensional control in multilayered thin glass-based packages is also described. The characterization results of the key technology building blocks show an insertion loss of 0.021 dB per through-package via (TPV), leading to the whole-chain loss of less than 1 dB and a return loss lower than 20 dB. The fabricated Yagi–Uda antenna features high repeatability of wide bandwidth due to the process control enabled by glass substrates. The antenna measurements show a bandwidth of 28.2%, which covers the entire 28-GHz fifth-generation (5G) frequency bands (n257, n258, and n261). The flip-chip assembled low-noise amplifier with 80- $\mu \text{m}$ solder balls shows a maximum gain of 20 dB as desired. The performance of the glass-based package integrated antennas is benchmarked to other 5G substrate technologies, such as organic laminates or co-fired ceramic-based substrates.

Segmentation method based modeling and analysis of a glass package power distribution network (PDN)

Segmentation method based modeling and analysis of a glass package power distribution network (PDN)

Through Glass Vias for hermetically sealed High Frequency Application

In this work we demonstrate the fabrication and use of a glass interposer platform with Through Glass Vias (TGVs) for high frequency applications. The platform is part of a versatile hermetically sealed glass package including passive and active devices (radar sensor, pressure sensors, infrared sensors). Glass has ideal properties for such applications, like excellent chemical resistance, mechanical strength and low costs. The hermetic sealing allows the seamless operation in hazardous environments. The TGVs may be deployed, for instance, in miniaturized sensor systems as vertical DC and RF interconnections with reduced parasitics for improved performance of the sealed device, while maintaining the hermetic sealing. TGVs provide a superior RF performance compared to bonding wires for frequencies &amp;gt;20 GHz and will provide larger bandwidths. TGVs improve the performance drastically and will give us an easy way to provide a hermitically sealed connection to the inner circuitries of the package. We investigate the whole process chain of the fabrication of the metallized TGVs. Initially 200 mm glass wafer with a thickness of 500 μm are used. Vias are created by laser-induced deep etching (LIDE). Subsequently, selective metallization of wafer surface areas and TGV sidewalls is carried out. Vias with diameters ranging from 50 μm to 1mm are created. The wafer thickness is reduced to 465 μm during the via production. Thus vias with an aspect ratio of 1:9 to 2:1 are created on one wafer. The vias with the high-aspect ratio are filled by sputtering with an appropriate seed layer for electroplating. Depending on the via geometry and the aspect ratio, normal DC sputtering is not viable. Thus, High Power Impulse Magnetron Sputtering (HIPIMS) is utilized to deposit a thin film of titanium and copper. Titanium served as the adhesion layer and copper is used as the conductive seed layer for the following electroplating step. Then, electroplating is carried out to line the different sized TGVs and create a conducting path through the wafer. Afterwards, the metallization in the vias has to be exposed by removing only the plated copper and sputtered titanium on top of the wafer by a combination of etching and chemical mechanical polishing. In the following steps, the front and backside are sputtered and coated with a resist to allow electroplating of the RDL on both backside and front side. Finally, the wafer is diced and measured. The LIDE process shows excellent repeatability with respect to the position and shape of the TGVs on all axes. The repeatability of the shape is critical for the following TGV metallization and the matching of the simulated RF behaviour compared to the behaviour of the fabricated structures. The metallization process of the TGVs shows very promising results regarding the repeatability of the formation of the TGVs and the metallization inside the vias. Different shapes and dimensions of vias could be metallized with the same process, which makes it stable against deviations in the structures to be fabricated on the wafer The measured RF properties of the realized structures are very promising and showing that the usage of glass and TGVs improves the performance in the millimetre wave regime significantly, compared to conventional bonding wires.

Performances and procedures modules in micro electro mechanical system packaging technologies

Abstract This paper presents the challenging issues in micro electro mechanical system (MEMS) packing technologies. The MEMS package includes a MEMS device and a signal conditioning electronic circuit. In one viewpoint, MEMS application is categorized by the type of sensor, actuator, and structure. MEMS technology applications in general domains are automotive, consumer, industrial, biotechnology and commercial applications. Few methods such as the low power oven, vacuum, and silicon glass packages were discussed. The major technique as die level and wafer level of packing including thin-film packing were reviewed in this paper. The problem of several failure mechanisms and challenges and their solutions were discussed in this review.

A bimodal endoscopic imager in a glass package

We present the first endoscopic imaging probe that combines full-field white light video microscopy and 3D optical coherence tomography (OCT) in a single miniaturized instrument. Designed as an instrument for the working channels of conventional endoscopes, the presented system has dimensions of mm3 (l × w × h) and is an important step towards practical multi-modal optical biopsy systems for clinical use. The video modality has a sensor-limited resolution and a total field of view of 10 μm and 1.17 mm in diameter, respectively. The OCT modality works in a scanned imaging arrangement and provides 3D optical tomograms with a lateral resolution of 43.5 μm. An integrated tubular piezoelectric fiber scanner is used to perform en face scanning necessary for the 3D OCT measurements. The entire system is assembled and encapsulated within a glass package fabricated via 3D laser microstructuring, a technology which addresses the major issues of micro-optic assembly precision and biocompatibility.