Abstract

This work presents a novel sensor packaging and a novel transition concept for radar applications above 150 GHz based on glass material. By using laser induced deep etching (LIDE) technology, glass vias and cavities are fabricated without degrading the mechanical stability of glass, as micro-cracks are completely avoided. Especially at high millimeter wave (mm-wave) frequencies, precise structuring on low dielectric loss materials and a high integration density are essential for low loss transitions. In this paper, an ultra compact FMCW radar monolithic microwave integrated circuit (MMIC) at 160 GHz is used to demonstrate this packaging technology. In addition, the high frequency signal is guided by a low loss transition to a deposed antenna via a dielectric waveguide (DWG) providing the antenna front end with mechanical flexibility. Thus, using plated through glass vias (TGVs) and a circulating solder ring, the package is hermetically sealed. The optical transparent glass package has a size of only <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">${5.8}\,\rm {mm}\times {4.4}\,\rm {mm}\times {0.9}\,\rm {mm}$</tex-math></inline-formula> . A minimum measured insertion loss of 2.85 dB at 162 GHz from chip to DWG is achieved. The complete radar system with a range resolution of 12 mm is demonstrated via radar measurement.

Highlights

  • The increased demand for low-cost and compact radar sensors in the last decades pushed the radar development to millimeter wave frequencies

  • This paper presents a novel packaging concept on glass, which allows high integration density on low-cost substrate material and optical transparency

  • This paper presents an ultra compact, mechanically detachable, and low loss transition from a monostatic transceiver monolithic microwave integrated circuit (MMIC) to a dielectric waveguide (DWG)

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Summary

INTRODUCTION

The increased demand for low-cost and compact radar sensors in the last decades pushed the radar development to millimeter wave (mm-wave) frequencies. High integration density on MMICs reduces the number of components on printed-circuit-boards (PCB) and the sensor price Packaging these chips with RF signals above 150 GHz is challenging, as decreases in radiation efficiencies are provoked by Teflon based substrate materials and insufficient structuring accuracy. In order to reduce transmission losses, antenna structures are often implemented on chip (AoC) [7]–[9] since lossy interfaces to the package or to the PCB are avoided In this way, low fabrication tolerances are achieved at the expense of a larger chip area and reduced radiation efficiency on silicon substrate materials [10].

GLASS TECHNOLOGY
TRANSITIONS
MMIC-TO-GLASS LAYER 2
SIW IN GLASS LAYER 2
SIW-TO-DWG TRANSITION
RADAR SENSOR
Findings
CONCLUSION
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