Glass Package and Through Glass Via (TGV) for MEMS

Abstract

Menlo Microsystems has introduced a glass-based MEMS switch that utilizes through glass via (TGV) technology. Created in the R&D labs at GE, these MEMS solutions combined with utilization of glass packaging, has enabled the creation of the highly reliable Ideal Switch™. It is the world’s smallest, most reliable, and efficient micro-mechanical switch that can be used for numerous applications, including power. Several advantages are gained by taking advantage of the low electrical loss of glass and hermetic TGV. The TGV technology enables >60% smaller package size relative to wirebond. Parasitics are reduced by >75% and devices have a wide operational bandwidth from DC to > 50 GHz. Devices can have dozens of switches in a small form factor that give reliable performance over billions of cycles. Leading up to the volume production of these devices, Menlo has helped drive the glass supply chain to an increased level of maturity. In this talk we will provide an overview of Menlo’s glass package for the Ideal Switch™ technology as well as discuss the growing maturity and emerging capabilities in the glass/TGV supply chain.