Generation IC Research Articles

Predicting delamination in plastic IC packages and determining suitable mold compound properties

This paper proposes that the critical stress intensity factor obtained in an adhesion test between the leadframe and the mold compound,can be used as a criterion for predicting delamination. A finite element stress analysis of the adhesion test determines the critical stress intensity factor K/sub IIC/ corresponding to the measured maximum strength. Delamination between the leadframe chip pad and the mold compound occurs when the maximum stress intensity value, K/sub II/ for the package exceeds the critical value K/sub IIC/. The validity of the proposed criterion was verified by experiments on different plastic SOJ packages molded with different molding compounds under different moisture conditions. These findings suggest that for any new IC package, an optimised package design together with a mold compound with the necessary properties that will not result in delamination can be defined on the outset of any new package development. The results of this work can be used to avoid exhaustive experimental trials, enabling savings in both time and cost in new package development. They can also be used to set directions for mold compound manufacturers on the requirements of compounds for future generation IC devices. >

Opportunities in high performance ICs

The high performance of next generation ICs will, according to worldwide market analysts Henderson Ventures, help create new OEM markets. Among the devices helping to make those equipment markets worth $317bn by 1996 will be GaAs ICs. What are the prospects for this market, where are the applications? Most importantly, which companies are in the Top 10 league of manufacturing production for advanced ICs such as GaAs ICs?

Aluminum Nitride-An Alternative Ceramic Substrate for High Power Applications in Microcircuits

The development of more complex integrated circuits (IC's) with larger chip sizes and greater power generation IC's, emitter-coupled logic (ECL) circuits, very large-scale integration (VLSI), and laser diodes requires new packaging schemes with improved thermal management. From the limited number of some ten nonmetallic inorganic solids known from the literature to have thermal conductivities greater than 100 W/m°K, aluminum nitride (AIN) is the most attractive substrate material. By means of a suitable power technological process, an AIN ceramic has been produced with a thermal conductivity five times higher than that of alumina, which is about one half of the theoretical value estimated for defect-free single crystal AIN. Another advantage of this newly developed material is its low coefficient of thermal expansion which, in the temperature range of interest (20-200°C) closely matches that of silicon. It also has a high electrical resistivity and a moderate dielectric loss. These and some other physical, mechanical, and chemical properties are shown and partly discussed in relation to other ceramics in use or of potential interest as substrate materials.

Second Generation IC's for Color TV Receivers (Part II)

Second Generation IC's with high performances for color TV's have newly been developed and now put into actual use. The IC's consist of five big IC's, which are for VIF, SIF audio, video chroma, jungle and horizontal and vertical oscillators, and vertical output. These five packages of IC's cover all the circuitry that can be designed into IC's with advantage and reduced component counts of a color TV receiver typically from 500 to 300 which is comparable with that of a black and white TV, and reduced assembly and adjustment time by 35 to 40%, resulting in ease of production and improved reliability.

Second Generation IC's for Color TV Receivers (Part I)

Second Generation IC's with high performances for color TV's have newly been developed and now put into actual use. The IC's consist of five big IC's, which are for VIF, SIF audio, video chroma, jungle and vertical and horizontal oscillators, and vertical output. These five packages of IC's cover all the circuitry that can be designed into IC's with advantage and reduced component counts of a color TV receiver typically from 500 to 300 which is comparable with that of a black and white TV, and reduced assembly and adjustment time by 35 to 40%, resulting in ease of production and improved reliability.

AN Integrated Circuit for Chrominance Signal Processing in Color-TV Receivers

The development of a multifunction integrated circuit which processes the detected video signals in a NTSC color television is described. A first generation IC has been produced which regenerates the color subcarrier using APC loop techniques. A gain controllable, chroma amplifier is also included on the chip. This IC represents the first step in a program to develop a high performance, low cost, single chip chroma processing system. Careful consideration has been given to system partitioning to maximize functional capabilities while maintaining flexibility and low cost. A detailed description of the subcarrier regenerator and chroma amplifier is given in Section II and Section III. The overall circuit organization is discussed in Section IV.