The paper describes in detail the basics of manufacturing printed circuits and all relevant interactions with the currently used methods of desmearing. A matrix proposes the optimal method to choose depending on the given needs of an application. The first part discusses the general layup of printed circuits, the commonly used sequences of manufacturing, different types of construction and, of most importance to the desmear processes, the polymeric nature of widely used laminates. Single processes of the through‐plating sequence, as well as the consequences of desmearing for subsequent assembly operations, are highlighted. An overview of currently used methods of desmearing is given with respect to commonly used process parameters as well as the basics of the relevant chemical reactions. The second part of the paper focuses on selection of the optimal desmear method, depending on the nature of the material for a given application, namely the different polymers utilised in rigid, rigid‐flex and microwave circuits. The paper ends with a survey of practical ways to monitor the process capability of any desmear process.
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