Forward Current-voltage Characteristics Research Articles

Hole diffusion effect on the minority trap detection and non-ideal behavior of NiO/β-Ga2O3 heterojunction

A NiO/β-Ga2O3 heterojunction was fabricated by sputtering a highly p-doped NiO layer onto β-Ga2O3. This heterojunction showed a low leakage current and a high turn-on voltage (Von) compared to a Ni/β-Ga2O3 Schottky barrier diode. The extracted Von from the NiO/β-Ga2O3 heterojunction's forward current–voltage characteristics was ∼1.64 V, which was lower than the extracted built-in potential voltage (Vbi) obtained from the capacitance–voltage curve. To explain this difference, deep level transient spectroscopy and Laplace-deep level transient spectroscopy were employed to study majority and minority traps in β-Ga2O3 films. A minority trap was detected near the surface of β-Ga2O3 under a reverse bias of −1 V but was not observed at −4 V, indicating its dependence on hole injection density. Using Silvaco TCAD, the hole diffusion length from P+-NiO to β-Ga2O3 was determined to be 0.15 μm in equilibrium, which is increased with increasing forward voltage. This finding explained why the trap level was not detected at a large reverse bias. Moreover, hole diffusion from NiO into β-Ga2O3 significantly affected the β-Ga2O3 surface band bending and impacted transport mechanisms. It was noted that the energy difference between the conduction band minimum (CBM) of β-Ga2O3 and the valence band maximum (VBM) of NiO was reduced to 1.60 eV, which closely matched the extracted Von value. This supported the dominance of direct band-to-band tunneling of electrons from the CBM of β-Ga2O3 to the VBM of NiO under forward bias voltage.

Bio-mimicking the melanogenesis pathway using tyrosinase for dopamine sensing

An electrochemical sensor was fabricated using tyrosinase functionalized metal oxide nanoparticles that were used to detect dopamine (DA). The copper oxide nanoparticles (Cu2O NPs) were synthesized by hydrothermal method using Artemisia absinthium leaf extract. The surface morphology, optical characterization, and elemental composition of synthesized nanoparticles were characterized by various analytical instruments. The Line-weaver relationship was used to estimate the Km and Vmax values of the tyrosinase enzyme. Differential pulse voltammetry and cyclic voltammetry techniques were used to record the electrochemical responses of DA at Tyr/Cu2O NPs/GCE modified electrode. The modified electrode exhibits enhanced electro-catalytic activity towards DA more than the bare electrode that was supported by the lowering of critical voltage in the forward current-voltage characteristics. The Tyr/Cu2O NPs/GCE modified electrode exhibits a limit of detection (LOD) of 0.3 µM with a linear range of 10 µM to 70 µM concentration. Further study demonstrated that the modified electrochemical device had excellent repeatability and high selectivity to DA in the presence of various interference molecules. Analyses of real-world samples were demonstrated to estimate the practical applicability of Tyr/Cu2O NPs/GCE modified electrode.

Effect of drift layer doping and NiO parameters in achieving 8.9 kV breakdown in 100 μm diameter and 4 kV/4 A in 1 mm diameter NiO/β-Ga2O3 rectifiers

The effect of doping in the drift layer and the thickness and extent of extension beyond the cathode contact of a NiO bilayer in vertical NiO/β-Ga2O3 rectifiers is reported. Decreasing the drift layer doping from 8 × 1015 to 6.7 × 1015 cm−3 produced an increase in reverse breakdown voltage (VB) from 7.7 to 8.9 kV, the highest reported to date for small diameter devices (100 μm). Increasing the bottom NiO layer from 10 to 20 nm did not affect the forward current–voltage characteristics but did reduce reverse leakage current for wider guard rings and reduced the reverse recovery switching time. The NiO extension beyond the cathode metal to form guard rings had only a slight effect (∼5%) in reverse breakdown voltage. The use of NiO to form a pn heterojunction made a huge improvement in VB compared to conventional Schottky rectifiers, where the breakdown voltage was ∼1 kV. The on-state resistance (RON) was increased from 7.1 m Ω cm2 in Schottky rectifiers fabricated on the same wafer to 7.9 m Ω cm2 in heterojunctions. The maximum power figure of merit (VB)2/RON was 10.2 GW cm−2 for the 100 μm NiO/Ga2O3 devices. We also fabricated large area (1 mm2) devices on the same wafer, achieving VB of 4 kV and 4.1 A forward current. The figure-of-merit was 9 GW cm−2 for these devices. These parameters are the highest reported for large area Ga2O3 rectifiers. Both the small area and large area devices have performance exceeding the unipolar power device performance of both SiC and GaN.

Current transport in Ni Schottky barrier on GaN epilayer grown on free standing substrates

In this paper, the Ni Schottky barrier on GaN epilayer grown on free standing substrates has been characterized. First, transmission electrical microscopy (TEM) images and nanoscale electrical analysis by conductive atomic force microscopy (C-AFM) of the bare material allowed visualizing structural defects in the crystal, as well as local inhomogeneities of the current conduction. The forward current-voltage (I-V) characteristics of Ni/GaN vertical Schottky diodes fabricated on the epilayer gave average values of the Schottky barrier height of 0.79 eV and ideality factor of 1.14. A statistical analysis over a set of diodes, combined with temperature dependence measurements, confirmed the formation of an inhomogeneous Schottky barrier in this material. From a plot of ΦB versus n, an ideal homogeneous barrier close to 0.9 eV was estimated, similar to that extrapolated by capacitance-voltage (CV) analysis. Local I-V curves, acquired by means of C-AFM, displayed the inhomogeneous distribution of the onset of current conduction, which in turn resembles the one observed in the macroscopic Schottky diodes. Finally, the reverse characteristic of the diodes fabricated in the defects-free region have been acquired at different temperature and its behaviour has been described by the thermionic field emission (TFE) model.

Traps inhomogeneity induced conversion of Shockley–Read–Hall recombination in NiO/β-Ga2O3 p+–n heterojunction diodes

In this Letter, the trap inhomogeneity within β-Ga2O3 is correlated with the conversion of Shockley–Read–Hall (SRH) recombination in NiO/β-Ga2O3 p+–n heterojunction diodes. For the virgin epi-wafer, both near-surface traps E2 (EC-0.82 eV) and E3 (EC-1.11 eV) and bulk E2* traps (EC-0.76 eV) are identified by a transient capacitance analysis, and the corresponding forward current–voltage characteristics of diodes are well fitted in the framework of field-dependent SRH recombination. The SRH recombination rates for E2, E3, and E2* traps are determined to be 1.3 × 107, 8.6 × 108, and 2.4 × 108 s−1, respectively. In this circumstance, carrier transport under forward bias is governed by trap-assisted tunneling through E3 traps with high recombination rates, and the hysteresis is pronounced. With the removal of the defective surface layer, E2 and E3 traps are almost completely eliminated, together with the reduced density of E2* traps to 5.6 × 1014 cm−3. The resultant diode performs an improved rectification ratio of >1011 at ±3 V and an enhanced reverse breakdown voltage of 1692 V. The elimination of near-surface traps leads to the conversion of carrier transport into the conventional SRH recombination, accompanied by the negligible forward hysteresis characteristics. The established fundamental correlation of carrier transport and traps within Ga2O3 is beneficial to develop a high-performance power rectifier toward practical applications.

Lateral p-type GaN Schottky barrier diode with annealed Mg ohmic contact layer demonstrating ideal current–voltage characteristic

We have demonstrated the fabrication process for a lateral p-type Schottky barrier diode (SBD) with the annealed Mg ohmic contact layer on a MOVPE-grown p-GaN wafer and measured the electrical characteristic of the diode. Because of the selective-area ohmic contact, the interface between the Schottky electrode and p-type GaN is well protected from any damage introduced by dry-etching or regrowth. The ideality factor of the forward current–voltage characteristic is as low as 1.09 at room temperature and an on–off ratio above 109 is also achieved. Various metals are deposited as the Schottky electrode and the work function dependence of the Schottky barrier height is confirmed with a pinning factor of 0.58. The temperature dependence of the current–voltage characteristic indicates that the GaN p-type SBD still fits the thermionic emission mode at 600 K with an ideality factor of 1.1. The reverse current of the p-SBD is also studied with the Poole–Frenkel emission model, and the trap energy level in the p-GaN is confirmed.

Ultrawide bandgap vertical β-(AlxGa1−x)2O3 Schottky barrier diodes on free-standing β-Ga2O3 substrates

Ultrawide bandgap β-(AlxGa1−x)2O3 vertical Schottky barrier diodes on (010) β-Ga2O3 substrates are demonstrated. The β-(AlxGa1−x)2O3 epilayer has an Al composition of 21% and a nominal Si doping of 2 × 1017 cm−3 grown by molecular beam epitaxy. Pt/Ti/Au has been employed as the top Schottky contact, whereas Ti/Au has been utilized as the bottom Ohmic contact. The fabricated devices show excellent rectification with a high on/off ratio of ∼109, a turn-on voltage of 1.5 V, and an on-resistance of 3.4 mΩ cm2. Temperature-dependent forward current-voltage characteristics show effective Schottky barrier height varied from 0.91 to 1.18 eV while the ideality factor from 1.8 to 1.1 with increasing temperatures, which is ascribed to the inhomogeneity of the metal/semiconductor interface. The Schottky barrier height was considered a Gaussian distribution of potential, where the extracted mean barrier height and a standard deviation at zero bias were 1.81 and 0.18 eV, respectively. A comprehensive analysis of the device leakage was performed to identify possible leakage mechanisms by studying temperature-dependent reverse current-voltage characteristics. At reverse bias, due to the large Schottky barrier height, the contributions from thermionic emission and thermionic field emission are negligible. By fitting reverse leakage currents at different temperatures, it was identified that Poole–Frenkel emission and trap-assisted tunneling are the main leakage mechanisms at high- and low-temperature regimes, respectively. Electrons can tunnel through the Schottky barrier assisted by traps at low temperatures, while they can escape these traps at high temperatures and be transported under high electric fields. This work can serve as an important reference for the future development of ultrawide bandgap β-(AlxGa1−x)2O3 power electronics, RF electronics, and ultraviolet photonics.

Characteristics of leakage currents in InGaN/AlGaN nanowire-based red microLEDs.

III-nitride nanowire (NW) LEDs have been intensively studied for several emerging applications. However, the performance of these LEDs is still limited due to many factors. A leakage current may cause idle power consumption and affect the reliability and luminescence efficiency of the devices. Hence, it is one of the most important limiting factors from an application point of view. In this context, we have experimentally observed temperature-dependent forward and reverse leakage current-voltage characteristics of InGaN/AlGaN NW-based red microLEDs. The characteristic curves are fitted using different constant parameters such as the space charge term, zero bias current, and the characteristic energy. They are found to have error bars of less than 10%. The extra space charge term is believed to be due to inherent space charges trapped with the NWs and presents at every instance of the operation of the diode. The characteristic energy and ideality factors are compared to the reported values. An Arrhenius plot is used to calculate the thermal activation energy in the high- and low-temperature regions for both bias conditions. Our results show that the voltage-dependent activation energy is found to be about double in the case of the forward bias compared to that of the reverse bias in all voltage ranges. However, in a high voltage regime, the magnitudes of these parameters are almost four and six times greater for the forward and reverse biases, respectively, compared to those in the lower voltage regions. This study presents vital insight into the design and fabrication of high-performance NW-based LEDs.

Ga+ Focused Ion Beam Damage in n-type Ga2O3 and Its Recovery after Annealing Treatment

Focused Ga+ ion milling of lightly Si-doped, n-type Ga2O3 was performed with 2–30 kV ions at normal incidence and beam currents that were a function of beam voltage. The electrical effects of the ion damage were characterized by Schottky barrier height and diode ideality factor on vertical rectifier structures comprising 10 µm epitaxial n- Ga2O3 on n+ Ga2O3 substrates, while the structural damage was imaged by Transmission Electron Microscopy. The forward current-voltage characteristics showed significant deterioration at 5kV. The I-V characteristics no longer showed rectification for the 30kV condition. Subsequent annealing up to 400°C produced substantial recovery of the I-V characteristics for all beam energies and was sufficient to restore the initial ideality factor completely for beam energies up to 5kV. A remarkable reduction of dislocations can be observed in 30 kV ion exposed sample after annealing at 400°C.

Quasi-vertical diamond temperature sensor by using Schottky–pn junction structure diode

A Schottky–pn junction structure diode (SPND) has been fabricated on HPHT Ib (001) diamond substrate for temperature sensor application. The forward current-voltage characteristics show an obvious temperature dependency with the turn-on voltages decrease with the increasing temperature. It demonstrates that three types of current transport mechanisms are found at different forward bias voltages. Furthermore, based on the good linear relationship between the turn-on voltages and temperatures, the sensing ability is evaluated at the sub-threshold region. At low current densities (<10−2 A/cm2) high thermal sensitivities are reached (>4.75 mV/K, with a maximum value of 5.31 mV/K at 10−3 A/cm2 of current density) which is remarkably above the sensitivity obtained by other semiconducting material devices. Furthermore, the deviation of sensitivity from the theoretic model is attributed to the relatively higher ideality factor value.

Ga+-focused ion beam damage in n-type Ga2O3

Focused Ga+ ion milling of lightly Si-doped, n-type Ga2O3 was performed with 2–30 kV ions at normal incidence and beam currents that were a function of beam voltage, 65 nA for 30 kV, 26 nA for 10 kV, 13 nA for 5 kV, and 7.1 nA for 2 kV, to keep the milling depth constant at 100 nm. Approximate milling rates were 15, 6, 2.75, and 1.5 μm3/s for 30, 10, 5, and 2 kV, respectively. The electrical effects of the ion damage were characterized by Schottky barrier height and diode ideality factor on vertical rectifier structures comprising 10 μm epitaxial n-Ga2O3 on n+ Ga2O3 substrates, while the structural damage was imaged by transmission electron microscopy. The reverse bias leakage was largely unaffected even by milling at 30 kV beam energy, while the forward current-voltage characteristics showed significant deterioration at 5 kV, with an increase in the ideality factor from 1.25 to 2.25. The I–V characteristics no longer showed rectification for the 30 kV condition. Subsequent annealing up to 400 °C produced substantial recovery of the I–V characteristics for all beam energies and was sufficient to restore the initial ideality factor completely for beam energies up to 5 kV. Even the 30 kV-exposed rectifiers showed a recovery of the ideality factor to 1.8. The surface morphology of the ion-milled Ga2O3 was smooth even at 30 kV ion energy, with no evidence for preferential sputtering of the oxygen. The surface region was not amorphized by extended ion milling (35 min) at 5 kV with the samples held at 25 °C, as determined by electron diffraction patterns, and significant recovery of the lattice order was observed after annealing at 400 °C.

Schottky diodes based on 4H-SiC epitaxial layers

Forward and reverse current-voltage (IV) characteristics of Cr-SiC (4H) Schottky diodes based on epitaxial layers with doping (1-3)· 1015 cm-3 were studied in the temperature range of 300-550 K. It is shown that in many cases the IV characteristics are close to ideal, but a significant spread of the forward IV characteristics of diodes manufactured in the same way on the same epitaxial layer was found, probably due to the spread of the Schottky barrier heights reaching 0.3 eV. Heating of the diode, as well as packaging, can also change the Schottky barrier height. An alternative explanation suggests the presence of a powerful shunt.

Simulation of forward current-voltage characteristics for Schottky diodes with MOS trenches

Present work is devoted to the development of a mathematical model for the forward current-voltage characteristic of Schottky diodes with a metal – oxide – semiconductor (MOS) trench structure, which takes into account the accumulation of the main carriers in silicon near the walls of the trenches at a forward bias. The proposed model considers the decrease of the series resistance of the Schottky diode drift region with an increase in the voltage at the rectifying contact due to the enrichment of silicon with electrons near the walls of the trenches. The proposed model is compared with the experimental results for Schottky diodes with a metal – oxide – semiconductor trench structure with a nominal reverse voltage of 45.0 V and a nominal forward current of 50.0 A. It is shown that the error in calculating the direct voltage value for the new model does not exceed 1.2 % in the range of direct currents from 20.0 to 50.0 A, which is 4.6–9.7 times less than the calculation error for the classical model. The results obtained can be used to develop the structure and geometry of Schottky diodes with a metal – oxide – semiconductor trench structure with required electrical parameters.

Effects of silicon surface defects on the graphene/silicon Schottky characteristics

Distinct characteristics and yet adverse in some cases have been widely reported in the graphene/silicon Schottky junction under DC biasing, for biological and chemical sensing, or as a photodetector. The explanations to these observations are often attributed to the nature of the graphene layer but are still far from satisfactorily for many cases. In this work, we conducted a detailed analysis on both the forward and reverse current-voltage characteristics under different temperatures and we proposed that the silicon surface defects, which had been well-known as Pb0 centers or ≡Si, should play an important role in the adverse characteristics observed in the Gr/Si junction. Compared with the metal/Si and oxide/Si interface, the graphene-isolated Pb0 centers at the Gr/Si interface are chemically inactive but are still electrically active and that modify the carrier transportation over the junction barrier. Without efficient chemical passivation, the graphene-covered Si surface should maintain the most native Si surface such that it preserves a much higher amount of Pb0 centers as compared with other Si junctions or interfaces. This should be the main origin for the reported adverse current-voltage characteristics.

Crystal orientation dependence of deep level spectra in proton irradiated bulk β-Ga2O3

The effects of 20 MeV proton irradiation with fluences of 5 × 1014 and 1015 p/cm2 on electrical properties of lightly Sn doped n-type (net donor concentration 3 × 1017 cm−3) bulk β-Ga2O3 samples with (010) and (−201) orientation were studied. Proton irradiation decreases the net donor density with a removal rate close to 200 cm−1 for both orientations and similar to the electron removal rates in lightly Si doped β-Ga2O3 epilayers. The main deep electron traps introduced in the β-Ga2O3 crystals of both orientations are near Ec−0.45 eV, while in Si doped films, the dominant centers were the so-called E2* (Ec−0.75 eV) and E3 (Ec−0.1 eV) traps. Deep acceptor spectra in our bulk –Ga2O3(Sn) crystals were dominated by the well-known centers with an optical ionization energy of near 2.3 eV, often attributed to split Ga vacancies. These deep acceptors are present in a higher concentration and are introduced by protons at a higher rate for the (010) orientation. Another important difference between the two orientations is the introduction in the surface region (∼0.1 μm from the surface) of the (010) of a very high density of deep acceptors with a level near Ec−0.27 eV, not observed in high densities in the (−201) orientation or in Si doped epitaxial layers. The presence of these traps gives rise to a very pronounced hysteresis in the low temperature forward current–voltage characteristics of the (010) samples. These results are yet another indication of a significant impact of the orientation of the β-Ga2O3 crystals on their properties, in this case, after proton irradiation.

Effects of Downstream Plasma Exposure on β-Ga2O3 Rectifiers

The effects of downstream plasma exposure with O2, N2 or CF4 discharges on Si-doped Ga2O3 Schottky diode forward and reverse current-voltage characteristics were investigated. The samples were exposed to discharges with rf power of 50 W plasma at a pressure of 400 mTorr and a fixed treatment time of 1 min to simulate dielectric layer removal, photoresist ashing or surface cleaning steps. Schottky contacts were deposited through a shadow mask after exposure to avoid any changes to the surface. A Schottky barrier height of 1.1 eV was obtained for the reference sample without plasma treatment, with an ideality factor of 1.0. The diodes exposed to CF4 showed a 0.25 V shift from the I–V of the reference sample due to a Schottky barrier height lowering around 14%. The diodes showed a decrease of Schottky barrier height of 2.5 and 6.5% with O2 or N2 treatments, respectively. The effect of plasma exposure on the ideality factor of diodes treated with these plasmas was minimal; 0.2% for O2 and N2, 0.3% for CF4, respectively. The reverse leakage currents were 1.2, 2.2 and 4.8 μA cm−2 for the diodes treated with O2, and CF4, and N2 respectively. The effect of downstream plasma treatment on diode on-resistance and on-off ratio were also minimal. The changes observed are much less than caused by exposure to hydrogen-containing plasmas and indicate that downstream plasma stripping of films from Ga2O3 during device processing is a relatively benign approach.

Electron transport properties of electrically doped guanine nano-sheet based bio-Zener diode: a first principle paradigm

The quantum ballistic transmission properties of an electrically-doped guanine-nanosheet-based bio-Zener diode are investigated using density functional theory and nonequilibrium Green’s function-based first-principles calculations. The bio-Zener diode is gate-bias modulated, and its various quantum-electronic properties, for example, the V–I characteristic, the transmission spectra, and the device density of states, depend on both the electrical doping concentration and on the applied gate bias voltage. The junctionless highly doped bio-Zener diode shows high levels of reverse-bias current which is dominated by majority charge carriers. It is also found that, due to the presence of a wide bandgap and the backscattering effect, the forward-bias current is highly suppressed. The quantum simulation results confirm a strong reverse gate-bias-modulated biased current–voltage response as well as a charge transport phenomenon through the effective device region. The bio-Zener diode exhibits a specific reverse breakdown that can be varied from −0.78 to −3.2 V without affecting the forward current–voltage characteristic. The current findings are obtained by including the coherent tunneling and incoherent hopping processes with a minimal Hamiltonian model approach.

Effect of high temperature irradiation with 15 MeV protons on characteristics of power SiC Schottky diodes

The effect of high-temperature irradiation with 15 MeV protons on the parameters of high-voltage 4H-SiC Schottky diodes has been studied at irradiation temperatures of 23–500 °C and doses in the range from 7 × 1013 to 2 × 1014 cm−2. After the irradiation with a dose of 1014 cm−2 at room temperature, the forward current at a forward voltage U = 2 V decreases by ~10 orders of magnitude. In this case, the cutoff voltage Uc, equal to ~0.6 V in unirradiated devices, decreases to Uc ≈ 0.35 V. By contrast, irradiation with the same dose at a temperature of 500 °C leads to an increase in Uc up to Uc ≈ 0.8 V. At the same reference value of the forward voltage U = 2 V, the decrease in current, compared to the value in unirradiated devices, was smaller by ~4 orders of magnitude. In the entire range of doses and irradiation temperatures under study, the forward current–voltage characteristic of diodes at U > Uc is linear up to U ≤ 2 V.

Effects of incomplete ionization on forward current–voltage characteristics of p-type diamond Schottky barrier diodes based on numerical simulation

The forward current–voltage characteristics of p-type diamond pseudo-vertical Schottky barrier diodes are investigated via numerical simulation. Impact ionization decrease the hole concentration of the p− drift layer from 1015 to 1014 cm–3 at 300 K, thereby increasing the forward voltage drop and on-resistance. When we consider an incomplete ionization with increasing temperature, the increase in the hole concentration is more dominant than the enhanced phonon scattering, thereby resulting in an increasing forward current. We modified the Ohmic contact for both metallic conduction at the p+ layer and incomplete ionization at the p– drift layer. The Baliga figure-of-merit of the device with and without incomplete ionization is 25 and 192 MW cm−2, respectively. Incomplete ionization should be considered in the numerical study of diamond power devices.

Nearly Fermi-level-pinning-free interface in metal/heavily-doped SiC Schottky structures

The barrier heights in Ti/ and Ni/n-SiC Schottky barrier diodes (SBDs) in a wide range of the donor density (N d = 2 × 1017–1 × 1019 cm−3) were investigated. The forward current–voltage characteristics in the heavily-doped SBDs (N d > 2 × 1017 cm−3) are described by the thermionic field emission (TFE) model, which includes an electron tunneling induced by the high electric field (> MV cm−1) at the Schottky interface. The high electric field also causes significant image force lowering (Δϕ ∼ 0.2 eV) in the heavily-doped SBDs (N d = 1 × 1019 cm−3). Through the analysis carefully considering such strong image force lowering, the same slope of the barrier height versus the metal work function plot (S ∼ 0.7) is obtained regardless of N d. This indicates that metal/SiC interfaces are nearly free from Fermi-level pinning independent of N d.