In this study, the solid-state bonding of the Cu-to-Cu parallel connection with no fusion zone and keyhole formation was achieved using the refill friction stir spot welding (RFSSW) process. During the refilling process, significant plastic flow and thermo-compressive behavior promoted geometric and continuous dynamic recrystallization behaviors and highly oriented (111) microstructures, serving as key mechanisms to prevent work-hardening loss and reinforce the joint. Furthermore, the refinement of the grain size without work-hardening loss, increased by 50.8 % which was from 61 Hv in the base material to 92 Hv in the thermo-mechanically affected zone (TMAZ). Even, the hardness of the TMAZ/stir zone interface noticeably increased up to 138 Hv as the reduction in the stacking fault energy (SFE) due to the infiltration of Al element at the trace from the tool. The contribution of microstructural features to the mechanical property was quantitatively investigated by a modified Hall-Petch relationship in terms of the grain size, sub-grain size, and dislocation density. This study systematically investigated the driving forces for the implementation of Cu-to-Cu direct bonding, where work-hardening loss can be suppressed, through the RFSSW process from the perspective of dynamic recrystallization behavior and SFE due to partial alloying of Al elements.