Flagship Conference Research Articles

Through the Looking Glass—The 2023 Edition: Trends in solid-state circuits from ISSCC

The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2023 is “Building on 70 Years of Innovation in Solid-State Circuit Design.” The IC design community has proved to be agile and resilient in a world scarred by the worldwide pandemic, and this year’s ISSCC commemorates the 70th anniversary of ISSCC with an edition that is more than ever focused on innovation. To enhance our lives and support increasingly more innovative developments, ISSCC promotes and shares new circuit ideas with potential to advance the state of the art for IC design and enable systems with ever-improving functionality and efficiency.

Looking Back at a Successful Year [President’s Message

As 2022 comes to a close, I cannot help but reflect on the many things that we accomplished together this year. The highlight of the year is that our flagship conference and most of our sponsored conferences have been held “in person.” All conferences have enjoyed tremendous success, with strong participation, wonderful scientific discussions, and exchanges of ideas. Our 2022 IEEE International Symposium on Antennas and Propagation and U.S. National Committee for the International Union of Radio Science Radio Science Meeting, held in July, in Denver, CO, USA, was a truly memorable event: the technical program consisted of approximately 1,400 orally presented papers, 15 parallel technical sessions during each day of the conference, 24 special sessions, and 11 short courses and workshops. There were approximately 1,500 registered attendees, and a record number of over 600 students registered. Highlights of the symposium included three outstanding keynote presentations from industry, government, and large international collaborations; 50 exhibitors in one of the best-attended exhibits recorded at our flagship conference; and 10 interactive industrial demonstrations. The next six editions of our flagship conference, in 2023–2028, will take place in four different countries around the world. With preparations well underway, fantastic venues selected, and dedicated organizing committees onboard, these events promise to be great successes, as well.

From the chair

This special year-end issue is Part 1 of a two-part follow-up to our flagship conference, SC22. This part announces the professional society and conference award winners. The next issue will include perspectives from our student members and conference participants and other editorial content.

2022 PES Meeting: Back in Person at Our Flagship Conference [Society News

2022 PES Meeting: Back in Person at Our Flagship Conference [Society News

Atlanta: mathematics and music

ABSTRACT In this review, we summarize the key topics discussed at the Mathematics and Computation in Music (MCM) conference held in Atlanta from June 21–24, 2022. MCM is the flagship conference of the Society for Mathematics and Computation in Music. The subjects of the presentations included combinatorics and graph theory in scales and rhythm, categorical and algebraic approaches to music, algorithms and modelling for music and music-related phenomena, among many others that will be described.

Our Flagship Conference and SHE in ECE [Cope Corner

W e are excited to share with you that the IEEE Antennas and Propagation Society (AP-S) flagship conference, the 2022 IEEE AP-S International Symposium on Antennas and Propagation and U.S. National Committee–International Union of Radio Science Radio Science Meeting (IEEE AP-S/URSI 2022), which was held in “the Mile High City” of Denver, CO, USA, on 10–15 July 2022, was a great success. Many of the attendees were happy to join the in-person meetings and events. Many could not do so for various reasons and inconveniences caused by the pandemic. Virtual attendance was made possible for all those who could not be there in person.

To Travel or Not to Travel: The Hybrid Conference Era [President’s Message

This year it is nice to once again be writing the September message having just returned from the annual IEEE Geoscience and Remote Sensing Society (GRSS) flagship conference, the IEEE International Geoscience and Remote Sensing Symposium (IGARSS). IGARSS was held in Kuala Lumpur, Malaysia, at the Kuala Lumpur Conference Center, where we enjoyed a week of technical sessions held both in person and online as well as a full agenda of GRSS social events, the Student Paper Competition (SPC), the Three Minute Thesis (3MT) competition, and a map design contest organized by the IGARSS Local Organizing Committee.

Advances in Intelligent Vehicles [President’s Message

Each year, before the summer holidays begin, the first Intelligent Transportation Systems Society (ITSS) flagship conference of the year takes place. This year’s IEEE Intelligent Vehicles Symposium (IV’22) was a great success, gathering more than 400 researchers and practitioners from industry and universities, with 75% of the registrants attending on site.

Reconnecting the Diverse Community [From the Editor’s Desk

After two years of virtual conferences, the annual flagship conference of the IEEE Robotics and Automation Society (RAS), the IEEE International Conference on Robotics and Automation (ICRA), has returned in person. When I attended ICRA in Philadelphia in May, I felt excitement in the air when people greeted each other and friends shook hands and hugged each other. It was not easy for professors, students, industry practitioners, and other attendees traveling from all around the world to be under one roof, while the COVID-19 pandemic has not fully settled into its endemic stage. With more than 4,700 in-person participants, nearly half of whom were students, this year’s conference was the largest and youngest one ever in ICRA history.

Guest Editorial Special Issue on Selected Papers From the IEEE Sensors 2020 Conference

As the flagship conference series of the IEEE Sensors Council, IEEE SENSORS JOURNAL receives each year several hundreds of paper submissions, on various topics related to sensing technologies, sensors devices, their communications and applications. The IEEE Sensors 2020 Conference was initially planned to be held as a traditional face-to-face event in Rotterdam, The Netherlands, between October 25 and 28, 2020. However, the Covid-19 pandemic, and the gathering and travel restrictions that were implemented all over the world obliged us to change the format of the conference, and make it a fully virtual, on-line event.

Welcome to the June Issue [From the Editor’s Desk

For many years, the issues of <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">IEEE Microwave Magazine</i> are not only sent out to IEEE Microwave Theory and Techniques Society (MTT-S) members in the manner in which they subscribe (hard copy or electronic), but they are also placed inside the delegate bags at the MTT-S’s flagship conference, the International Microwave Symposium (IMS). For 2022, we are again including this month’s issue, the June 2022 issue, as the second insert for the delegate bags as a way to show the “Breadth of the MTT-S,” that is, examples of the wide-ranging topics that fall within our field of interest (see the MTT-S field of interest statement at <uri xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">https://mtt.org/field-interest-statement/</uri> ).

Editorial

This Special Issue of IEEE Microwave and Wireless Components Letters (MWCL) represents the second year that we include selected papers from the IEEE Microwave Theory and Techniques Society (MTT-S) International Microwave Symposium (IMS). The IEEE MTT-S IMS is the MTT Society’s flagship conference and the world’s largest meeting on microwave technology. This year, it is to be held in Denver, CO, USA, June 19–24, 2022.

NEW business theme for BSDHT flagship conference

NEW business theme for BSDHT flagship conference

Preface

Since 2020, we have had to adapt our activities due to the CoVid-19 pandemic. The prolonged restriction of movement has hampered our scientific research activities. We long for a venue where we can share and discuss optics and photonics, thus we are glad that the Indonesian Optical Society (InOS) biannual main meeting, the 13th International Symposium on Modern Optics and Its Applications (ISMOA) had been successfully held on 2-4 August 2021 virtually through video conference. With a theme of “Photonics for Better Lives”, this symposium was organized in collaboration with the Department of Electrical Engineering, Universitas Pelita Harapan, together with Institut Teknologi Bandung and Institut Teknologi Sepuluh Nopember as one of the International Day of Light (IDL) 2021 activities in Indonesia.The ISMOA meeting series is the flagship conference of the Indonesian Optical Society (InOS) which has been successfully organized twelve times. Since the first ISMOA held in 2001, for ten times, these meeting series have always been held at Institut Teknologi Bandung (ITB) in Bandung, Indonesia, wherein 2011 the Indonesian Optical Society was founded. Thereafter, to fulfil the mission of the society to disseminate the science of optics and its important contributions to the advances of science and technology in general, a rotating scheme of hosting the meeting by other universities and cities in Indonesia was started. This 13th meeting is the third time that the meeting was held outside of ITB. This 13th symposium was highlighted by 13 distinguished international scientists who delivered invited presentations on their latest research, namelyAslam BAIG (National Centre for Physics, Pakistan)Humeyra CAGLAYAN (Tampere Univ., Finland)Martijn DE STERKE (Univ. Sydney, Australia)Suganda JUTAMULIA (Omnivision Technologies, Inc., USA)Takashi KURODA (National Institute for Material Science, Japan)Laura M. LECHUGA (Catalan Institute of Nanoscience and Nanotechnology, Spain)David MARPAUNG (Univ. Twente, The Netherlands)Thomas PERTSCH (Friedrich-Schiller University Jena, Germany)Jonghwa SHIN (Korea Advanced Institute of Science and Technology, South Korea)Kaoru TAMADA (Kyushu University, Japan)Nelson TANSU (Univ. Adelaide, Australia)Thomas WHITE (Australian National University, Australia)Yuanlin ZHENG (Shanghai Jiao Tong University, P. R. China)out of which, 5 are Fellows of Optica.

SIGCSE TS 2022 report

The SIGCSE Technical Symposium is SIGCSE's flagship conference and this past March we held SIGCSE's 53nd technical symposium. SIGCSE TS 2022 was held March 3-5, 2022, in Providence, Rhode Island and online. Virtual attendees participated through the Pathable platform. SIGCSE TS 2022 was our first hybrid conference, and it opened with some trepidation about stepping into the unknown. However, our community showed patience and support through this adventure, and we thank you.

The New Frontiers of “Wireless Motion Capture and Fine-Scale Localization”

This special issue in the IEEE Journal of Radio Frequency Identification (JRFID) was born as an initiative of the IEEE Council Of Radio Frequency Identification (CRFID) Technical Committee on &#x201C;Motion Capture and Localization&#x201D; (TC-MoCap) (<uri>https://mocap.ieee-rfid.org/</uri>). The latter (<xref rid="fig1" ref-type="fig">Fig. 1</xref>) was established in Spring 2021 to promote activities and research in the field of RFID-based localization, ultra-precise Radio-Frequency (RF) positioning, and related fields. This initiative began with a highly successful workshop at IEEE RFID 2020 Conference (<uri>https://2020.ieee-rfid.org/workshop-on-wireless-mocap/</uri>). Since then, other workshop editions have followed each other at the IEEE RFID 2021 Conference (<uri>https://2021.ieee-rfid.org/workshop-on-wireless-motion-capture-and-fine-scale-localization/</uri>), IEEE RFID-TA 2021 Conference (<uri>https://2021.ieee-rfid-ta.org/social-event/</uri>), IEEE WiSEE 2021 Conference (<uri>https://attend.ieee.org/wisee-2021/program/workshops/</uri>) and are currently scheduled for the 2022 editions of the IEEE CRFID flagship conferences.

Updates on aHUS: Latest Insights into Triggers, Diagnosis, and Management Outcomes

Atypical hemolytic uremic syndrome (aHUS) is a form of thrombotic microangiopathy (TMA) that primarily affects the kidney but has a wide variability in its triggers and clinical presentation. In spite of its ultra-rare status, aHUS was a topic of interest at Kidney Week, the flagship conference of the American Society of Nephrology. Nineteen posters and four publication-only abstracts covered various facets of aHUS, using case studies and larger-scale analyses from clinical trials and the Global aHUS Registry to deepen our understanding of aHUS triggers and diagnosis, and to give us new perspectives on the long-term clinical outcomes with complement C5 inhibitor medications.

Guest Editorial

This Special Issue of IEEE Transactions on Microwave Theory and Techniques (TMTT) is comprised of the expanded papers from the 2021 IEEE Microwave Theory and Techniques Society (IEEE MTT-S) International Microwave Symposium (IMS2021), held in Atlanta, GA, USA, on June 2021. The IEEE MTT-S International Microwave Symposium is the world’s major event of microwave technologies annually organized by the IEEE MTT-S as the society’s premier flagship conference. The conference represents a unique opportunity to bring together researchers and practitioners with diverse technical backgrounds to share the most recent advances in MHz-to-THz technologies and systems. Due to the unprecedented pandemic situations, the IMS2021 was held in a hybrid format, comprised of in-person and virtual participation options. The in-person event was held on June 7–10, 2021, at the Georgia World Congress Center, Atlanta. A virtual event followed on June 20–25, 2021.

Through the Looking Glass—The 2022 Edition: Trends in solid-state circuits from ISSCC

The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2022 is “Intelligent Silicon for a Sustainable World.” This theme further highlights the fact that to cope with strong environmental changes, the circuit design community is evolving more than ever to support a more sustainable world. Given their widespread use in our everyday lives, without change, ICs will become the dominant energy consumer and source of carbon emissions in the (near) future. Despite phenomenal advances in solid-state circuits and systems, low-power circuit design is becoming increasingly more sophisticated in all application areas, from digital computation and machine learning to analog design. In the context of data communications, advances in wireless and wireline circuits will help optimize local and global communications energy. Various sensors can be deployed to measure environmental data and optimize energy consumption. Power management techniques continue to be an essential aspect of a majority of circuits and systems to extend their lifetime and battery longevity. Furthermore, new technologies are providing opportunities to develop innovative circuits, reduce fabrication impacts, and improve recyclability.

Guest Editorial: Special Issue Based on Papers Submitted to All 2018 IEEE TEMS Conferences

The papers in this special issue were submitted to all the conferences organized by IEEE Technology and Engineering Management Society (TEMS) in a given calendar year. In 2017, IEEE TEMS initiated its flagship conference TEMSCON (held in Silicon Valley), which serves as rebranding from its original International Technology Management Conferences (ITMC). Following that, in 2018, two more conferences were initiated globally, one in Asia known as IEEE TEMS International Symposium on Innovation and Entrepreneurship (ISIE), and one in Europe as IEEE TEMS International Conference on Technology and Entrepreneurship (ICTE). For this special issue, we invited authors attending any of the three aforementioned conferences in 2018 to submit full manuscripts for reviews, and the present special issue with eleven papers is the result of a careful selection following our usual rigid double-blinded peer-review process.