Fin Heat Sink Research Articles

Experimental and numerical studies of the effect of perforation configuration on heat transfer enhancement of pin fins heat sink

AbstractIn this study, experimental and computational studies of the impact of forced convective flow on the heat transfer characteristics of staggered pin fins with perforations are investigated in a rectangular channel at constant heat flux with Reynolds numbers (Re) of 2 × 103–12 × 103. In particular, cylindrical pin fins with circular longitudinal (L) perforation, longitudinal/transverse (LT) perforation, and longitudinal/transverse/vertical (LTV) perforation perforations are compared to solid pin fins to find out how adding different perforation arrays affects overall heat transfer performance and also to find the best perforation configuration for maximum performance. ANSYS‐FLUENT is employed for numerical simulation, validated by experimental data. Experimental validation is conducted by attaching the heat sink to a Peltier module, inducing heat generation through current on one face in the Armfield Free and Forced Convection Heat Transfer Service Units HT 19 and HT10XC. Results highlight significant increases in Nusselt number (Nu) for perforated pins compared to solid pins, with L perforations at 8%, LT perforations at 33%, and 67% for LTV perforated pins due to transverse perforations that act as slots, which stir up the primary flow and induce secondary flow generated by vertical perforations. Regarding pressure drops, L perforations reduce by 9%, LT by 19%, and LTV by 27% compared to solid pins. The overall enhancement ratio peaks at the minimum Reynold number, notably achieving a 38% increase in the LTV perforation pin fin array. This innovative study holds promise for diverse electronic applications, offering enhanced heat transfer performance in electronic cooling systems.

Effect of PCM-filled hallow fin heat sink for cooling of electronic components — a numerical approach for thermal management perspective

This paper aims at the PCM-based heat sink for electronic cooling. In the present analysis, paraffin wax-based phase change material (PCM), in 3-fin and 4-fin hollow heat sinks with the proper volume of PCM in the temperature of the electronic components can be controlled. The PCM-filled heat sinks are placed on top of the high heat-generating integrated circuit (IC) components. The aim is to reduce the maximum temperature of the electronic components and keep them below their critical temperature, hence increasing the life of the IC chips. A correlation is put forward for dimensionless temperature ([Formula: see text]) in terms of heat flux ([Formula: see text]), volume content ([Formula: see text]) and size of the IC chips ([Formula: see text]). It has been found that there will be a 4–[Formula: see text]C drop in temperature when compared to solid fins heat sinks. It is confirmed that the temperature of the IC chip is a strong function of heat flux, size and volume content of PCM.

Investigating thermal performance enhancement in perforated pin fin arrays for cooling electronic systems through integrated CFD and deep learning analysis

Pin fin heat sinks have garnered considerable attention within the realm of thermal management for high-heat-flux electronics systems. This study advances the understanding of perforated pin fin systems, offering novel insights into heat transfer enhancement. The research explores circular and square perforation geometries located at varying positions along the pin fin length, aiming to enhance heat dissipation and extend the lifespan of electronic components. A parametric analysis examines the impact of perforation quantity on thermal performance with a rigorous comparison against non-perforated pin fins. The investigation incorporates machine learning techniques, including artificial neural networks, to predict cooling system thermal efficiency. Using computational fluid dynamics simulations and Artificial Neural Network modeling, the obtained results indicate the optimal design mode is the use of 3 square holes on the pin fin, which leads to an increase in thermal efficiency by 16.63% compared to the case without pin fins. Additionally, the mean absolute error value calculated across all data extracted from the computational fluid dynamics simulation for predicting thermal efficiency was 2.25%. This low error value further demonstrates the accuracy of the simulation data and neural network model in predicting the heat transfer performance of the pin fin designs.

Improving the performance of heat sinks through the integration of fins and the utilization of graphene-mixed latent heat energy storage

Effective thermal management is significant to ensure the safety of all operating systems. However, these systems demand innovative thermal management technology. A heat sink with improved thermal conductivity is one of the passive heat management techniques. This study focuses on enhancing thermal management in devices by evaluating the performance of a heat sink with and without fins integrated with high thermal conductivity graphene-incorporated phase change material. Paraffin wax with a melting temperature of 58 °C was used as the phase change material. The study examines how the addition of graphene nanoparticles improves heat transfer capacity and extends the heat sink's working duration. The findings revealed that the phase change material extends the heat sink's working duration while adding nanoparticles improves performance. The performance of the phase change material and mixture of the nanoparticles was examined using a finned heat sink under constant heat input. The heating and cooling cycle of the heat sink was examined. The performance of the heat sink with fins and nano PCM was increased by 30 % compared to the baseline heat sink at 15 W heat input. This performance was increased to 45 % when the heat input changed to 30 W. The results indicated that nanoparticles in the phase change material augment the heat sink's recovery time, irrespective of the influence of fins.

Analysis and optimization of effect factors of refrigeration performance of portable micro-refrigerator

The objective of this study was to ascertain an efficient portable cold container, considering the constrained space, low airflow velocity, and uneven heat distribution of a micro-refrigerator, which lead to in insufficient heat dissipation and low refrigeration efficiency. A thermoelectric micro-refrigerator model with a volume of 9083.8 cm3 was established under forced convection heat transfer conditions. Through single-factor and response surface experiments, the impact of thermoelectric elements configuration on refrigeration efficiency was identified. These elements include the input current of the Thermo Electric Cooler (TEC), the derating factor (actual power) of the cooling fan, and the height of the heat sink fin.The results indicate that optimizing the refrigeration conditions significantly enhances the refrigeration efficiency of the micro-refrigerator. At an ambient temperature of 25℃, with a fan derating factor of 0.77 (corresponding to an actual power of 0.8218 W), a heat sink fin height of 59.15 mm, and a TEC input current of 5.09A, under stable conditions,the cold side temperature can reach −11.3 ℃. The hot side temperature is 38.2 ℃, consistent with the response surface experiment result. Numerical simulation under these conditions reveals a cold side temperature of −12.4 ℃ and a hot side temperature of 41.9 ℃, showing a 9.7 % difference from the experimental results. The simulation data further demonstrate that the vertical arrangement of the cooling fan and heat sink can achieve a cold side temperature of −12.9 ℃, effectively maintaining the hot side temperature below 40 ℃. The thermoelectric system investigated in this paper holds promising potential for applications in portable fresh-keeping and refrigeration.

The Influence of Plate Fin Heat Sink Orientation under Natural Convection on Thermal Performance: An Experimental and Numerical Study

Many electronic gadgets now require more power as a result of technological advancements, and to prolong their lifespan, they must all be kept thermally stable. To prevent electronic equipment from operating above their safe operating temperature, numerous techniques are used. Due to its low cost and dependable manner of cooling, the naturally cooled heat sink is the most used technology. The goal of the current research is to improve the thermal efficiency of less dense heat sinks by modifying their design and orientation. The aluminium heat sink utilized for the experimental and numerical investigation has the following dimensions: length 120 mm, width 100 mm, thickness 2 mm, height 40 mm, and channel width 12 mm. The cartridge-type heater received heat input ranging from 25 W, 50 W, 75 W, and 100 w. Under natural convection, the orientation was changed to 0°, 15°, 30°, 45°, 60°, and 90°. By increasing the orientation angle of the heat sink from 00 (horizontal position) for all the heat input, the Nusselt number and rate of heat transfer increases. Due to changes in the flow pattern, the vertical orientation of the heat sink was found to be transferring heat more quickly than other orientations. According to the study, plate-fin heat sinks with circular in-line notches perform thermally better than those without any notches.

Combining artificial intelligence and computational fluid dynamics for optimal design of laterally perforated finned heat sinks

The efficient design of heat sinks is a severe challenge in thermo-fluid engineering. A creative and innovative way is applying lateral perforations to parallel finned heat sinks. The significance of achieving an optimal design for perforated finned heat sinks (PFHSs) has inspired the present authors to introduce a novel hybrid designing approach that combines computational fluid dynamics (CFD), machine learning (ML), multi-objective optimization (MOO), and multi-criteria decision-making (MCDM). The design variables considered include the size (0.25<φ<0.5) and shape (square, circular, and hexagonal) of the perforations, as well as the airflow Reynolds number (2000<Re<5000). The design objectives have been redefined as dimensionless parameters to assess heat dissipation, pressure drop, and heat sink weight. These modified objectives encompass thermal performance (TP), thermo-hydraulic performance (THP), and thermo-volumetric performance (TVP). The modeling process showed that both stepwise mixed selection (SMS) and GMDH-NN techniques exhibited comparable performance in most modeling scenarios. Nevertheless, the SMS approach demonstrated more reliability in modeling diverse objectives. Furthermore, the optimization results demonstrated that the optimal size of the perforations is strongly dependent on their shapes. In PFHSs with square perforations, approximately 54% of the Pareto points had a φ-value greater than 0.45. Meanwhile, in PFHSs based on circular perforations, more than 50% of the optimal points have φ less than 0.4. The MCDM-based analysis on various real-world scenarios indicated that using PFHSs with square-shaped perforations with Reynolds numbers around 2000 and considering a wide range of perforations' sizes could result in optimal designs.

Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink

Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink

The numerical analysis in heat transfer, fluid flow, and irreversibility of a pin-fin heatsink under the ultrasonic vibration with different transducer power assignment scenarios

The hydrothermal performance and entropy generation rate in a pin–fin heatsink were numerically investigated under different vibration transducer power distribution scenarios between 11 transducers located at 3 walls of the heatsink. Two cases were investigated; Case#A and Case#B which are different in 3 transducer locations on one wall of the heatsink. The highest convection coefficient (h) in Case#A was obtained for a variable power scenario, which escalated pressure drop (ΔP) by 91.94%. However, the highest h in Case#B was obtained for the constant power scenario. In addition, h, average temperature of CPU, and thermal resistance factor in Case#A are 5.84% higher than, 0.41% lower than, and 5.34% lower than those in Case#B. The PEC factor for Case#A is higher than unity (1.31) only under the constant power scenario, while the PEC of Case#B is higher than unity under different studied scenarios. Frictional irreversibility (Ṡfr) for Case#A was obtained as 1.45–74.56% higher than that for Case#B due to the swirl flow generated by the high-power transducers and creating the huge velocity gradients in Case#A. Nevertheless, the high flow mixing in Case#A leads to reducing the temperature gradients against Case#B, thereby thermal irreversibility (Ṡth) in Case#A is almost 7.05–19.69% lower than that of Case#B.

Numerical study and optimization of thermal efficiency for a pin fin heatsink with nanofluid flow by modifying heatsink geometry

This paper presents a numerical study on the thermal efficiency of a pin fin heatsink (HEK). The working fluid used is an alumina/water nanofluid, which enters the HEK in a laminar flow regime and exits from its surroundings. This study involves varying the distance between circular pin fins, their height, and their diameter. By altering these parameters, we determine the values of thermal resistance (THR) and temperature uniformity (Teta) on the HEK, along with the heat transfer coefficient (HTC). We further optimize the obtained results using artificial intelligence techniques to minimize the THR of the HEK, maximize the HTC, and achieve the best Teta on the HEK. This numerical investigation employs a two-phase approach to model nanofluid flow within the HEK. The optimization process yields predictions with an accuracy of less than 4%. The findings reveal that increasing the height of the pin fins reduces the HTC and the heat capacity of the HEK, while simultaneously improving the Teta on the HEK. Expanding the distance between pin fins enhances the HTC, decreases the THR of the HEK, and further improves the Teta on the HEK. Similarly, augmenting the diameter of the pin fins amplifies the HTC, reduces the THR, and enhances the Teta on the HEK.

Influence of pin-perforation shape on thermohydraulic performance of circular pin-fin heat sinks under turbulent flow

The impact of pin-perforation shape on the thermohydraulic performance of circular pin–fin heat sinks (CPFHS) under turbulent flow conditions is numerically assessed using a computational fluid dynamics software. The convective heat transfer efficiency, hydraulic resistance, and thermohydraulic performance of four pin-perforation shapes: square diamond, triangle, hexagon, and circle, are evaluated under various turbulent flow conditions (Reynolds number between 24,484 to 55,088). The sizes of all pin-perforation shapes are under a constraint that the ratio of the air–solid interfacial surface area to the total volume of pin-perforated CPFHS must be the same. The results show that all pin-perforated CPFHS demonstrate a higher Nusselt number compared to unperforated CPFHS. Those with circular perforations exhibit the highest Nusselt number with up to 39% improvement compared to unperforated CPFHS, followed by those with hexagonal, triangular, and diamond perforations, respectively. The Nusselt numbers correlate with the ease of fluid flow within perforations which is expressed using the average air velocities through perforations. In terms of hydraulic resistance, all pin-perforated CPFHS exhibit a reduction in friction factor compared to unperforated CPFHS. Among these, the largest decrease in friction factor, up to 15.8%, is observed in CPFHS featuring circular perforations, followed by those with hexagonal, diamond, and triangular perforations, respectively. The friction factors are influenced by the ratio of perforation perimeter to cross-sectional area. All pin-perforated CPFHS have a thermal performance factor greater than 1, indicating an improvement in thermohydraulic performance compared to unperforated CPFHS. CPFHS with circular perforations yield the highest thermal performance factor, reaching up to 1.44, followed by hexagonal, triangular, and diamond pin configurations, in descending order. With increasing Reynolds numbers, thermal performance factors of pin-perforated CPFHS initially rise, then gradually decline, suggesting that thermohydraulic advantages due to pin–fin perforations are diminishing as the flow become more turbulent.

Thermal-hydraulic performance enhancement of modified hexagonal micro-Pin fin heat sinks using rotational configurations

Nowadays, micro-pin fin heat sinks (MPFHSs) have shown promising performance in removing high heat fluxes in small dimensions and are widely used in electronic cooling applications. Among various techniques for thermal–hydraulic enhancement of MPFHSs, geometric design modification has been emphasized in this study, which focuses on investigating the orientation of the micro-pin fins (MPFs) as an overlooked but crucial parameter. To this end, rotational configurations of modified hexagonal MPFs, including co-rotation, alternating rotation, and counter-rotation have been investigated at rotation angles ranging from 0 to 60 degrees. In the numerical study, the copper MPFHS with a heat flux of 50 W/cm2 is cooled using water within the Reynolds number (Re) range of 400 to 1000. The results revealed that the rotation angle of MPFs governs the flow behavior around them. In general, counter-rotation configurations exhibited better thermal performance by providing the possibility of increased fluid mixing and contraction of low-velocity recirculation zones. However, the considerable increase in pressure drop in this configuration may limit its usability in higher Re regimes. By considering the compromise between pressure drop and heat transfer, the counter-rotation configuration with a 30-degree angle was selected as the optimal design. The optimized design results in an increase of approximately 50 % in Nusselt number (Nu) and up to 26.7 % in performance evaluation criteria (PEC). Furthermore, a supplementary experimental study confirmed the numerical results. It demonstrated the remarkable performance of the proposed design in removing heat fluxes ranging from 125 to 250 W/cm2, within the range of Re under investigation.

Multi-objective optimization of thermal management system for multiple heat source arrays electronic chassis in a noiseless environment

Effective thermal management of electronic chassis is currently a critical concern. A heat sink with fins and heat pipes is suggested in this paper. It is intended to handle the heat produced by numerous sources within an electronic case and enhance its functionality. The parameters have been examined and improved in order to work quietly. Response surface methodology (RSM) was employed to examine the influence of fin length, fin thickness, fin spacing and Re on the junction temperature, temperature uniformity and thermal resistance of the heat sink for a printed circuit board array (PCBA). The parameter combinations were optimized using a genetic algorithm. The results indicated that the optimal fin spacing is 11 mm, optimal length is 199 m, and optimal thickness is 2.9 mm when the Reynolds number falls within the range of 2000 ≤ Re ≤ 7000. Compared to the original fins, the combined finned heat pipe heat sink decreases the temperature of the PCBA junction by approximately 10 K, enhances the temperature uniformity by around 49 %, and diminishes the total thermal resistance by nearly 48 %. The optimal air velocity is approximately 0.41 m/s. The improved heat sink can efficiently enhance the thermal management of electronic casings.

Design and Optimization of Heatsink for an Active CPU Cooler using Numerical Simulations

Heat generation in CPUs with high computing performance has been a very serious issue that deteriorates their performance. To ensure that CPUs operate at their maximum potential, it is essential to maintain their temperature below 80 °C. Forced convection coolers comprising of a heatsink and fan are considered the most effective means of satisfying operating temperature requirements for a CPU in order to ensure its maximum performance. A heatsink design paired with a fan with airflow speed of 80 cubic feet per minute (CFM) for a CPU Cooler targeted at CPUs with maximum heat generation of 380 watts operating in ambient temperature of 25 °C, is developed using numerical methods of Computational Fluid Dynamics (CFD) and topology optimization using ANSYS Mechanical and ANSYS Fluent. Various fin profiles, fin arrangements, fin numbers and heatsink materials are comparatively analyzed. The best results from the comparative analyses are combined to present a base design capable of keeping the CPU temperature below 80 °C, which is the requirement for ensuring maximum computing performance. A 30 fin heatsink with covered rectangular plate fins in an arc-shaped placement configuration is determined to provide the maximum cooling performance. In materials, Silicon Carbide resulted in the lowest CPU temperature of 78°C, followed by copper at 84 °C. Silicon Carbide heatsink successfully managed to satisfy the requirements for maximum CPU performance. Copper heatsink is unlikely to cause CPU failure, but it fails to meet conditions for maximum CPU performance. In addition, this base design is then optimized for material cost reduction using topology optimization which resulted in 13% reduction in material cost with a negligible cooling performance reduction of only 0.32%. The overall design of the cooler can be improved by incorporating fan design and various CPU load conditions into the design parameters in future research.

Enhancing thermal efficiency of aluminum heat sink by reduced graphene oxide-layer coating approach

Light emitting diode (LED) technology plays a significant role in the market of lighting technologies due to its high efficiency compared to conventional lighting solutions. Cooling of high-power LEDs, on the other hand, is a critical aspect in maximizing LED performance. Furthermore, due to the powder, rain, and muds, LED armatures including a finned heat sink may not be efficient according to its design and utilization areas especially for outdoor illumination. Eliminating these factors, un-finned heat sink LED armatures are also preferred, yet the temperature dissipation of the un-finned type is not homogeneous relatively according to finned type. In this study, a graphene coated un-finned heat sink was developed to obtain relatively homogeneous temperature distribution and increase heat transfer of aluminum plate. An un-finned heat sink comprising thin graphene film was designed by a computer-aided-design (CAD) program and the thermal analysis was conducted by a finite element analysis (FEA) program. The experimental measurements offered that the maximum and minimum junction temperatures for the bare, and reduced graphene oxide (rGO)-layers coated aluminum heat sinks were obtained as 90 − 70◦C, and 59–54◦C, respectively. The outstanding in-plane thermal conductivity of rGO-layers facilitated the homogenous heat distribution throughout the aluminum heat sink. Moreover, the design and thermal analysis of developed heat sinks were validated with experimental results with the 2.4% error with respect to maximum junction temperature. It can be concluded that rGO-layers coated aluminum heat sink enabled to facilitated the heat transfer more than bare aluminum due to its higher thermal conductivity. In brief, this work opens a new gate for designing the graphene based materials-integrated cooling solution for LED applications.

Evaluation of prediction and modeling performance using machine learning methods for thermal parameters of heat sinks under forced convection: The case of external validation

The capability of ML models in thermal systems is generally determined by internal validation, while this study investigates the prediction performance of ML models with external validation. ANN, XGBoost, and RF models were created with the training-test data set obtained from the results of flat, conical, and cross-cut pin fin heat sinks. Data of 33, 66, and 99 W for the training-test data set were used for training and internal validation, while data of 49.5 W for conic Model-I and 82.5 W for conic Model-II were used for external validation. The RF showed the highest performance on the test data-internal validation and the ANN on the external validation. According to the test data not used in training, the lowest MSE is 0.0270-(RF), 1.7437-(ANN), and 14.7140-(XGBoost). In RF and XGBoost, the external validation performance decreased significantly compared to the internal validation. The MSE of the models are 8.0683-ANN, 214.4047-XGBoost, and 300.6012-RF for external validation. The thermal resistance provides more realistic results than the Nusselt number for the thermal performance evaluation of heat sinks with ML methods. The ANN based on external validation may be used to predict heat sinks' thermal performance and save money, labor, and time compared to CFD simulations.

OPTIMIZATION OF FINNED HEAT SINKS WITH ELECTROSPRAY COOLING: FULL FACTORIAL METHOD

In this study, the optimum heat sink geometry was determined by the full factorial method with electrospray cooling, which has started to find a place among the methods used for the removal of high heat flux in recent years. The experiments were carried out at 4.4 kV voltage, 0.2 mL/min flow rate, d&lt;sub&gt;i&lt;/sub&gt;&amp;#61; 0.61 mm nozzle diameter, and 20 mm nozzle-to-heat sink distance. Ethanol was used as the cooling fluid. The experiments were carried out in the cone jet electrospray mode. As a result of the experiments performed with square, rectangular, and triangular fin heat sinks, it was determined that the best cooling performance was achieved in the square fin heat sink. As a result of the experiments carried out with the square fin heat sink with 27 different geometries, it was determined that the most effective cooling was achieved in the Square-18 heat sink with 3 mm fin width, 3 mm fin distance, and 3 mm fin height. An average temperature value of 51&amp;deg;C and a fin enhancement ratio of 1.11 were obtained for eight different heat fluxes (3.2-2.99-2.75-2.59-2.4-2.19-2.02-1.88 kW/m&lt;sup&gt;2&lt;/sup&gt;) in the Square-18 heat sink.

RESPONSE SURFACE METHODOLOGY-BASED NOVEL LATTICE HEAT SINK OPTIMIZATION FOR ELECTROHYDRODYNAMIC (EHD) SPRAY COOLING

In recent years, the size of electronic equipment has become smaller, while the increased processing capacity has led to progressive elevation in the heat flux. As a result of this, the performance of this equipment decreases, and their service lives decrease. Although traditional cooling methods are insufficient to remove the surface heat, new cooling techniques, for example, electrohydrodynamic spray (EHD-spray) cooling, show promise in guaranteeing the operation of these systems under the intended conditions. EHD-spray, also known as electrospray, is an atomization method that provides equal and homogeneous droplets. Although EHD has been used in many studies in the literature, its use in heat transfer has only recently become an important research area. Studies on EHD-spray, which has important advantages such as requiring a very small amount of fluid and low energy, are limited, and there are almost no studies using finned heat sinks. In the study carried out, unique design heat sinks produced by the selective laser melting (SLM) method were optimized with the respond surface method (RSM) Box-Behnken design (BBD) management, that is one of the most effective design methods. In the study where heat sink surface area (HSSA), fluid composition ratio (FCR), and flow rate (FR) were used as variable parameters, the highest heat transfer coefficient (HTC) was found for 100&amp;#37; distilled water at a 17 mL/h flow rate, and the heat sink had the lowest surface area. The results show that EHD-spray is promising for cooling high-heat-flux systems.

HEAT TRANSFER ANALYSIS OF A COMBINED PIEZOELECTRIC FAN–TRANSLATIONAL AGITATOR COOLING SYSTEM

This paper investigates the heat transfer characteristics of a channel system consisting of a finned heat sink and two piezoelectric devices, the piezoelectric fan (PF) and the piezoelectric translational agitator (PTA), both experimentally and computationally. In the proposed system, the mean flow is generated by a cantilevered PF, and the flow between the fins is agitated using a PTA. A single-channel system consisting of a PTA, the PF, and two fins is analyzed numerically using ANSYS Fluent software after validating numerical predictions against experimental measurements. The effect of design variables such as frequency ratio, phase difference, PF's tip distance from PTA, and squeezing fraction is explored. A PTA increases the heat transfer from the heated surfaces without incrementally aiding in the mass-flow rate. Velocity and temperature fields are plotted to understand the physics of the system for one complete cycle of a PTA blade. The concept of total Reynolds number that incorporates the effect of both axial and transverse fluid flow is used in this study. The Nusselt number increases with an increment in the total Reynolds number. It is noted that the integration of the PF and the PTA with the finned heat sink system has enhanced the heat transfer coefficient by 76.88&amp;#37; compared to the system with PTA and by 30.92&amp;#37; as compared to the system with the PF only.

Mathematical Simulation of Plat-Pin Fin Heat Sink Installed under the Solar Panels

Mathematical simulation of plat–pin fin heat sink installed under solar panels was conducted. Based on the problem of heat accumulation inside the solar panel, the electricity generation efficiency become reduced with a higher heat. Thus, the objective was to design and simulate plate and pin cooling. Two shapes of pin consisting of plate and cylindrical pin were studied. The investigated process was divided into two stages. The design and calculation of the heat sink fin was the first stage. The process of simulating solar panels with fins attached and without fins using the SOLIDWORKS program was the second stage. Three factors were considered: the direction of the panel installation (S, SE, and SW), the inclination angle () of the solar panel, and the style of installation (Transvers and longitude fins). The appropriated condition for reducing the temperature of solar panels was discussed. The results showed that the minimal temperature of the solar panel was obtained at the southeast (SE) direction with an inclination angle () of 18°. Heat dissipation was achieved by the transvers fins in which a maximum temperature reduction gave 6.39 ℃.