A direct and deleterious effect on packaging reliability has been observed during elevated temperature isothermal aging for fine-pitch ball grid array (BGA) packages with Sn-1.0Ag-0.5Cu (SAC105), Sn-3.0Ag-0.5Cu (SAC305), and Sn-37Pb solder ball interconnects. Package sizes ranging from 19 mm with 0.8-mm-pitch BGAs to 5 mm with 0.4-mm-pitch μ BGAs with three different board finishes (ImSn, ImAg, and SnPb) were evaluated. The aging temperatures were 25°C, 55°C, 85°C, and 125°C, applied for a period of 6 mo. Subsequently, the specimens were thermally cycled from -40°C to 125°C with 15-min dwell times at the high temperature. Weibull analysis of failures versus cycle number show a ~ 50% reduction in package lifetimes when aged at 125 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">°</sup> C compared to the same at room temperature, with less dramatic but measurable reductions in lifetime at 85°C and even 55°C. In contrast, the reliability performance of Sn-37Pb is much more stable over time and temperature. The degradation was observed for both SAC alloys on all tested package sizes and board finishes. For the 19-mm SAC105 case, for example, there was a 53% (32%) reduction of characteristic lifetime at 125°C (85°C) compared to room temperature aging. The trends were in the expected directions; namely, the reliability was reduced when using higher aging temperatures, smaller solder balls, and SAC105. The dominant failure mode can be associated with the growth of Cu <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">6</sub> Sn <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5</sub> intermetallic compounds during the aging, particularly on the pad side.