Film Scratch Research Articles

On the influence of the micropulse on Nb thin films deposited by MPPMS and DOMS: A comparative study

Nb thin films deposited by modulated pulsed power magnetron sputtering (MPPMS) and deep oscillation magnetron sputtering (DOMS) were comparatively studied under a similar average power by controlling the micropulse duty cycle. It was found that DOMS discharge both showed higher discharge peak current and peak voltage, time delay between the current and voltage was much smaller compared with a MPPMS discharge. All Nb thin films were observed with Nb(110) preferred orientation and compact columnar structure. The increase of micropulse duty cycle led the gradual movement of Nb(110) to high scattering angle direction, meanwhile the DOMS Nb(100) diffraction peaks were all on the left of MPPMS Nb(110). An increase for compressive residual stress σ could be observed for both techniques, and all DOMS Nb thin films showed higher residual stress, hardness and elastic modulus. The anomalous increase in σ also led to the deterioration of DOMS Nb thin film scratch adhesion. Despite the grain sizes of DOMS Nb thin films were all smaller than MPPMS Nb thin films, σ in DOMS Nb thin films generated by the adatom diffusion and ion irradiation still overwhelmed the tensile stress generated by the volume shrinkage of the growing grains. The special afterglow of DOMS in the microsecond scale gave a new controlling dimension for thin film growth.

Scratch behavior of low density polyethylene film: Effects of pre-stretch and aging

To investigate the influences of pre-stretch and aging on the scratch behavior of low density polyethylene (LDPE) film, the scratch tests were conducted with the linearly increasing normal load. The scratch process was recorded using a high-speed camera and the scratched surface morphology was microscopically investigated. Three typical film scratch deformation/damage modes, i.e., smooth sliding, folding over and tension induced puncture were identified. Their mechanisms and evolution processes were analyzed. It was found that the pre-stretch could improve the scratch performance of LDPE film in the same direction while the scratch resistance perpendicular to the pre-stretch direction declines. While the thermal aging tends to diminish this anisotropic scratch performance, a long thermal aging time causes poor scratch resistance. A good correlation was found between the critical load of tension induced puncture and the elongation at break of LDPE film. Thus, the elongation at break can be one of the good indexes to evaluate the scratch resistance. Those findings provide a fundamental insight for material scientists to design LDPE film with better scratch performance and longer service lifetime.

A study on removal algorithm of flicker noise on old film sequences

This document is the study about flicker noise embedded in the old tape or old movie film. The purpose of the study is to improve the identification accuracy and the elimination rate of the noise caused mainly by the film scratches. Based on the traditional gray value and threshold method, a new circuitous detection method is used to adjust the threshold, so that the detection rate of noise is improved. The method is confirmed to have a good effect on the detection and repair of flicker noise and the tape or movie film repaired shows a satisfactory visual effect.

Characterization of Conductive Thin Films Deposited by Ink Jet Printing

With the advantage of simplicity and low cost, ink jet printing has the potential to replace the traditional chemical and physical deposition technology in thin film fabrication. In this work, silver conductive thin films are deposited on glass and polyimide substrates by ink jet printing, where some major characteristics of the printed thin films are investigated and compared to those deposited by sputtering. The micro texture and residual stresses of the thin films are measured with X-ray diffractometry (XRD). Using thin film scratch tester, the adhesion of thin films deposited by both ink jet printing and sputtering is studied. Further observations on electric and optical performance by using visible wavelength photospectrometry, four-point probe, and surface profiler are also discussed. The result shows that the micro texture of the printed thin film behaves as good as the sputtered thin film. Furthermore, the micro scratch result illustrates that the adhesion of the printed thin film is even better than the sputtered thin film. It emphasizes that, after certain baking process, the ink jet printing has the possibility to replace sputtering in thin film deposition, especially for the polymer substrates.

Restoration of Damaged Korean Films by Using Various Image-Processing Techniques

Recently, the digital cinema distribution chain has added an additional path for showing old, damaged films using proper restoration. Old films, which were acquired by low-quality cameras and stored in poor conditions, tend to have many defects compared with movies made with modern digital works. This paper presents a set of image-processing algorithms for enhancing and restoring old films severely degraded by camera jitter, film scratches, grain noise, and poor contrast. In 2005, the Korean Film Council reran 30-year-old animated films in high-quality digital standard. In this work we briefly introduce the restoration of these animated films and provide details of the additional ongoing restoration work on old Korean films with a consideration of the bottleneck between the main workflow and compatibility of intermediate equipment. Experimental results are presented for restored samples of old movies and animations followed by the workflow pipeline of the proposed restoration process.

Assessment of adhesion between thin film and silicon based on a scratch test

Thin film coatings are commonly utilized to prevent wear, modify surface properties, and manipulate the frictional behavior of various mechanical systems. The behavior of a coating has a direct effect on the life as well as performance of the system. However, the coating itself is subject to damage, and the quality of the coating is related to the adhesion characteristics between the coating and the substrate. Therefore, a quantitative assessment of the adhesion properties of thin film is important to guarantee the reliability of not only the thin film but also the mechanical system. In this study, ramp loading scratch tests were performed to assess the adhesion characteristics of Ag and ZnO thin films coated on a silicon wafer. Silver thin film, deposited by sputtering, and ZnO thin film, fabricated by a sol-gel method, were used as scratch specimens. Scratch tests using a diamond tip were performed with a continuously increasing normal force. During the scratch test, the normal and frictional forces were monitored to assess the integrity of the film. The Benjamin and Weaver model commonly used for obtaining the horizontal force during the scratching of films coated on a substrate showed large discrepancies with the experimental results. In this work, the model was modified with a plowing term to minimize the difference between the experimental and theoretical results. Using the modified model, the experimental results could be predicted with an accuracy of about 10%.

Film Scratches: Notes from the Fringe

Film Scratches: Notes from the Fringe

Film Scratches: Notes from the fringe

Film International invites film-makers and other related media artists to submit works particularly those that do not achieve mainstream distribution for consideration and possible review in this column. Please direct all (NTSC, VHS or any DVD format) submissions to: Liza Palmer, Review Section Editor, Film International, c/o University of North Carolina at Wilmington, 601 South College Road, Wilmington, NC 28403-5616, USA. For more information or to suggest topics for future Film Scratches, e-mail Liza at palmerluncw.edu.

Film scratches notes from the fringe

THIS MARKS THE FIRST article for what will become a regular Film International column, highlighting film and media projects as well as the craftspeople and companies that produce these projects that reflect an independent or experimental spirit and motivation. Film International invites fi lm-makers and other related media artists, to submit works particularly those that do not achieve mainstream distribution for consideration and possible review in this column. Please direct all (NTSC VHS or any DVD format) submissions to: Liza Palmer, Review Editor, Film International, c/o University of North Carolina Wilmington, 601 South College Road, Wilmington, NC 28403-5616, USA. For more information or to suggest topics for future Film Scratches, e-mail Liza at: palmerluncw.edu.

2-1 モフォロジーを用いたフィルムスクラッチの検出とその補正

2-1 モフォロジーを用いたフィルムスクラッチの検出とその補正

Thin film scratch testing in two dimensions—Experiments and analysis

We have modified the microscratch test to create a near plane strain loading condition. In the Microwedge Scratch Test (MWST), a wedge-shaped diamond indenter tip is drawn along a fine line (i.e., narrow strip of film), while simultaneously being driven into the line. We compare microwedge scratching of zone 1 (voided grain boundaries) and zone T (metallurgical grain boundaries) thin film specimens of sputtered tungsten on thermally grown SiO2. Symptomatic of its weak grain boundaries, the zone 1 film displays three separate crack systems. Because of its superior grain boundary strength, the zone T film displayed only one of these—an interfacial crack system. By correlating fracture phenomena to signature events in the load-displacement curve, we develop governing equations for propagating interfacial cracks, including expressions for strain energy release rate, bending strain, and mode mixity. Grain boundary fracture causes zone 1 films to spall before a stable crack is formed. Zone T films survive the bending strains, and hence adhesions may be inferred from stable crack growth mechanics. We conclude by contrasting and comparing experimental results for plane strain indentation versus plane strain scratching.

The Digital Wetgate: A Third-Generation Noise Reducer

This paper describes the development of noise-reduction technology and addresses its applications. First-generation noise reducers using linear filtering techniques such as recursive or transversal filters were designed for removing film grain noise or tape noise of analog VTRs. With the introduction of nonlinear median filtering techniques it became possible to conceal impulse-type noise such as film dust, randomly dispersed film scratches, or FM sparkles. — A third-generation noise reducer now has been developed by BTS. By the use of advanced techniques for error detection and motion adaption it is now possible to conceal large film dirt or fixed vertical film scratches — so-called tramline scratches. A wide range of new features especially designed for film reproduction, such as automatic pulldown and scene-change detection, provide great concealment power in the digital wetgate.