In this study, we reported the fabrication of a capacitive MEMS microphone packaged with an analog amplifying chip. The MEMS device and the amplifying chip were made using a micromachining technique and an IC Multi-Project Chip (MPC) service, respectively. The MEMS device consisted of a low stressed SiNx membrane that is sensitive to sound and the rigid Si back plate. The membrane and the back-plate parts fabricated separately on two wafers were bonded through a eutectic bonding process. Finally, the MEMS device and the amplifying chip were packaged on a single PCB for measuring. The evaluation results of the packaged microphone devices showed similar characteristics compared to FEM simulation results. The sensitivity of the microphone was about −37.4 dB in audio frequency bandwidth.
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