In this work, the fabrication technique for micropatterns of a colloidal assembly on agold-patterned electrode surface using electrophoretic deposition is described. It was foundthat the micropatterns of a colloidal assembly were preferentially deposited onto the goldpattern region, when a gold patterned indium tin oxide (ITO) electrode usingTEM-grids was introduced in the electrodeposition of colloidal particles. The use of anappropriate electrodeposition time resulted in an ordered colloidal assembly structureand prevented the unwanted aggregation of particles. The micropatterning of acolloidal assembly arises because an electrohydrodynamic flow of the colloidalsuspension towards the gold domains is induced by the variation of the currentdensity of the gold-patterned electrode. The proposed method offers a robustway to fabricate colloidal assembly patterns, which have various applications.