Evaluation Of Adhesive Strength Research Articles

515 配線用銅薄膜とキャップ層との付着強度の定量評価(OS2-3,OS2 各種機械材料の疲労挙動と強度評価)

515 配線用銅薄膜とキャップ層との付着強度の定量評価(OS2-3,OS2 各種機械材料の疲労挙動と強度評価)

317 燃焼炎法によるMo基板表面への合成ダイヤモンド皮膜の接合強度評価(機械材料・材料加工II)

317 燃焼炎法によるMo基板表面への合成ダイヤモンド皮膜の接合強度評価(機械材料・材料加工II)

Influence of structure on adhesion of grains in CVD diamond films

Diamond thin films of different structures were prepared by using chemical vapor deposition on WC(6%Co) substrates under different conditions.Reman spectroscopy was used for the quality evaluation of the diamond films.The cracking size in indentation tests was used for the evaluation of adhesion strength,and the influence of structure of diamond films on the adhesion was studied.Results obtained show that: (1) The buffer role of sp2_carbon between grain boundaries greatly affect the residual stress of the film,hence the cracking size decreases steadily with increasing sp2 content.(2) The increase of nucleation density is mainlyh due to the contribution of the diamond seed grains left. In this case,the increase of nucleation density cannot effectively improve the chemical adhesioe force between the film and the WC substrate,and cannot improve the adhesion between the film and the substrate.(3)For thinner films there is no compressive stress among diamond grains,hence the cracking size does n t increase apparently with increasing deposition time.Strong compressive stress emerges only after the thickness increases to a certain value,and then the cracking size increases rapidly with increasing deposition time.

1853 ポリイミドフィルムを基板とする銅薄膜配線の新規手法による付着強度評価(J09-3 プリント基板接続信頼性,J09 電子情報機器,電子デバイスの熱制御と強度・信頼性評価)

The quantitative evaluation of adhesive strength of copper thin film on flexible polyimide film was tried in this research by using a new technique. The specimen was made of polyimide film diced like a block on copper film. By comparing the maximum applied load between the experiment and the simulation to exfoliate this specimen from the copper film, the energy release rate of the interface was evaluated.

Investigation of Substrate Finishing Conditions to Improve Adhesive Strength of DLC Films

This study investigated the effects of grinding wheels on the surface modification properties in Electrolytic In-process Dressing grinding. Three specimens were ground with different abrasive grinding wheels: diamond wheel, SiO2 wheel, and diamond + SiO2 wheel. These three different grinding wheels produced surfaces modified by the diffusion of the abrasive elements. Adhesive strength evaluation tests between the substrate surface and the DLC film were performed using micro-scratch testing. The finished surface ground by the diamond + SiO2 wheel showed the highest adhesive strength due to the physical and chemical properties of the diffused elements. As a result, application of this proposed grinding method to mold fabrication shows considerable promise.

Sol?Gel-Derived Corrosion-Protection Coatings

There is a current need for alternative coatings that can provide corrosion resistance to metals or alloy surfaces due to the environmental hazards posed by conventional coatings. Herein, we report on novel organically-modified sol–gel coatings for the protection of metal and alloy surfaces. The basic concept of chemical conversion of metal surfaces is based on deposition of a hydrophobic, nonporous sol–gel barrier layer for surface protection and corrosion prevention. The properties of these organosilica coatings can be tuned by varying the composition of precursors. The evaluation of hydrophobicity, adhesive strength, and anticorrosion properties of organically-modified sol–gel derived coatings suggests their potential utility as technologically-compatible alternatives to conventional coatings.

Evaluation of Adhesive Strength of Chemical Vapor Deposition Diamond Films by Laser Spallation

The adhesive strength of polycrystalline chemical vapor deposition (CVD)-synthesized diamond films deposited on sintered SiC substrates was estimated using laser spallation. A strong pulse expansion wave was produced on the surface opposite the diamond film by the pulse laser breakdown of silicone grease confined by a silica plate and used to cause Mode-I fracture at the interface between the diamond and SiC. The amplitude of the expansion wave was monitored by a fast laser interferometer as a function of laser characteristics and the confining method. The critical laser energy for causing film spallation changed depending on the diameter of the laser beam and the thickness of the energy-absorbing layer (grease) confined by the silica plate. The driving force of the spallation was estimated to be the tensile stress of the expansion wave following the first compression wave, and it was changed significantly by the dynamics of dielectric breakdown. This was demonstrated by the waveform simulation of the out-of-plane displacement using a theoretical Green's function of the second kind for the dipole source. A pulse dipole source with short rise and decading times generates strong expansion waves.

On Evaluation of Adhesive Strength in Scratch Test of Coating Materials.

On Evaluation of Adhesive Strength in Scratch Test of Coating Materials.

Studies on synthesis, characterization and adhesive strength evaluation of KFA substituted resole adhesives

AbstractPreliminary investigations revealed the presence of appreciable amount of gum rich in lignin and tannin in kendu fruit (Diospyros Cordifolia Roxb). The kendu fruit adhesive (KFA) was used to substitute phenol in resole formulations to achieve cost effectiveness. Substituted resole formulations with 50 and 100% KFA were prepared in alkaline medium through stepwise addition process. Unsubstituted and KFA substituted resole adhesives were then characterized by FT‐IR, thermogravimetric analysis, differential scanning calorimetry and X‐ray diffraction analysis. The adhesive strength of the above mentioned formulations were evaluated by comparing the results of mechanical tests as per the ASTM specifications using UTM‐LR‐100K LLOYD Instruments, UK. Analytical characterizations revealed the substitutions of phenol by KFA in the substituted resole formulations. The results of adhesive strength test revealed that the 50% KFA substituted PF resin exhibits better adhesive strength than the virgin phenol‐formaldehyde and 100% KFA‐formaldehyde resole formulation. Copyright © 2001 John Wiley & Sons, Ltd.

Evaluation of Adhesion Strength for Amorphous SiC Thin Film and DLC/a-SiC Laminated Thin Film Deposited on Steel Substrates for Cutting Tool.

This paper describes the evaluation of adhesion strength between the amorphous Silicon carbide (a-SiC) thin film, Diamond-Like Carbon (DLC)/a-SiC laminated thin film and materials used for the cutting tool. The a-SiC and DLC/a-SiC thin films were deposited on the tungsten carbide steel substrate:K10 and on the high speed steel substrate;SKH51 by Plasma-Enhanced CVD method of the hot cathode PIG discharge type. Scratch tests were carried out for examining the critical fracture load of the films. Finite Element Method (FEM) analyses were also performed to clarify the stress distribution at the interface between the films and substrates. The stress intensity factors KI and KIIand the fracture toughness KC were calculated from results of scratch tests and FEM analyses. The KI, KIIand KC of a-SiC and DLC/a-SiC thin films deposited on the K10 substrate were larger than those of the thin films deposited on the SKH51 substrate. The KI, KII and KC of both of the films were directly proportional to the density of a-SiC thin films. In turning experiments, the delamination area of DLC/a-SiC thin films deposited on the cutting tool of K10 is closely related to the KC obtained from the scratch tests and FEM analyses.

Evaluation of adhesion strength of sol-gel ceramic insulation for HTS magnets

Adhesion strength of high temperature insulation materials deposited on silver was investigated. CeO/sub 2/ and ZrO/sub 2/ based coatings on Ag substrates were prepared by the sol-gel technique. Experiments for determining the adhesion strength between insulations and silver were performed using a mini tensile testing machine. The microstructures of coatings and their interfaces were determined by means of SEM, EDS, and X-ray diffraction. The results indicated that the failure was in the form of a mixed type as interfacial/cohesive defect. The average adhesive strength of ZrO/sub 2/, CeO/sub 2/, ZrO/sub 2/+20 wt%MgO, Zr/sub O/2+8 wt%Y/sub 2/O/sub 3/, ZrO/sub 2/+8 wt%CeO/sub 2/, ZrO/sub 2/+15 wt%In/sub 2/O/sub 3/ and ZrO/sub 2/+15 wt%SnO/sub 2/ were found to be 0.763, 0.913, 1.045, 1.150, 0.915 0.833 and 0.797 MPa, respectively. Y/sub 2/O/sub 3/, MgO, and CeO/sub 2/ doped ZrO/sub 2/ showed the best adhesive properties.

Evaluation of adhesion strength of Ti films on Si(100) by the internal stress method

Titanium films were sputter deposited onto Si(100) surface. Adhesion strength of the Ti film was evaluated by the internal stress method. The Ti film was overcoated by a Ni coating in the state of a high internal stress, the value of which was about 0.5 GPa (tensile). The internal stress induces large normal and shear stress at the interface between the Ti film and the Si(100) surface. Those stresses increase with the increase of the Ni coating thickness. The stress distribution was evaluated by the finite element method. The evaluation shows that the normal stress on the interface is extremely large at the edge of the sample. This result suggests that a peeling of the Ti film is initiated at the edge and is consistent with observed spontaneous peeling phenomena. We could determine the adhesion strength of the Ti film by measuring the thickness of the Ni coating to peel off the Ti film. The value was found to range in 0.1–1 GPa region. The effect of the Ar ion bombardment of Si substrate on the adhesion enhancement was investigated in detail by this method.

Nondestructive evaluation of adhesive strength of CVD polycrystalline diamond coatings deposited on SIALON substrates : Conway, J.C.; Cohen, P.H.; Tittmann, BY.; Drawl, W.R.; Meloncelli, M.; Poeth, D.F.; Kropiewnicki, R. Nondestructive Characterization of Materials IV. Edited by C.O. Ruud, J.F. Bussiere and R.E. Green. pp. 49–57. Plenum Press (1991)

Nondestructive evaluation of adhesive strength of CVD polycrystalline diamond coatings deposited on SIALON substrates : Conway, J.C.; Cohen, P.H.; Tittmann, BY.; Drawl, W.R.; Meloncelli, M.; Poeth, D.F.; Kropiewnicki, R. Nondestructive Characterization of Materials IV. Edited by C.O. Ruud, J.F. Bussiere and R.E. Green. pp. 49–57. Plenum Press (1991)

Influence of grit blasting pre-treatment on the adhesion strength of plasma sprayed coatings: fractal analysis of roughness

Since the adhesive strength of ceramic coatings by plasma spraying is fairly low, serious efforts have been made to improve it. In order to improve the adhesiveness of coatings, the substrate surfaces were roughened by blasting, sometimes by angled blasting as a pre-treatment. The measured adhesive strength showed the maximum value at blasting angle 75°. Average surface roughness of the substrates remains almost constant with respect to the blasting angle. Introducing fractal analysis to evaluating the surface topography of substrates, the fractal dimension was evaluated for the roughened surfaces. It showed a maximum fractal dimension at 75° where the adhesive strength reaches approximately its maximum value. It is concluded that fractal dimension is a better measure than average surface roughness for the evaluation of adhesive strength of ceramic coatings.

Evaluation of Photoresist Image Adhesion Strength Using the Surface Roughness Factor(SRF) of Copper Substrate.

Printed circuits are very important for the integration of electronic device fabrication. Each year, finer and more multilayer printed circuits are used. It is necessary to form a finer photoresist pattern before patterning the finer circuits, and several copper subtrate treatments are generally used to improve photoresist adhesion strength. However there is no suitable method for estimating adhesion properties of such surfaces. An attempt is made to apply the surface roughness factor(SRF, specific area of a solid) as a parameter to estimate conditions for adhesion. In this study, sultable equipment is made to measure the adhesion strength of the photoresist and the SRF of the copper substrate. It is also, confirmed that the SRF is a good parameter for estimating adhesion properties of surfaces, and there is a quantitative relationship between the adhesion strength of photoresist and SRF of the substrate.

Adhesion strength and microstructural evaluation in electroless Ni-P metallized AlN substrate

The adhesion strength of the electroless Ni (EN)-plated AlN substrates is studied through investigation of the microstructural morphologies at the AlN-EN interfaces. Etching sites around the Al-Y-O compounds on the etched AlN substrate provide the anchor acceptors for interlocking the EN film to achieve a high adhesion strength. Separation of the EN film from the AlN substrate under the action of force leaves the fracture cracks propagating along the AlN/EN interface, cutting through the anchors and making the fragmental EN films around the etching sites reside on the AlN fracture surface. However, the polished AlN substrate lacks the interlocking sites and fails to obstruct the cracks propagating along the AlN/EN interface, and thus results in a poor adhesion strength. An appropriate adhesion strength of 13.7 MPa with a small standard deviation (/spl plusmn/2.3 MPa) can be obtained for the previously etched and 10 /spl mu/m thick EN-plated AlN substrate.

Evaluation of Adhesive Strength for Paint Film on Concrete Surface.

In this paper, we developed a new method for evaluating the adhesive strength of paint film on a concrete surface. The peel test for paint film was carried out. A reinforcement plate was attached to the paint film so that it would not be damaged during the peel test. The critical energy release rate (Gc value) was obtained by using peel load and the displacement of the loading point measured during the peel test. Gc values were not affected by the thickness of the reinforcement plate and the peel length. Therefore, it was clear that Gc values could be used to evaluate the adhesive strength of the paint film. Furthermore, the influence of the environment on paint films was elucidated by obtaining the Gc value.

Evaluation of Interface Delamination in IC Packages Considering the Swelling of Molding Compound due to Moisture Absorption.

Adhesion strength evaluation of molding compounds is a critical issue in both structural design and material selection of plastic IC packages. We previously proposed a new adhesion test method that can separate residual stress from adhesion strength, and confirmed that the measured true adhesion strength can be applied to the quantitative prediction of interface delamination in a dry package. This paper describes the influence of moisture absorption of a molding compounds on true adhesion strength. When the average moisture content of an adhesive specimen is the same under the two kinds of moisture conditions (55°C/80%RH, 85°C/85%RH), the drop in true adhesion strength of the specimen that has absorbed moisture at 50°C is about 40 percent of that at 85°C. We also evaluate interface delamination in a moisturizing package by considering both the adhesion strength drop and the swelling of the molding compound caused by moisture absorption. The predicted temperature at which the delamination occurs agrees well with the experimental results for moisture-absorbed packages.

A novel concept for evaluation of biofilm adhesion strength by applying tensile force and shear force

A novel methodology is proposed in this study to evaluate biofilm adhesion strength in two different ways: by measuring detached biomass caused by tensile force and by shear force. Tensile force was provided by centrifuging biofilm-attached plates installed on rotary tables. Shear force was provided by colliding biofilm-attached plates by gravity. Test biofilms consisting of denitrifiers were formed on the flat surfaces of square (25 cm2) plates that had been submerged in a rectangular open-channel reactor. The detachment tests revealed that, although biofilm adhesion strength was relatively high at the earlier growth stage, it drastically decreased at the later stage. The most weakened location toward biofilm depth was observed at the substratum surface, at which the adhesion strength by tensile force dropped from a several Pa to below 1 Pa as biofilms became aged. The adhesion strength by shear force was all the time more than 100 times as large as that by tensile force, even though having a similar behavior. The proportion of cavity, i.e., biofilm-absent area at the biofilm/substratum interface, increased as biofilms became mature. Cavity formation was strongly responsible for lessening the adhesion strength. It is suggested that biofilm slough-off is caused by the decline of adhesion strength by tensile force rather than by shear force.

Evaluation of Adhesive Strength of Resin Liner Film

In this study, a new method for evaluating the adhesive strength of the interface between resin liner film and cement mortar has been developed. The peel test for vinyl ester resin liner films on cement mortar surfaces was carried out. The critical energy release rate (G c value) was obtained from the peel load and crack length measured during the peel test. G c values were not affected by the crack length or the thickness of resin liner film. Therefore it was established that G c values could be used to evaluate the adhesive strength of resin liner film. Furthermore, the effect of primer coats on the adhesive strength of resin liner film was revealed by obtaining the G c values.