This study investigates the heat dissipation structures for resonant tunneling diodes (RTDs). The n+-InGaAs conductive layer beneath the RTD double-barrier layer, which possesses low thermal conductivity and disrupting heat dissipation, has been replaced with n+-InP, which has high thermal conductivity. We manufactured simple RTD mesa structures with varying areas to analyze the impact of heat dissipation. Additionally, we conducted a study to explore the relationship between mesa area and power consumption at the RTD mesa under current–voltage measurements. The results clearly indicate that the proposed structure, incorporating an n+-InP layer, can function over an area twice as large without experiencing heat-induced destruction. By integrating this proposed structure, we successfully fabricated terahertz oscillators equipped with rectangular-cavity resonators. These oscillators achieved relatively high output power, approximately 0.2 mW was achieved at a frequency of 0.53 THz, all without any heat-induced damage, even within a large-area RTD device.