Electronics Industry Research Articles

High recovery design of reverse osmosis process with high permeate water quality and low wastewater discharge for ultra-pure water production

Ultra-pure water (UPW) for electronic industry is produced via many unit processes including reverse osmosis (RO), pretreatments, membrane degasifier, and ion exchange processes. Generally, 2-pass RO system is adopted in UPW production process to remove ionic and organic matters to meet water quality requirements of post-treatments. Since RO concentrate occupies most of wastewater discharged from UPW production process, high recovery design is beneficial to reduce wastewater discharge. According to the solution-diffusion model, permeate concentrations increase at higher feed concentrations, which may limit to increase RO recovery. Interestingly, the bench-scale 2-pass RO test using five commercial membrane modules revealed permeate concentrations were not affected by feed concentrations below a critical value (35 mg/L as NaCl in this work). This means the first-pass RO recovery can be increased without decreasing permeate water quality as far as second-pass RO feed concentrations are below the critical values. Various 2-pass UPW-RO system designs (250 mg/L as NaCl of feed concentration) were analyzed using an industrial RO system simulator to investigate the effect of the first- and second-pass recovery. The simulation works found that increasing the first- and second-pass recovery decreased wastewater discharge, energy consumption, and the number of membrane modules without degrading permeate water quality.

High-Quality Foaming and Weight Reduction in Microcellular-Injection-Molded Polycarbonate Using Supercritical Fluid Carbon Dioxide under Gas Counter Pressure.

Microcellular injection molding (MuCell®) using supercritical fluid (SCF) as a foaming agent to achieve weight reduction has become popular in carbon emission reduction. In the typical MuCell® process, SCF N2 is commonly used. Although SCF CO2 exhibits high solubility and can achieve a high weight reduction, controlling the foaming is not easy, and its foaming cells are usually larger and less uniform, which limits its industrial application. Our previous studies have shown that gas counter pressure (GCP) can improve the foaming quality effectively. Here, we investigated whether or not the CO2 SCF foaming quality could be improved, and weight reduction was achieved for polycarbonate (PC) material. This is quite important for the electronics industry, in which most of the housing for devices is made of PC materials. MuCell® was subjected to molding experiments using the parameters of the SCF dosage, melt temperature, mold temperature, and injection speed. The results revealed that using CO2 gas for the PC material can reduce the size of microcellular cells to 40 µm and increase the cell densities to 3.97 × 106 cells/cm3. Using GCP significantly improved the microcellular injection-molded parts by reducing the cell size to 20.9 µm (a 45.41% improvement) and increasing the cell density to 8.04 × 106 cells/cm3 (a 102.48% improvement). However, implementing GCP may slightly decrease the target weight reduction. This study reveals that microcellular injection molding of PC parts using SCF CO2 can achieve high-quality foaming and reduce the weight by about 30%.

Visualization experimental study on the boiling characteristics of vapor chamber evaporator surface with different heat sources

The effective functioning of vapor chambers depends on the phase change of the working fluid at the wick surface. Given the prevalent role of vapor chambers in thermal management in the electronics industry, it is critical to study the boiling characteristics and thermal performance of vapor chambers, as well as the effect of heat source conditions. In this work, to observe phase change at the wick surface, the visualization confined chamber with wick (VCCW) is proposed and fabricated, which features a side window and a 2 mm thick wick sintered with aluminum powders. The working fluid used is acetone. The heat source is designed in three different sizes to heat the VCCW in either the middle or right position. The experimental results show that the boiling curve is divided into four stages. In the stage Ⅰ, the boiling curve is linear, and the visualization results reveal that the phase change phenomenon on the wick surface is evaporation. The Ⅱ stage is defined as ONB (Onset of Nucleate Boiling) for the vapor chamber evaporator surface. The boiling curve shows a turning, and bubbles were observed to appear and spread by visualization. In the Ⅲ and Ⅳ stages, the boiling curve remains linear. The stable nucleate boiling and intermittent local dryout is observed before and after the DNB (Departure from Nucleate Boiling). The slope of the boiling curve increases as the size of the heat source enlarges, which contributes to greater superheat and evaporation of the working fluid at smaller heat fluxes. Moreover, the position and size of the heat sources affect the ONB and DNB due to heat diffusion and capillary-driven supply of fluid.

Boron nitride nanosheets synergized with two‐dimensional micron silver sheets to enhance thermal conductivity and insulation of epoxy resin composites

AbstractWith the rapid progress of the advanced electronic device industry, precision electronic instruments are gradually developing towards miniaturization. In this case, epoxy resin gradually attracts people's attention, but its intrinsic thermal conductivity is not high, and the resulting heat dissipation problem limits the further application of epoxy resin in the field of electronic packaging. Therefore, how to enhance the thermal conductivity of epoxy resins has become an urgent problem in the field of electronic packaging. In this work, BNNS was successfully prepared by stripping h‐BN into a flaky two‐dimensional material, which was added to the epoxy resin as a filler to make the composite material. And on the basis of the above, two‐dimensional micron silver flakes (AgMS) with different mass fractions were added to the composites, and the AgMS/BNNS/EP composites were successfully prepared. When BNNS was 25 wt% and AgMS was 1 wt%, its out‐of‐plane thermal conductivity was enhanced from 0.17 W m−1 K−1 of pure epoxy resin to 0.43 W m−1 K−1. When BNNS was 20 wt% and AgMS was 1 wt%, the breakdown strength was enhanced from 105 kV/mm for pure epoxy to 130 kV/mm. This work provides a new strategy for synthesizing high‐thermal‐conductivity epoxy matrix composites.

Finite element analysis and experimental study on the cutting mechanism of SiCp/Al composite in laser ultrasonic elliptic vibration turning

SiCp/Al composites have excellent material properties and are increasingly being used in the aerospace, military, and electronic packaging industries. However, the inhomogeneity and non-conductivity of conventional turning (CT) results in poor material surface quality and high cutting forces, which seriously hinder the application of particlereinforced metal matrix composites. The thermal softening property of laser-assisted turning (LAT) and the intermittent cutting property of two-dimensional (2D) ultrasonic elliptical vibratory turning (UEVT) offer unique advantages in improving material surface quality. Therefore, a novel laser ultrasonic elliptical vibratory turning (LUEVT) machining technique is proposed to improve the machining of SiCp/Al composites with two different volume fractions. The effect of highfrequency intermittent machining on material processing was further investigated by adjusting the pulsed laser power. Finite element modelling was used to predict the machining state, surface roughness, and chip morphology between the workpiece and the PCD tool. The effects of varying the machining parameters during the experiment on the two composites were analysed. The results showed that the LUEVT of 25 % and 45 % SiCp/Al composites were reduced by 39.3 % and 30.7 % respectively compared to the CT cutting forces. The experiments verified the consistency of the surface roughness and chip morphology with the finite element simulation results. The stability of the cutting force during the cutting process is also improved, as the material removal process mainly takes the form of small particle fragmentation and matrix encapsulation.

Implementation of Quality 4.0 framework in the electronics sector using ANP and QFD methodologies

PurposeQuality 4.0 is essential to the Industry 4.0 framework, notably in the electronics sector. It evaluates product quality in real-time using automatic process controls, quality tools and procedures. The implementation of Quality 4.0 criteria in the electronics industry is the subject of this study’s investigation and analysis. In this study, nine Customer Requirements (CRs) and 18 Design Requirements (DRs) have been defined to adopt Quality 4.0, aiming to increase yield while reducing defects. This study has developed a Quality 4.0 framework for effective implementation, incorporating the People, Process and Technology categories.Design/methodology/approachMany CRs and DRs of Quality 4.0 exhibit interdependencies. The Analytic Network Process (ANP) considers interdependencies among the criteria at various levels. Quality Function Deployment (QFD) can capture the customer’s voice, which is particularly important in Quality 4.0. Therefore, in this research, we use an integrated ANP-QFD methodology for prioritizing DRs based on the customers' needs and preferences, ultimately leading to better product and service development.FindingsAccording to the research findings, the most critical consumer criteria for Quality 4.0 in the electronics sector are automatic systems, connectivity, compliance and leadership. The Intelligent Internet of Things (IIOTs) has emerged as the most significant design requirement that enables effective control in production. It is observed that robotics process automation and a workforce aligned with Quality 4.0 also play crucial roles.Originality/valueExisting literature does not include studies on identifying CRs and DRs for implementing Quality 4.0 in the electronics industry. To address this gap, we propose a framework to integrate real-time quality measures into the Industry 4.0 context, thereby facilitating the implementation of Quality 4.0 in the electronics industry. This study can provide valuable insights for industry practitioners to implement Quality 4.0 effectively in their organizations.

From a Spoke to a Hub: The Case of South Korea

A few East Asian newly industrialized countries that used to belong to the Global South not only have joined the Global North but also have organized their own production chains in specific industries. Given the imperialist and exploitative nature of global production chains established by the Global North, it should be questioned whether the production chains organized by the East Asian newly industrialized countries are free from the innate nature of production chains. This article adopts a multiregional input-output analysis to examine the bilateral trade relationship between Korea and Vietnam. It finds that the Korean economy has unequally captured the benefits from the bilateral trade with Vietnam in terms of the domestic value-added share and the spillover effect derived from the final demand for Vietnamese products in the textile and electronics industries. JEL Classification: F62, F63

Intrinsic interlayer shear strength of graphite

Graphite holds significant values in the energy and electronics industries due to its unique properties. As a quintessential example of highly anisotropic materials, the shear strength measures one of its most fundamental mechanical properties. However, the lack of ideal materials and testing methods has led to a wide dispersion in the reported values. To address this issue, we utilized epitaxially grown single-crystal graphite and developed a high-throughput sample preparation method, along with a novel loading technique in this work. The intrinsic shear strength of AB-stacked graphite was determined to be τs = 62 MPa, by excluding the size effect in measurements. The results are further compared to highly oriented pyrolytic graphite specimens processed down to nanoscale thickness, highlighting the adverse impact of twisted single-crystalline interfaces between the graphitic layers. Additionally, we observed a distinctive failure mechanism with continuous and uniform cascade plastic slips across the thickness of graphite samples, which corresponds to an interlayer shear strength approaching τs. The intrinsic shear strength characterized in our work sets an upper limit for the interlayer shear resistance of graphite. The experimental procedure for measuring shear strength can be applied to other van der Waals materials.

Lowering trade barriers improves income distribution and economic resiliency

The U.S.-China trade war, COVID-19 pandemic and Russian invasion of Ukraine contributed to calls for greater economic self-sufficiency by exposing gaps in international collaboration and the uncertainty of global supply chains. In this study, we apply a comprehensive global modeling framework to enhance understanding of the potential impacts of fragmentation of global value chains. Supporting the general argument toward economic benefits from open markets our analysis contributes to the policy debate in two important dimensions of this phenomenon—distributional impacts and economic resiliency. We find that tariff liberalization and trade facilitation measures implemented by developing countries could not only reduce between-country inequality but also result in progressive within-country income distribution primarily through lowering food prices, as well as increasing unskilled wages. In addition, using a case study of disruption to Thailand’s electronics industry, we find higher resiliency of developing countries to external shocks in the globalized (as opposed to a localized) world.

Research status on the effect of energy density on the forming microstructure and properties of nickel-based superalloys for laser additive manufacturing

Abstract Nickel-based superalloys have excellent high-temperature mechanical properties, corrosion resistance and oxidation resistance, and strong machinability. It is widely used in aerospace, submarine and shipbuilding, petrochemical, electronic industry and other industries. However, there are still challenges in the popularization and application of nickel-based superalloys for alloy components with complex structures and extremely harsh working conditions. In this paper, the research status of the influence of energy density on the microstructure and properties of laser additive fabrication of nickel-based superalloys at home and abroad is reviewed. The influence of energy density on the microstructure evolution behavior and mechanical properties improvement effect of laser additive manufacturing nickel-based superalloys is summarized. The mechanism of energy density was discussed from the perspectives of microstructure evolution and macroscopic performance change. Based on the individual effects and synergistic effects of each process parameter, the influence of laser energy density on dendrite growth, phase precipitation characteristics, element distribution and porosity defect control effect of nickel-based superalloy was expounded, as well as the influence mechanism on microhardness, wear resistance and residual stress. Finally, the energy density optimization and development prospect of laser additive fabrication of nickel-based superalloys are prospected.

The 33rd International Symposium on Industrial Electronics [Society News

The 33rd International Symposium on Industrial Electronics [Society News

S&YP Forum at 2024 ISIE—The 33rd International Symposium on Industrial Electronics [Students and Young Professionals News

S&YP Forum at 2024 ISIE—The 33rd International Symposium on Industrial Electronics [Students and Young Professionals News

Leveraging ChatGPT for Sustainability: A Framework for SMEs to Align with UN Sustainable Development Goals and tackle sustainable development challenges

Abstract The United Nations Sustainable Development Goals (SDGs) outline a global agenda for sustainable development, but need more detailed implementation guidelines for businesses, particularly Small and Medium Enterprises (SMEs). Given their limited resources, SMEs face significant challenges in adopting sustainability practices aligned with the SDGs. This study explores the potential of ChatGPT, a large language model, to assist SMEs in overcoming these challenges. The research introduces a ChatGPT-aided framework through a novel methodological approach to help SMEs develop sustainability roadmaps, engage stakeholders, and identify key sustainability goals, risks, opportunities, and Key Process Indicators (KPIs). The case study of an SME in the electronic measurement equipment industry is used to validate the framework. The findings, corroborated by a Focus Group with the participation of academics and SME top managers, demonstrate the framework’s potential to enhance SME sustainability practices, contributing to academic discourse and offering practical insights that will inform and empower industry stakeholders. Furthermore, several actions are presented to respond to concerns about the accuracy and reliability of AI-generated recommendations. Finally, future research should seek to validate the proposed framework across a broader range of industries and SME contexts and assess this methodology’s application with organisations other than SMEs.

Preface

Abstract During June 21-22, 2024, the 2nd International Conference on Computer Technology and Information Science (CTIS2024) was successfully held online. This conference included keynote speeches, invited speeches, oral and poster presentations. Prof. Yong Yue from Xi’an Jiaotong-Liverpool University (XJTLU), China; Assoc. Prof. Lei Chen from Shandong University, China and Dr. Binqiang Wang from Inspur (Beijing) Electronic Information Industry Co. Ltd attended the conference and delivered keynote speeches. In addition, experts and scholars from the Guizhou Normal University, Guiyang, China; Harbin Institute of Technology; IEIT SYSTEMS Co., Ltd.; Kansai University, Osaka, Japan and other universities and institutes shared wonderful speeches. This conference proceedings included 7 accepted articles selected from 39 submissions, all the papers have been through rigorous review and process to meet the requirements of international publication standard. We would like to express our gratitude to the reviewers of these manuscripts, who provided constructive criticism and stimulated comments and suggestions to the authors. We are extremely grateful as organizers, technical program committee and editors and extend our most sincere thanks to all the authors for their excellent contribution and work. Our sincere gratitude also goes to the IOP Publishing editors and managers for their helpful cooperation during the preparation of the proceedings. On behalf of the Organizing Committee of CTIS2024. List of Technical Program Committee is available in this Pdf.

Study on the cracking process of epoxy resin under oxygen and water atmosphere based on ReaxFF force field

Amino-cured epoxy resins are widely used in the electrical and electronic industry for their excellent properties. To investigate the mechanism of the effect of O2 and H2O on the pyrolysis behavior of epoxy resin, in this paper, the cross-linked structure of bisphenol A type epoxy resin cured by adducts of diethylenetriamine and butyl glycidyl ether is modeled based on the ReaxFF force field, and the thermal decomposition processes at different temperatures and gas atmospheres were simulated and the pathways of the small molecule products were clarified. The results show that epoxy resin will produce small molecule gas products, such as H2, CO, H2O, OH, CH2O, and free radicals, in the process of pyrolysis; the presence of amino groups also generates nitrogen-containing radicals, such as CN, CH2N, and C2H4N; as the reaction temperature increases, the rate of pyrolysis reaction will be accelerated. The same temperature in oxygen and water atmospheres can accelerate the breakage of epoxy resin main chain by promoting the breakage of carbon and oxygen bonds and, at the same time, promote the generation of small molecule gases, such as H2 and CO.

Zn(II)-based 2D coordination polymer bridged by isophthalate and Dipyridylsulphide : Structural characterisation, Schottky diode device and theoretical interpretation

The design of low cost, easy-to-prepare, soft-to-handle and sustainable material-based technology has been growing day-by-day. Coordination polymers (CPs) are such emerging materials those have been instructed as one of the premium resources to serve the electronic industry. In this aspect, we have designed a hetero-bridging Zn(II)-coordination polymer using two different bridging ligands - 4,4′-Dipyridylsulphide (4,4′-DPS) and 5-Nitroisophthalic acid (5-H2NIA), {[Zn(4,4′-DPS)2(5-HNIA)2(H2O)]n} (Zn-CP) and characterize the crystalline compound with Single Crystal X-ray diffraction (SCXRD) technique. The structure demonstrates that Zn-CP consists of two-dimensional (2D) network with distorted trigonal bipyramidal Zn(II) center (ZnN2O3). The self-assembly of 2D network by different non-covalent interactions forms three-dimensional (3D) supramolecular architecture. Hirshfeld surface analysis effectively evaluates the possibilities of non-covalent interactions present in Zn-CP. Density functional theory (DFT) based numerical calculation using crystallographic parameters has estimated the band gap 3.51 eV which implies the semiconducting nature of Zn-CP. This property has been endorsed by the determination of band gap from Tauc's plot (3.71 eV) using UV–Visible absorption data. The electrical conductivity of Zn-CP determined at room temperature is 8.54 x 10–7 S m-1. The DC activation energy of the device is 9.05 × 10–19 eV with the conductivity limit, 4.71 (Ω-m)-1 having Richardson constant, 7.07 × 10–10Am−2K−2and barrier height is 0.87 eV which suggests that the Zn-CP is n-type semiconductor. Thus, the present work may provide a facile pathway for laboratory-to-land application of such energy materials taking into consideration of technological aspect in the highly energy demanding era. Hence, the synthesized Zn-CP may have energy material application in the semiconducting industry.

Automatic Intrusion Detection Model with Secure Data Storage on Cloud Using Adaptive Cyclic Shift Transposition with Enhanced ANFIS Classifier

Cloud computing has emerged as a pivotal technology in the computer electronics industry, offering users significant computing power and ample storage space. Security threats pose significant challenges to the progression of cloud computing, hindering its growth in the industry. Detecting intrusions is crucial for protecting cloud environments from harmful attacks. However, due to the complexity and vast amount of network data, building effective intrusion detection systems (IDS) for cloud setups is difficult. Traditional IDS have struggled to effectively mitigate these risks. To overcome these problems, we propose a novel feature selection technique with deep learning classifier-based intrusion detection and avoidance in a cloud environment. The suggested model is divided into four phases: feature selection, pre-processing, classification, and encryption. The initial step involves gathering the data from the dataset and pre-processing it. The Adaptive Walrus Optimization Algorithm (AWO) is then used to choose select optimal features, aiming to mitigate computational complexity and reduce time consumption. These selected features are then fed into an enhanced Adaptive Neuro-Fuzzy Inference System (EANFIS) classifier for accurate classification of normal and intruded data. Following classification, normal data undergoes encryption using the Adaptive Cyclic Shift Transposition (ACST) Algorithm to bolster security.For experimental evaluation two datasets used namely, KDDCup-99 and NSL-KDD. The proposed method notably achieves impressive accuracy rates of 98.47% for the NSL KDD dataset and 98.97% for the KDD-CUP99 dataset.

IEEE Industrial Electronics Society Students & Young Professionals: S&YP on the Move: ICIT’24, ISIE’24, CPE-POWERENG’24, and Beyond [Students and Young Professionals News

IEEE Industrial Electronics Society Students & Young Professionals: S&YP on the Move: ICIT’24, ISIE’24, CPE-POWERENG’24, and Beyond [Students and Young Professionals News

IEEE Transactions on Industrial Electronics Information for Authors

IEEE Transactions on Industrial Electronics Information for Authors

Become an IES S&YP Member and Join Our Activities at IECON 2024—The 50th Annual Conference of the IEEE Industrial Electronics Society! [Students and Young Professionals News

Become an IES S&YP Member and Join Our Activities at IECON 2024—The 50th Annual Conference of the IEEE Industrial Electronics Society! [Students and Young Professionals News