Electron Spectroscopy Depth Profile Analysis Research Articles

Effects of ambient gas on the diffusion of copper through thin chromium films and of nickel through thin gold films

The low temperature (300–400°C) out-diffusion of an underlying metal through a thin film overlayer of another metal has been studied in ambients of nitrogen and forming gas. Surface oxidation of this out-diffused metal degrades solder wettability and wire bonding properties. Auger electron spectroscopy depth profile analysis shows that the out-diffusion of copper through chromium and of nickel through gold is suppressed in a forming gas ambient.

Polarization behaviour and surface composition of CrMo alloys in acid chloride media

Anodic polarization behavior of CrMo alloys containing 2–18% Mo is investigated by means of a rotating disk electrode. Auger electron spectroscopy depth profile analysis is employed to study the surface composition as a function of applied potential and charge. Obtained Auger data are interpreted by taking into account the influence of ion sputtering on surface concentration. Results show that addition of Mo to Cr reduces the critical current density for passivation but hardly affects transpassive behavior. The Mo/Cr ratio at the surface strongly depends on applied potential but is little affected by charge.

The application of Auger electron spectroscopy to the study of wear surfaces

An integrated approach employing semiquantitative Auger electron spectroscopy (AES) depth profile analysis and mechanical wear in a Reichert cylinder-on-disc machine was applied to the study of worn surfaces under heavy load conditions in the presence of extreme pressure (EP) additives. A significant correlation between the sulphur content of the topmost reaction layer and the wear behaviour was observed, although the worn surfaces were not ideal for AES analysis. A repeatability of better than 10% was obtained on the basis of four independent measurements. The thickness of the sulphur- and phosphorus-rich surface layer formed in the presence of EP additives is much smaller than that of the so-called white layer produced by heavy deformation and a high local temperature. The observed wear-preventive action of the sulphur-rich reaction layer and the possibility of characterizing this layer by AES offer interesting approaches to the study of the mechanism of wear prevention by EP additives.

Auger electron spectroscopy study on reaction layers formed under Reichert wear test conditions in the presence of extreme pressure additives

Auger electron spectroscopy depth profile analysis was used to study the reaction layers formed under Reichert wear test conditions in the presence of four different extreme pressure additives and hence to try to determine the wear prevention mechanism. Wear protection on Reichert wear test specimens was found to correlate with the formation of a thin, sulphur-rich reaction layer in the worn surface. Under FZG gear test conditions, phosphorus in the reaction layer appeared to be necessary for good wear protection

ChemInform Abstract: ELECTROPOLISHING OF TITANIUM IN PERCHLORIC ACID‐ACETIC ACID SOLUTION. I. AUGER ELECTRON SPECTROSCOPY STUDY OF ANODIC FILMS

AbstractAnodisch auf Ti in einem HClO4/ AcOH‐Elektropolierelektrolyten gebildete TiO2‐Filme werden Auger‐Elektronenspektroskopisch (Tiefenprofilanalyse) auf ihre chemische Natur und ihre Dicke untersucht.

Electropolishing of Titanium in Perchloric Acid‐Acetic Acid Solution: I . Auger Electron Spectroscopy Study of Anodic Films

Anodic films on titanium formed in a perchloric acid‐acetic acid electropolishing electrolyte were investigated by Auger electron spectroscopy (AES) depth profile analysis. Films formed in at different potentials were used as standards for determining sputter rate and stoichiometry. Obtained results show linear film growth to occur up to the onset of electropolishing when film thickness abruptly decreases and becomes independent of potential. The electropolishing film observed by AES contains chloride ions, the concentration of which exhibits a maximum at the metal‐film interface.